EN 62680-1-2:2017

SLOVENSKI STANDARD
SIST EN 62680-1-2:2017
01-maj-2017
Vmesniki univerzalnega serijskega vodila za prenos podatkov in napajanje - 1-2.
del: Skupne komponente - Specifikacija za zagotavljanje napajanja prek USB (IEC
62680-1-2:2016)
Universal Serial Bus interfaces for data and power - Part 1-2: Common components -
USB Power Delivery Specification (IEC 62680-1-2:2016)
Schnittstellen des Universellen Seriellen Busses für Daten und Energie - Teil 1-2:
Gemeinsame Komponenten - USB Stromversorgungs-Spezifikation (IEC 62680-1-
2:2016)
,QWHUIDFHVEXVVpULHXQLYHUVHO86%SRXUOHVGRQQpHVHWO
DOLPHQWDWLRQpOHFWULTXH3DUWLH
&RPSRVDQWVFRPPXQV6SpFLILFDWLRQ86%SRXUODIRXUQLWXUHGHFRXUDQW
,(&
Ta slovenski standard je istoveten z: EN 62680-1-2:2017
ICS:
35.200 Vmesniška in povezovalna Interface and interconnection
oprema equipment
SIST EN 62680-1-2:2017 en,fr,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 62680-1-2:2017

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SIST EN 62680-1-2:2017


EUROPEAN STANDARD EN 62680-1-2

NORME EUROPÉENNE

EUROPÄISCHE NORM January 2017
ICS 29.220; 33.120; 35.200

English Version
Universal serial bus interfaces for data and power - Part 1-2:
Common components - USB Power Delivery specification
(IEC 62680-1-2:2016)
Interfaces bus série universel (USB) pour les données et Schnittstellen des Universellen Seriellen Busses für Daten
l'alimentation électrique - Partie 1-2 : Composants und Energie - Teil 1-2: Gemeinsame Komponenten - USB
communs - Spécification USB pour la fourniture de courant Stromversorgungs-Spezifikation
(IEC 62680-1-2:2016) (IEC 62680-1-2:2016)
This European Standard w as approved by CENELEC on 2016-12-13. CENELEC members are bound to comply w ith the CEN/CENELEC
Internal Regulations w hich stipulate the conditions for giving this European Standard the status of a national standard w ithout any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its ow n language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norw ay, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sw eden,
Sw itzerland, Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2017 CENELEC All rights of exploitation in any form and by any means reserved w orldw ide for CENELEC Members.
 Ref. No. EN 62680-1-2:2017 E

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SIST EN 62680-1-2:2017
EN 62680-1-2:2017

European foreword
The text of document 100/2728/CDV, future edition 1 of IEC 62680-1-2, prepared by IEC/TC 100
“Audio, video and multimedia systems and equipment” was submitted to the IEC-CENELEC parallel
vote and approved by CENELEC as EN 62680-1-2:2017.

The following dates are fixed:
(dop) 2017-09-13
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2019-12-13
• latest date by which the national
standards conflicting with the
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.

Endorsement notice
The text of the International Standard IEC 62680-1-2:2016 was approved by CENELEC as a
European Standard without any modification.
2

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SIST EN 62680-1-2:2017




IEC 62680-1-2

®


Edition 1.0 2016-11




INTERNATIONAL



STANDARD








colour

inside










Universal serial bus interfaces for data and power –

Part 1-2: Common components – USB Power Delivery specification



























INTERNATIONAL

ELECTROTECHNICAL


COMMISSION





ICS 29.220; 33.120; 35.200 ISBN 978-2-8322-3710-6



  Warning! Make sure that you obtained this publication from an authorized distributor.


® Registered trademark of the International Electrotechnical Commission

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SIST EN 62680-1-2:2017
– 2 – IEC 62680-1-2:2016 © IEC 2016
© USB-IF:2016
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

UNIVERSAL SERIAL BUS INTERFACES FOR DATA AND POWER

Part 1-2: Common components – USB Power Delivery specification

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62680-1-2 has been prepared by technical area 14: Interfaces and
methods of measurement for personal computing equipment, of IEC technical committee 100:
Audio, video and multimedia systems and equipment.
The text of this standard was prepared by the USB Implementers Forum (USB-IF). The
structure and editorial rules used in this publication reflect the practice of the organization
which submitted it.
The text of this standard is based on the following documents:
CDV Report on voting
100/2728/CDV 100/2729/RVC

Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.

