EN 60297-3-107:2012

SLOVENSKI STANDARD
01-maj-2012
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Mechanical structures for electronic equipment - Dimensions of mechanical structures of
the 482,6 mm (19 in) series - Part 3-107: Dimensions of subracks and plug-in units, small
form factor
Bauweisen für elektronische Einrichtungen - Maße der 482,6 mm-(19-Zoll-)Bauweise -
Teil 3-107: Maße von Baugruppenträgern und Baugruppen, kleiner Formfaktor
Structures mécaniques pour équipements électroniques - Dimensions des structures
mécaniques de la série 482,6 mm (19 pouces) - Partie 3-107: Dimensions des bacs et
blocs enfichables de petit facteur de forme
Ta slovenski standard je istoveten z: EN 60297-3-107:2012
ICS:
31.240 Mehanske konstrukcije za Mechanical structures for
elektronsko opremo electronic equipment
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 60297-3-107
NORME EUROPÉENNE
March 2012
EUROPÄISCHE NORM
ICS 31.240
English version
Mechanical structures for electronic equipment -
Dimensions of mechanical structures of the 482,6 mm (19 in) series -
Part 3-107: Dimensions of subracks and plug-in units, small form factor
(IEC 60297-3-107:2012)
Structures mécaniques pour équipements Bauweisen für elektronische
électroniques - Einrichtungen -
Dimensions des structures mécaniques de Maße der 482,6 mm-(19-Zoll-)Bauweise -
la série 482,6 mm (19 pouces) - Teil 3-107: Maße von Baugruppenträgern
Partie 3-107: Dimensions des bacs et und Baugruppen, kleiner Formfaktor
blocs enfichables de petit facteur de forme (IEC 60297-3-107:2012)
(CEI 60297-3-107:2012)
This European Standard was approved by CENELEC on 2012-02-14. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland, Turkey and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2012 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60297-3-107:2012 E

Foreword
The text of document 48D/492/FDIS, future edition 1 of IEC 60297-3-107, prepared by SC 48D,
"Mechanical structures for electronic equipment", of IEC TC 48, "Electromechanical components and
mechanical structures for electronic equipment" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN 60297-3-107:2012.

The following dates are fixed:
(dop) 2012-11-14
• latest date by which the document has
to be implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2015-02-14
• latest date by which the national
standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent
rights.
Endorsement notice
The text of the International Standard IEC 60297-3-107:2012 was approved by CENELEC as a European
Standard without any modification.

- 3 - EN 60297-3-107:2012
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

IEC 60297-3-100 - Mechanical structures for electronic EN 60297-3-100 -
equipment - Dimensions of mechanical
structures of the 482,6 mm (19 in) series -
Part 3-100: Basic dimensions of front panels,
subracks, chassis, racks and cabinets

IEC 61076-4-116 - Connectors for electronic equipment - Product EN 61076-4-116 -
requirements -
Part 4-116: Printed board connectors - Detail
specification for a high-speed two-part
connector with integrated shielding function

PICMG AMC.0 - Advanced Mezzanine Card Specification - -

PICMG MicroTCA.0 - Micro Telecommunications Computing - -
Architecture
PICMG MicroTCA.1 - Air Cooled Rugged MicroTCA Specification - -

IEC 60297-3-107 ®
Edition 1.0 2012-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical structures for electronic equipment – Dimensions of mechanical

structures of the 482,6 mm (19 in) series –

Part 3-107: Dimensions of subracks and plug-in units, small form factor

Structures mécaniques pour équipements électroniques – Dimensions des

structures mécaniques de la série 482,6 mm (19 pouces) –

Partie 3-107: Dimensions des bacs et blocs enfichables de petit facteur de forme

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX V
ICS 31.240 ISBN 978-2-88912-844-0

– 2 – 60297-3-107  IEC:2012
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope and object . 7
2 Normative references . 7
3 Arrangement overview (4U shown) . 8
4 Subrack dimensions . 9
4.1 Subrack dimensions front mounting area . 9
4.2 Subrack dimensions, rear view, backplane mounting area . 12
5 Plug-in unit dimensions . 13
6 Connector and related printed board dimensions . 14
6.1 Connector according to PICMG-MicroTCA.0/ IEC 61076-4-116, fixed board
connector and related printed board dimensions . 14
6.1.1 PICMG- MicroTCA.0/ IEC 61076-4-116 connector, isometric view . 14
6.1.2 Connector according to PICMG- MicroTCA.0/ IEC 61076-4-116, fixed
board connector and related printed board – arrangement overview . 14
6.1.3 Printed board dimensions . 15
6.1.4 Printed board dimensions, 4U example . 16
6.1.5 Connector according to PICMG-MTCA.0, fixed board connector
dimensions . 17
6.2 Two part connector according to IEC 61076-4-116 and related printed board
dimensions . 17
6.2.1 Two part connector, isometric view . 17
6.2.2 Two part connector, arrangement overview . 18
6.2.3 Two part connector, printed board dimensions . 18
6.2.4 Two part connector, fixed board connector dimensions . 19
6.3 Two part connector with PIU PB component side attachment features . 19
6.3.1 Two part connector, arrangement overview . 19
6.3.2 Two part connector, printed circuit board dimensions, 2 U . 19
6.3.3 Two part connector, connector mounted on backplane, 2 U . 20
7 Backplane dimensions . 21
7.1 Backplane dimensions using two part connector according to IEC 61076-4-116 . 21
8 Subrack and plug-in units with electromagnetic shielding (EMC) provisions . 23
8.1 General . 23
8.2 Subrack EMC provisions . 23
8.3 Plug-in unit and filler panels EMC provisions . 24
9 Subrack and plug in units electrostatic discharge provisions (ESD) . 24
9.1 General . 24
9.2 Subrack ESD provisions . 25
9.3 Plug–in unit ESD provisions, front mounted . 26
10 Nomenclature . 27
Annex A (informative) Connector hole pattern at the backplane . 29
Annex B (informative) Rear mounted plug-in unit implementation . 30
Annex C (informative) Hot swap latch function . 32
Annex D (informative) Subrack latch mechanism interface dimensions for ruggedized
applications . 33
Annex E (informative) Subrack ESD contact interface dimensions . 34

60297-3-107  IEC:2012 – 3 –
Figure 1 – Arrangement overview . 8
Figure 2 – Subrack dimensions, front view . 10
Figure 3 – Subrack dimensions, side view . 11
Figure 4 – Subrack dimensions, top view . 12
Figure 5 – Subrack dimensions, rear view . 12
Figure 6 – Plug-in unit dimensions . 13
Figure 7 – PICMG- MicroTCA.0/ IEC 61076-4-116 connector, isometric view . 14
Figure 8 – PICMG- MicroTCA.0/ IEC 61076-4-116 fixed board connector, arrangement
overview – Top view . 14
Figure 9 – Printed board dimensions . 15
Figure 10 – Printed board dimensions, 4U example . 16
Figure 11 – Connector according to PICMG- MTCA.0, fixed board connector
dimensions . 17
Figure 12 – Fixed board and free board connector – Isometric view . 17
Figure 13 – Two part connector, arrangement overview – Top view . 18
Figure 14 – Two part connector, printed board dimensions . 18
Figure 15 – Two part connector, arrangement overview – Top view . 19
Figure 16 – Two part connector, dimensions, 2 U . 19
Figure 17 – Two part connector, connector mounted on backplane dimensions, 2 U . 20
Figure 18 – Backplane dimensions. 22
Figure 19 – Subrack EMC dimensions .
...