EN 60917-2-3:2006

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EUROPEAN STANDARD
EN 60917-2-3
NORME EUROPÉENNE
July 2006
EUROPÄISCHE NORM
ICS 31.240
English version
Modular order for the development of mechanical structures
for electronic equipment practices
Part 2-3: Sectional specification -
Interface co-ordination dimensions for the 25 mm equipment practice -
Extended detail specification -
Dimensions for subracks, chassis, backplanes, front panels
and plug-in units
(IEC 60917-2-3:2006)
Ordre modulaire pour le développement Modulordnung für die Entwicklung
des structures mécaniques pour von Bauweisen für
les infrastructures électroniques elektronische Einrichtungen
Partie 2-3: Norme intermédiaire - Teil 2-3: Strukturnorm –
Dimensions de coordination pour Schnittstellen-Koordinationsmaße für
les interfaces des infrastructures die 25-mm-Bauweise –
au pas de 25 mm - Erweiterte Maßnorm –
Spécification particulière étendue - Maße für Baugruppenträger, Einschübe,
Dimensions pour bacs, châssis, fonds de Rückplatten, Frontplatten und
panier, faces avant et blocs enfichables steckbare Baugruppen
(CEI 60917-2-3:2006) (IEC 60917-2-3:2006)

This European Standard was approved by CENELEC on 2006-06-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60917-2-3:2006 E
Foreword
The text of document 48D/338/FDIS, future edition 1 of IEC 60917-2-3, prepared by SC 48D, Mechanical
structures for electronic equipment, of IEC TC 48, Electromechanical components and mechanical
structures for electronic equipment, was submitted to the IEC-CENELEC parallel vote and was approved
by CENELEC as EN 60917-2-3 on 2006-06-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2007-03-01
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2009-06-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60917-2-3:2006 was approved by CENELEC as a European
Standard without any modification.
__________
- 3 - EN 60917-2-3:2006
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

IEC 60917-1 1998 Modular order for the development of EN 60917-1 1998
mechanical structures for electronic
equipment practices
Part 1: Generic standard
IEC 60917-2-1 1993 Modular order for the development of EN 60917-2-1 1995
mechanical structures for electronic
equipment practices
Part 2: Sectional specification - Interface
co-ordination dimensions for the 25 mm
equipment practice
Section 1: Detail specification - Dimensions
for cabinets and racks
IEC 60917-2-2 1994 Modular order for the development of EN 60917-2-2 1996
mechanical structures for electronic
equipment practices
Part 2: Sectional specification - Interface
co-ordination dimensions for the 25 mm
equipment practice
Section 2: Detail specification - Dimensions
for subracks, chassis, backplanes, front
panels and plug-in units
IEC 61076-4-100 2001 Connectors for electronic equipment EN 61076-4-100 2001
Part 4-100: Printed board connectors with
assessed quality - Detail specification for
two-part connector modules having a grid of
2,5 mm for printed boards and backplanes

IEC 61076-4-101 2001 Connectors for electronic equipment EN 61076-4-101 2001
+ corr. November 2003 Part 4-101: Printed board connectors with
assessed quality - Detail specification for
two-part connector modules, having a basic
grid of 2,0 mm for printed boards and
backplanes in accordance with IEC 60917

IEC 61076-4-104 1999 Connectors for use in d.c. low-frequency EN 61076-4-104 1999
analogue and digital high speed data
applications
Part 4-104: Printed board connectors with
assessed quality - Detail specification for
two-part modular connectors, basic grid of
2,0 mm, with terminations on a multiple grid
of 0,5 mm
INTERNATIONAL IEC
STANDARD 60917-2-3
First edition
2006-05
Modular order for the development
of mechanical structures
for electronic equipment practices –

Part 2-3:
Sectional specification –
Interface co-ordination dimensions
for the 25 mm equipment practice –
Extended detail specification –
Dimensions for subracks, chassis, backplanes,
front panels and plug-in units

 IEC 2006  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale V
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

– 2 – 60917-2-3  IEC:2006(E)
CONTENTS
FOREWORD.4
INTRODUCTION.6

1 Scope and object.8
2 Normative references .8
3 Terms and definitions .9
4 Arrangement overview.9
5 Subrack dimensions for injector/extractor handle of plug-in units.10
5.1 Subrack interface dimensions.10
6 Dimensions of injector/extractor handle for plug-in units .12
6.1 Injector/extractor handle interface dimensions.12
6.2 Handle-locking function .14
7 Subrack and plug-in units with electromagnetic shielding provision .14
7.1 Subrack interface dimensions for electromagnetic shielding provision .14
7.2 Front panel/plug-in unit interface dimensions .17
8 Key/coding system for subrack and plug-in units .18
8.1 Subrack interface dimensions – Key/coding system on the plug-in unit guides .19
8.2 Key dimensions – Key/coding system on the plug-in unit guides.20
8.3 Programming of key – Key/coding system on the plug-in guides.22
8.4 Keying chamber inspection dimensions .22
9 Alignment pin and/or electrical contact for front panels and plug-in units .23
9.1 Alignment pins and receptacle plates on the subrack horizontal members .24
9.2 Alignment and/or electrical contact pins and receptacles on the subrack
plug-in unit guides.25
10 Electrostatic discharge provision for plug-in units and subracks.27
10.1 ESD contact interface dimensions .28
10.2 ESD strip interface dimensions.28
11 Subrack dimensions for rear-mounted plug-in units .32

Annex A Subrack, plug-in unit and backplane dimensions for using metric connectors.33

Figure 1 – Typical example of large subracks in a wide cabinet, equipped mass
volume of copper/optical cables installation .7
Figure 2 – Subject for development of extended connector application packaging and
key elements of interconnection between functional plug-in modules via backplane in
the future packaging system .7
Figure 3 – Arrangement overview .9
Figure 4 – Subrack interface dimensions, injector/extractor handles for plug-in units .11
Figure 5 – Detail X and detail Y, subrack interface dimensions, injection/extraction
handles for plug-in units.12
Figure 6 – Plug-in units interface dimensions, injection/extraction handle for plug-in units .13
Figure 7 – Detail X and detail Y, plug-in interface dimensions, injector/extractor
handles for plug-in units.14
Figure 8 – Subrack interface dimensions, electromagnetic shielding provisions .15

60917-2-3  IEC:2006(E) – 3 –
Figure 9 – Detail X and detail Y, subrack interface dimensions, electromagnetic
shielding provisions .16
Figure 10 – Front panel/plug-in unit interface dimensions, electromagnetic shielding
provisions .17
Figure 11 – Arrangement of key/coding system for plug-in units.18
Figure 12 – Subrack interface dimensions – Key/coding system on the plug-in unit
guides.19
Figure 13 – Plug-in unit interface dimensions – Key/coding system on the plug-in unit
guides.20
Figure 14 – Key dimensions and rotated key positions – Key/coding system on the
plug-in unit guides .21
Figure 15 – Programming of keys .22
Figure 16 – Arrangement of alignment pin system for subracks and plug-in units.23
Figure 17 – Subrack interface dimensions, alignment pins and receptacle plates on
the horizontal members .24
Figure 18 – Plug-in unit interface dimensions, alignment pins and receptacle plates on
the horizontal members .25
Figure 19 – Subrack interface dimensions, alignment and/or electrical contact pin
receptacles on the plug-in unit guides.26
Figure 20 – Plug-in unit interface dimensions, alignment and/or electrical contact pin
receptacles on the plug-in unit guides.27
Figure 21 – Subrack interface dimensions, ESD contacts on the plug-in guides .
...