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SIST EN 62680-1-2:2017
IEC 62680-1-2:2016 © IEC 2016 – 3 –
© USB-IF:2016
A list of all parts in the IEC 62680 series, published under the general title Universal serial
bus interfaces for data and power, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.

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SIST EN 62680-1-2:2017
– 4 – IEC 62680-1-2:2016 © IEC 2016
© USB-IF:2016
INTRODUCTION
The IEC 62680 series is based on a series of specifications that were originally developed by
the USB Implementers Forum (USB-IF). These specifications were submitted to the IEC under
the auspices of a special agreement between the IEC and the USB-IF.
This standard is the USB-IF publication USB Power Delivery Specification Revision 3.0 V.1.0.
The USB Implementers Forum, Inc.(USB-IF) is a non-profit corporation founded by the group
of companies that developed the Universal Serial Bus specification. The USB-IF was formed
to provide a support organization and forum for the advancement and adoption of Universal
Serial Bus technology. The Forum facilitates the development of high-quality compatible USB
peripherals (devices), and promotes the benefits of USB and the quality of products that have
passed compliance testing.
ANY USB SPECIFICATIONS ARE PROVIDED TO YOU "AS IS, "WITH NO WARRANTIES
WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-
INFRINGEMENT, OR FITNESS FOR ANY PARTICULAR PURPOSE. THE USB
IMPLEMENTERS FORUM AND THE AUTHORS OF ANY USB SPECIFICATIONS DISCLAIM
ALL LIABILITY, INCLUDING LIABILITY FOR INFRINGEMENT OF ANY PROPRIETARY
RIGHTS, RELATING TO USE OR IMPLEMENTATION OR INFORMATION IN THIS
SPECIFICAITON.
THE PROVISION OF ANY USB SPECIFICATIONS TO YOU DOES NOT PROVIDE YOU
WITH ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY
INTELLECTUAL PROPERTY RIGHTS.
Entering into USB Adopters Agreements may, however, allow a signing company to
participate in a reciprocal, RAND-Z licensing arrangement for compliant products. For more
information, please see:
http://www.usb.org/developers/docs/
http://www.usb.org/developers/devclass_docs#approved
IEC DOES NOT TAKE ANY POSITION AS TO WHETHER IT IS ADVISABLE FOR YOU TO
ENTER INTO ANY USB ADOPTERS AGREEMENTS OR TO PARTICIPATE IN THE USB
IMPLEMENTERS FORUM.”

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SIST EN 62680-1-2:2017
IEC 62680-1-2:2016 © IEC 2016 – 5 –
© USB-IF:2016







Universal Serial Bus
Power Delivery
Specification









Revision 3.0, V1.0. 11 December 2015

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SIST EN 62680-1-2:2017
– 6 – IEC 62680-1-2:2016 © IEC 2016
© USB-IF:2016
Editors
Bob Dunstan Intel Corporation
Richard Petrie DisplayLink

