IEC 62453-302:2016

IEC 62453-302 ®
Edition 2.0 2016-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Field device tool (FDT) interface specification –
Part 302: Communication profile integration – IEC 61784 CPF 2

Spécification des interfaces des outils des dispositifs de terrain (FDT) –
Partie 302: Intégration des profils de communication – CPF 2 de l’IEC 61784

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IEC 62453-302 ®
Edition 2.0 2016-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Field device tool (FDT) interface specification –

Part 302: Communication profile integration – IEC 61784 CPF 2

Spécification des interfaces des outils des dispositifs de terrain (FDT) –

Partie 302: Intégration des profils de communication – CPF 2 de l’IEC 61784

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 25.040.40; 35.100.05; 35.110 ISBN 978-2-8322-3463-1

– 2 – IEC 62453-302:2016  IEC 2016
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references. 7
3 Terms, definitions, symbols, abbreviated terms and conventions. 8
3.1 Terms and definitions . 8
3.2 Symbols and abbreviated terms . 8
3.3 Conventions . 8
3.3.1 Data type names and references to data types . 8
3.3.2 Vocabulary for requirements . 8
4 Bus category . 9
5 Access to instance and device data . 10
6 Protocol specific behavior . 10
7 Protocol specific usage of general data types . 11
8 Protocol specific common data types . 11
9 Network management data types . 15
9.1 General . 15
9.2 Node address . 15
9.3 Scanner/master – Bus parameter set (CIP) . 15
10 Communication data types . 23
11 Channel parameter data types . 25
12 Device identification . 28
12.1 Device type identification data types . 28
12.2 Topology scan data types . 29
12.3 Scan identification data types . 29
12.4 Device type identification data types . 29
Annex A (informative) Implementation hints . 32
A.1 Addressing in CompoNet DTMs . 32
A.2 Displaying addresses of CompoNet DTMs . 33
A.3 Handling of Config1 and Config2 elements in EtherNet/IP . 33
Bibliography . 34

Figure 1 – Part 302 of the IEC 62453 series . 6
Figure A.1 – Examples of DTM naming for CompoNet . 33

Table 1 – Protocol identifiers . 9
Table 2 – Physical layer identifiers for DeviceNet . 9
Table 3 – Physical layer identifiers for ControlNet . 9
Table 4 – Physical layer identifiers for Ethernet/IP . 9
Table 5 – Physical layer identifiers for CompoNet . 10
Table 6 – Data link layer identifiers . 10
Table 7 – Protocol specific usage of general data types . 11
Table 8 – Simple protocol specific common data types . 12

Table 9 – Structured protocol specific common data types . 13
Table 10 – Simple fieldbus configuration data types . 15
Table 11 – Structured fieldbus configuration data types . 17
Table 12 – Simple communication data types . 23
Table 13 – Structured communication data types . 24
Table 14 – Simple channel parameter data types . 26
Table 15 – Structured channel parameter data types . 26
Table 16 – Identification data types with protocol specific mapping . 28
Table 17 – Simple identification data types with protocol independent semantics . 28
Table 18 – Structured identification data types with protocol independent semantics . 28
Table 19 – Simple scan identification data types . 29
Table 20 – Structured scan identification data types . 29
Table 21 – Structured device type identification data types . 30
Table A.1 – CompoNet relationship between Device Category, Node Address, MAC ID . 32

– 4 – IEC 62453-302:2016  IEC 2016
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIELD DEVICE TOOL (FDT) INTERFACE SPECIFICATION –

Part 302: Communication profile integration –
IEC 61784 CPF 2
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
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with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possibl
...