EN 60068-3-13:2016

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Okoljsko preskušanje - 3-13. del: Podporna dokumentacija in navodilo za preskus T: SpajkanjeEssais d'environnement - Partie 3-13: Documentation d'accompagnement et guide sur les essais T: BrasageEnvironmental testing - Part 3-13: Supporting documentation and guidance on test T: Soldering25.160.01Varjenje, trdo in mehko spajkanje na splošnoWelding, brazing and soldering in general19.040Preskušanje v zvezi z okoljemEnvironmental testing01.110L]GHONHTechnical product documentationICS:Ta slovenski standard je istoveten z:EN 60068-3-13:2016SIST EN 60068-3-13:2016en01-december-2016SIST EN 60068-3-13:2016SLOVENSKI
STANDARDSIST EN 60068-2-44:20011DGRPHãþD

EUROPEAN STANDARD NORME EUROPÉENNE EUROPÄISCHE NORM
EN 60068-3-13
September 2016 ICS 19.040
Supersedes
EN 60068-2-44:1995
English Version
Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering (IEC 60068-3-13:2016)
Essais d'environnement - Partie 3-13: Documentation d'accompagnement et guide sur les essais T - Brasage (IEC 60068-3-13:2016)
Umweltprüfungen - Teil 3-13: Ergänzende Unterlagen und Anleitung zur Prüfung T: Löten (IEC 60068-3-13:2016) This European Standard was approved by CENELEC on 2016-06-17. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17,
B-1000 Brussels © 2016 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 60068-3-13:2016 E SIST EN 60068-3-13:2016

The following dates are fixed: • latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2017-03-17 • latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2019-06-17
This document supersedes EN 60068-2-44:1995.
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent rights.
Endorsement notice The text of the International Standard IEC 60068-3-13:2016 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60068-2 Series NOTE Harmonized as EN 60068-2 Series. IEC 60749-20 NOTE Harmonized as EN 60749-20. IEC 61190-1-1 NOTE Harmonized as EN 61190-1-1. IEC 61191 Series NOTE Harmonized as EN 61191 Series. IEC 61192 Series NOTE Harmonized as EN 61192 Series. IEC 61760-4 NOTE Harmonized as EN 61760-4. SIST EN 60068-3-13:2016

Normative references to international publications with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu
Publication Year Title EN/HD Year
IEC 60068-2-20 2008
Environmental testing -
Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads EN 60068-2-20 2008
IEC 60068-2-58 -
Environmental testing -
Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) EN 60068-2-58 -
IEC 60068-2-69 -
Environmental testing -
Part 2: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method EN 60068-2-69 -
IEC 60068-2-83 -
Environmental testing -
Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste EN 60068-2-83 -
IEC 61760-1 -
Surface mounting technology -
Part 1: Standard method for the specification of surface mounting components (SMDs) EN 61760-1 -
IEC 62137-3 -
Electronics assembly technology -
Part 3:
Selection guidance of environmental and endurance test methods for solder joints EN 62137-3 -
IEC 60068-3-13 Edition 1.0 2016-05 INTERNATIONAL STANDARD NORME INTERNATIONALE Environmental testing –
Part 3-13: Supporting documentation and guidance on Test T – Soldering
Essais d'environnement –
Partie 3-13: Documentation d'accompagnement et guide sur les essais T – Brasage
INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE
ICS 19.040
ISBN 978-2-8322-3359-7
– 2 – IEC 60068-3-13:2016  IEC 2016 CONTENTS FOREWORD . 4 1 Scope . 6 2 Normative references. 6 3 Terms, definitions and abbreviations . 6 3.1 Terms and definitions . 6 3.2 Abbreviations . 7 4 Overview . 7 4.1 Factors influencing the formation and reliability of solder joints (ability to be soldered) . 7 4.2 Physics of surface wetting . 8 4.3 Quality and reliability of solder joints . 10 5 Component soldering – Processes . 10 5.1 General considerations . 10 5.1.1 Components' ability to be soldered . 10 5.1.2 Soldering processes . 12 5.1.3 Soldering defects . 12 5.1.4 Geometrical factors which may influence the soldering result . 12 5.1.5 Process factors . 12 5.1.6 Material factors . 12 5.2 Solder . 13 5.3 Grouping of soldering conditions . 13 5.4 Ability to be soldered . 13 5.5 Moisture sensitivity of components . 13 5.6 Relation between storage time/storage conditions and solderability . 14 5.6.1 Natural and accelerated ageing . 14 5.6.2 Oxidation . 14 5.6.3 Growth of intermetallic layers . 14 5.6.4 Effect of ageing to wetting characteristics . 14 5.6.5 Test conditions for accelerated ageing . 15 5.7 Place of soldering tests in testing . 16 6 Soldering tests . 17 6.1 General . 17 6.2 Solder . 18 6.3 Fluxes . 18 6.4 Test equipment . 18 6.5 Evaluation methods . 18 6.5.1 Criteria for visual inspection . 18 6.5.2 Criteria for quantitative evaluation of the wetting characteristic . 19 6.5.3 Special cases . 19 6.6 Acceptance criteria . 19 7 Soldering tests – Methods . 19 7.1 General principles . 19 7.2 Survey of test methods . 19 7.3 Bath test . 22 7.4 Reflow test . 23 7.4.1 With/without solder land . 23 SIST EN 60068-3-13:2016

IEC 60068-3-13:2016  IEC 2016 – 3 – 7.4.2 Selection of solder paste (flux system and activity grade) . 23 7.5 Soldering iron test . 23 7.6 Resistance to dissolution of metallization and soldering heat . 23 7.6.1 General . 23 7.6.2 Limitations . 23 7.6.3 Choice of severity . 24 7.7 Wetting balance test . 24 7.7.1 General . 24 7.7.2 Test methods available . 25 7.7.3 Limitations . 25 8 Requirements and statistical character of results . 25 Bibliography . 27
Figure 1 – Sessile drop of solder on oxidised copper . 8 Figure 2 – Sessile drop of solder plus flux on clean copper . 9 Figure 3 – Sessile drop equilibrium forces . 9 Figure 4 – Typical soldering processes . 12 Figure 5 – Soldering tests for devices with leads . 21 Figure 6 – Soldering tests for SMDs . 22
Table 1 – Solder process groups . 13
– 4 – IEC 60068-3-13:2016  IEC 2016 INTERNATIONAL ELECTROTECHNICAL COMMISSION ____________
ENVIRONMENTAL TESTING –
Part 3-13: Supporting documentation and guidance on Test T – Soldering
FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization compri
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