Contributors
Charles Wang ACON, Advanced-Connectek, Inc.
Conrad Choy ACON, Advanced-Connectek, Inc.
Steve Sedio ACON, Advanced-Connectek, Inc.
Vicky Chuang ACON, Advanced-Connectek, Inc.
Joseph Scanlon Advanced Micro Devices
Howard Chang Allion Labs, Inc.
Greg Stewart Analogix Semiconductor, Inc.
Mehran Badii Analogix Semiconductor, Inc.
Bill Cornelius Apple
Colin Whitby-Strevens Apple
Corey Axelowitz Apple
Corey Lange Apple
Dave Conroy Apple
David Sekowski Apple
Girault Jones Apple
James Orr Apple
Jason Chung Apple
Jennifer Tsai Apple
Karl Bowers Apple
Keith Porthouse Apple
Matt Mora Apple
Paul Baker Apple
Reese Schreiber Apple
Sameer Kelkar Apple
Sasha Tietz Apple
Sree Raman Apple
William Ferry Apple
Zaki Moussaoui Apple
Bernard Shyu Bizlink Technology, Inc.
Eric Wu Bizlink Technology, Inc.
Morphy Hsieh Bizlink Technology, Inc.
Shawn Meng Bizlink Technology Inc.
Tiffany Hsiao Bizlink Technology, Inc.
Weichung Ooi Bizlink Technology, Inc.
Michal Staworko Cadence Design Systems, Inc.
Alessandro Ingrassia Canova Tech
Andrea Colognese Canova Tech
Davide Ghedin Canova Tech
Matteo Casalin Canova Tech
Nicola Scantamburlo Canova Tech

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SIST EN 62680-1-2:2017
IEC 62680-1-2:2016 © IEC 2016 – 7 –
© USB-IF:2016
Yi-Feng Lin Canyon Semiconductor
Anup Nayak Cypress Semiconductor
Jagadeesan Raj Cypress Semiconductor
Pradeep Bajpai Cypress Semiconductor
Rushil Kadakia Cypress Semiconductor
Steven Wong Cypress Semiconductor
Subu Sankaran Cypress Semiconductor
Sumeet Gupta Cypress Semiconductor
Adolfo Montero Dell Inc.
Bruce Montag Dell Inc.
Gary Verdun Dell Inc.
Merle Wood Dell Inc.
Mohammed Hijazi Dell Inc.
Siddhartha Reddy Dell Inc.
Dan Ellis DisplayLink
Jason Young DisplayLink
Peter Burgers DisplayLink
Richard Petrie DisplayLink PD Chair/Device Policy Lead
Abel Astley Ellisys
Chuck Trefts Ellisys
Emmanuel Durin Ellisys
Mario Pasquali Ellisys
Chien-Cheng Kuo Etron Technology, Inc.
Jack Yang Etron Technology, Inc.
Richard Crisp Etron Technology, Inc.
Shyanjia Chen Etron Technology, Inc.
TsungTa Lu Etron Technology, Inc.
Christian Klein Fairchild Semiconductor
Oscar Freitas Fairchild Semiconductor
Souhib Harb Fairchild Semiconductor
AJ Yang Foxconn / Hon Hai
Fred Fons Foxconn / Hon Hai
Steve Sedio Foxconn / Hon Hai
Terry Little Foxconn / Hon Hai
Bob McVay Fresco Logic Inc.
Christopher Meyers Fresco Logic Inc.
Tom Burton Fresco Logic Inc.
Dian Kurniawan Fresco Logic Inc.
Adam Rodriguez Google Inc.
Alec Berg Google Inc.
David Schneider Google Inc.
Jim Guerin Google Inc.
Juan Fantin Google Inc.
Ken Wu Google Inc.
Mark Hayter Google Inc.
Nithya Jagannathan Google Inc.

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SIST EN 62680-1-2:2017
– 8 – IEC 62680-1-2:2016 © IEC 2016
© USB-IF:2016
Todd Broch Google Inc.
Vincent Palatin Google Inc.
Mike Engbretson Granite River Labs
Rajaraman V Granite River Labs
Alan Berkema Hewlett Packard
Lee Atkinson Hewlett Packard
Rahul Lakdawala Hewlett Packard
Robin Castell Hewlett Packard
Roger Benson Hewlett Packard
Ron Schooley Hewlett Packard
Vaibhav Malik Hewlett Packard
Walter Fry Hewlett Packard
Bob Dunstan Intel Corporation PD Chair/Protocol WG Lead
Brad Saunders Intel Corporation
Chee Lim Nge Intel Corporation
Christine Krause Intel Corporation
Dan Froelich Intel Corporation
David Harriman Intel Corporation
David Hines Intel Corporation
David Thompson Intel Corporation
Guobin Liu Intel Corporation
Harry Skinner Intel Corporation
Henrik Leegaard Intel Corporation
Jervis Lin Intel Corporation
John Howard Intel Corporation
Karthi Vadivelu Intel Corporation
Leo Heiland Intel Corporation
Maarit Harkonen Intel Corporation
Nge Chee Lim Intel Corporation
Paul Durley Intel Corporation
Rahman Ismail Intel Corporation System Policy Lead
Ronald Swartz Intel Corporation
Sarah Sharp Intel Corporation
Scott Brenden Intel Corporation
Sridharan Ranganathan Intel Corporation
Steve McGowan Intel Corporation
Tim McKee Intel Corporation PD Chair/Compliance Lead
Toby Opferman Intel Corporation
Japan Aviation Electronics
Kenta Minejima
Industry Ltd. (JAE)
Japan Aviation Electronics
Mark Saubert
Industry Ltd. (JAE)
Japan Aviation Electronics
Toshio Shimoyama
Industry Ltd. (JAE)
Brian Fetz Keysight Technologies Inc.
Babu Mailachalam Lattice Semiconductor Corp
Gianluca Mariani Lattice Semiconductor Corp
Joel Coplen Lattice Semiconductor Corp

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SIST EN 62680-1-2:2017
IEC 62680-1-2:2016 © IEC 2016 – 9 –
© USB-IF:2016
Thomas Watza Lattice Semiconductor Corp
Vesa Lauri Lattice Semiconductor Corp
Daniel H Jacobs LeCroy Corporation
Jake Jacobs LeCroy Corporation
Kimberley McKay LeCroy Corporation
Mike Micheletti LeCroy Corporation
Roy Chestnut LeCroy Corporation
Phil Jakes Lenovo
Dave Thompson LSI Corporation
Alan Kinningham Luxshare-ICT
Daniel Chen Luxshare-ICT
Josue Castillo Luxshare-ICT
Chris Yokum MCCI Corporation
Geert Knapen MCCI Corporation
Terry Moore MCCI Corporation
Velmurugan Selvaraj MCCI Corporation
Brian Marley Microchip Technology Inc.
Dave Perchlik Microchip Technology Inc.
Don Perkins Microchip Technology Inc.
John Sisto Microchip Technology Inc.
Josh Averyt Microchip Technology Inc.
Kiet Tran Microchip Technology Inc.
Mark Bohm Microchip Technology Inc.
Matthew Kalibat Microchip Technology Inc.
Mick Davis Microchip Technology Inc.
Rich Wahler Microchip Technology Inc.
Ronald Kunin Microchip Technology Inc.
Shannon Cash Microchip Technology Inc.
Anthony Chen Microsoft Corporation
Dave Perchlik Microsoft Corporation
David Voth Microsoft Corporation
Geoff Shew Microsoft Corporation
Jayson Kastens Microsoft Corporation
Kai Inha Microsoft Corporation
Marwan Kadado Microsoft Corporation
Rahul Ramadas Microsoft Corporation
Randy Aull Microsoft Corporation
Shiu Ng Microsoft Corporation
Timo Toivola Microsoft Corporation
Toby Nixon Microsoft Corporation
Vivek Gupta Microsoft Corporation
Yang You Microsoft Corporation
Dan Wagner Motorola Mobility Inc.
Ben Crowe MQP Electronics Ltd.
Pat Crowe MQP Electronics Ltd.
Sten Carlsen MQP Electronics Ltd.

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SIST EN 62680-1-2:2017
– 10 – IEC 62680-1-2:2016 © IEC 2016
© USB-IF:2016
Frank Borngräber Nokia Corporation
Kai Inha Nokia Corporation
Pekka Leinonen Nokia Corporation
Richard Petrie Nokia Corporation PD Vice-Chair/Device Policy Lead
Sten Carlsen Nokia Corporation Physical Layer WG Lead
Abhijeet Kulkarni NXP Semiconductors
Ahmad Yazdi NXP Semiconductors
Bart Vertenten NXP Semiconductors
Dong Nguyen NXP Semiconductors
Guru Prasad NXP Semiconductors
Ken Jaramillo NXP Semiconductors
Krishnan TN NXP Semiconductors
Michael Joehren NXP Semiconductors
Robert de Nie NXP Semiconductors
Rod Whitby NXP Semiconductors
Vijendra Kuroodi NXP Semiconductors
Robert Heaton Obsidian Technology
Bryan McCoy ON Semiconductor
Cor Voorwinden ON Semiconductor
Edward Berrios ON Semiconductor Power Supply WG Lead
Tom Duffy ON Semiconductor
Craig Wiley Parade Technologies Inc.
Ricardo Pregiteer Power Integrations
Chris Sporck Qualcomm, Inc.
Craig Aiken Qualcomm, Inc.
George Paparrizos Qualcomm, Inc
Giovanni Garcea Qualcomm, Inc
James Goel Qualcomm, Inc
Joshua Warner Qualcomm, Inc
Narendra Mehta Qualcomm, Inc.
Terry Remple Qualcomm, Inc.
Yoram Rimoni Qualcomm, Inc.
Atsushi Mitamura Renesas Electronics Corp.
Dan Aoki Renesas Electronics Corp.
Kiichi Muto Renesas Electronics Corp.
Masami Katagiri Renesas Electronics Corp.
Nobuo Furuya Renesas Electronics Corp.
Patrick Yu Renesas Electronics Corp.
Peter Teng Renesas Electronics Corp.
Philip Leung Renesas Electronics Corp.
Steve Roux Renesas Electronics Corp.
Tetsu Sato Renesas Electronics Corp.
Heinz Wei Richtek Technology Corporation
Tatsuya Irisawa Ricoh Company Ltd.
Akihiro Ono Rohm Co. Ltd.
Chris Lin Rohm Co. Ltd.

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SIST EN 62680-1-2:2017
IEC 62680-1-2:2016 © IEC 2016 – 11 –
© USB-IF:2016
Hidenori Nishimoto Rohm Co. Ltd.
Kris Bahar Rohm Co. Ltd.
Manabu Miyata Rohm Co. Ltd.
Ruben Balbuena Rohm Co. Ltd.
Takashi Sato Rohm Co. Ltd.
Vijendra Kuroodi Rohm Co. Ltd.
Yusuke Kondo Rohm Co. Ltd.
Matti Kulmala Salcomp Plc
Toni Lehimo Salcomp Plc
Tong Kim Samsung Electronics Co. Ltd.
Alvin Cox Seagate Technology LLC Cab Con WG Lead
John Hein Seagate Technology LLC
Marc Noblitt Seagate Technology LLC
Ronald Rueckert Seagate Technology LLC
Tony Priborsky Seagate Technology LLC
John Sisto SMSC
Ken Gay SMSC
Mark Bohm SMSC
Richard Wahler SMSC
Shannon Cash SMSC
Tim Knowlton SMSC
William Chiechi SMSC
Fabien Friess ST-Ericsson
Giuseppe Platania ST-Ericsson
Jean-Francois Gatto ST-Ericsson
Milan Stamenkovic ST-Ericsson
Nicolas Florenchie ST-Ericsson
Patrizia Milazzo ST-Ericsson
Christophe Lorin ST-Microelectronics
John Bloomfield ST-Microelectronics
Massimo Panzica ST-Microelectronics
Meriem Mersel ST-Microelectronics
Nathalie Ballot ST-Microelectronics
Pascal Legrand ST-Microelectronics
Patrizia Milazzo ST-Microelectronics
Zongyao Wen Synopsys, Inc.
Joan Marrinan Tektronix
Kimberley McKay Teledyne-LeCroy
Matthew Dunn Teledyne-LeCroy
Tony Minchell Teledyne-LeCroy
Anand Dabak Texas Instruments
Bill Waters Texas Instruments
Deric Waters Texas Instruments Physical Layer WG Lead
Grant Ley Texas Instruments
Ingolf Frank Texas Instruments
Ivo Huber Texas Instruments

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SIST EN 62680-1-2:2017
– 12 – IEC 62680-1-2:2016 © IEC 2016
© USB-IF:2016
Javed Ahmad Texas Instruments
Jean Picard Texas Instruments
Martin Patoka Texas Instruments
Scott Jackson Texas Instruments
Srinath Hosur Texas Instruments
Steven Tom Texas Instruments
Dydron Lin VIA Technologies, Inc.
Fong-Jim Wang VIA Technologies, Inc.
Jay Tseng VIA Technologies, Inc.
Rex Chang VIA Technologies, Inc.
Terrance Shih VIA Technologies, Inc.
Charles Neumann Western Digital Technologies, Inc.
Curtis Stevens Western Digital Technologies, Inc.
John Maroney Western Digital Technologies, Inc.

Revision History
Revision Version Comments Issue Date
1.0 1.0 Initial release Revision 1.0 5 July, 2012
1.0 1.1 Including errata through 31-October-2012 31 October 2012
1.0 1.2 Including errata through 26-June-2013 26 June, 2013
1.0 1.3 Including errata through 11-March-2014 11 March 2014
2.0 1.0 Initial release Revision 2.0 11 August 2014
2.0 1.1 Including errata through 7-May 2015 7 May 2015
3.0 1.0 Initial release Revision 3.0 11 December 2015

INTELLECTUAL PROPERTY DISCLAIMER
THIS SPECIFICATION IS PROVIDED TO YOU “AS IS” WITH NO WARRANTIES
WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-
INFRINGEMENT, OR FITNESS FOR ANY PARTICULAR PURPOSE. THE AUTHORS OF
THIS SPECIFICATION DISCLAIM ALL LIABILITY, INCLUDING LIABILITY FOR
INFRINGEMENT OF ANY PROPRIETARY RIGHTS, RELATING TO USE OR
IMPLEMENTATION OF INFORMATION IN THIS SPECIFICATION. THE PROVISION OF THIS
SPECIFICATION TO YOU DOES NOT PROVIDE YOU WITH ANY LICENSE, EXPRESS OR
IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS.
Please send comments via electronic mail to techsup@usb.org
For industry information, refer to the USB Implementers Forum web page at
http://www.usb.org
All product names are trademarks, registered trademarks, or service marks of their respective
owners.
Copyright © 2010-2015 Hewlett-Packard Company, Intel Corporation, LSI Corporation,
Microsoft Corporation, Renesas, STMicroelectronics, and Texas Instruments
All rights reserved.

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SIST EN 62680-1-2:2017
IEC 62680-1-2:2016 © IEC 2016 – 13 –
© USB-IF:2016
Table of Contents
FOREWORD . 2
INTRODUCTION . 4
Contributors . 6
Revision History . 12
Table of Contents . 13
List of Tables . 18
List of Figures . 22
1 Introduction . 29
1.1 Overview . 29
1.2 Purpose . 30
1.3 Scope . 30
1.4 Conventions . 31
1.4.1 Precedence . 31
1.4.2 Keywords . 31
1.4.3 Numbering . 32
1.5 Related Documents. 32
1.6 Terms and Abbreviations . 33
1.7 Parameter Values . 39
2 Overview . 39
2.1 Introduction . 39
2.2 Section Overview . 40
2.3 USB Power Delivery Capable Devices . 41
2.4 SOP* Communication . 42
2.4.1 Introduction . 42
2.4.2 SOP* Collision Avoidance . 42
2.4.3 SOP Communication . 43
2.4.4 SOP’/SOP’’ Communication with Cable Plugs . 43
2.5 Operational Overview . 44
2.5.1 Source Operation . 44
2.5.2 Sink Operation . 46
2.5.3 Cable Plugs . 48
2.6 Architectural Overview . 49
2.6.1 Policy . 51
2.6.2 Message Formation and Transmission . 52
2.6.3 Collision Avoidance . 52
2.6.4 Power supply . 53
2.6.5 DFP/UFP . 53
2.6.6 VCONN Source . 54
2.6.7 Cable and Connectors . 54
2.6.8 Interactions between Non-PD, BC and PD devices . 54
2.6.9 Power Rules . 54
3 USB Type-A and USB Ty
...