ASTM F1709-97

NOTICE: This standard has either been superceded and replaced by a new version or discontinued.
Contact ASTM International (www.astm.org) for the latest information.
Designation: F 1709 – 97
Standard Specification for
High Purity Titanium Sputtering Targets for Electronic Thin
Film Applications
This standard is issued under the fixed designation F 1709; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
TABLE 1 Titanium Sputtering Target Grades
1. Scope
Grade Purity, % Maximum Total Metallic Impurity
1.1 This specification covers pure titanium sputtering tar-
Content, wt ppm
gets used as a raw material in fabricating semiconductor
4N 99.99 100
electronic devices.
4N5 99.995 50
1.2 This standard sets purity grade levels, physical at-
5N 99.999 10
tributes, analytical methods, and packaging.
1.2.1 The grade designation is a measure of total metallic
impurity content. The grade designation does not necessarily
5. Ordering Information
indicate suitability for a particular application because factors
5.1 Orders for pure titanium sputtering targets shall include
other than total metallic impurity may influence performance.
the following:
5.1.1 Grade (see 4.1),
2. Referenced Documents
5.1.2 Special requirements concerning impurities, if re-
2.1 ASTM Standards:
quired (see 6.1, 6.2, 6.3, 6.4),
E 112 Test Methods for Determining the Average Grain
5.1.3 Grain size, if required (Section 7),
Size
5.1.4 Configuration (Section 8),
5.1.5 Certification required (Section 12), and
3. Terminology
5.1.6 Whether or not a sample representative of the finished
3.1 Definitions of Terms Specific to This Standard:
product is required to be provided by the supplier to the
3.1.1 material lot, n—for the purpose of this standard,a
purchaser.
“lot” is material melted into one ingot, and processed as one
continuous batch in subsequent thermal-mechanical treat-
6. Impurities
ments.
6.1 The minimum suite of metallic impurity elements to be
3.1.2 finished product, n—for the purposes of this standard,
analyzed is defined in Table 2. Acceptable analysis methods
a “finished product” is a manufactured sputtering target, ready
and detection limits are specified in Section 11. Elements not
for use.
detected will be counted and reported as present at the
minimum detection limit (“mdl”). Additional elements may be
4. Classification
analyzed and reported as agreed upon between the purchaser
4.1 Grades of titanium sputtering targets are defined in
and the supplier, but these shall not be counted in defining the
Table 1, based upon total metallic impurity content of the
grade designation.
elements listed in Table 2. Impurity contents are reported in
6.2 Cesium, chlorine, phosphorus, and tantalum present
parts per million by weight (wt ppm). Higher purity grades, for
particular analysis problems. The limits, analysis method, and
example “5N5” and“ 6N”, may be provided, as agreed upon
mdl may be as agreed upon between the purchaser and the
between the purchaser and the supplier.
supplier.
4.2 Purity grade and total metallic impurity levels are based
upon the suite of elements listed in Table 2.
TABLE 2 Suite of Metallic Elements to be Analyzed and Reported
aluminum iron silicon vanadium
This specification is under the jurisdiction of ASTM Committee F-1 on
chromium lead silver zinc
Electronics and is the direct responsibility of Subcommittee F01.17 on Sputtered
cobalt lithium potassium sodium
Thin Films.
zirconium copper magnesium thorium
Current edition approved December 10, 1997. Published March 1998. Originally boron manganese tin molybdenum
published as F 1709 - 96. Last previous edition F 1709 - 96. tungsten nickel uranium
Annual Book of ASTM Standards, Vol 03.01.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
NOTICE: This standard has either been superceded and replaced by a new version or discontinued.
Contact ASTM International (www.astm.org) for the latest information.
F 1709 – 97
6.3 Nonmetallic elements which shall be analyzed and grade designation (4.1), other metallic impurity limits (6.1, 6.2,
reported are carbon, hydrogen, nitrogen, oxygen, and sulfur. 6.4), and the agreed upon limits for nonmetallic content (6.3).
Maximum limits for nonmetallic impurities shall be as agreed
11. Analytical Methods
upon between the purchaser and the supplier.
11.1 Analysis for impurities listed in Section 6 and Table 2
6.4 Acceptable limits and analytical techniques for particu-
shall be performed as follows:
lar elements in critical applications may be agreed upon
11.1.1 Trace Metallic Impurities—By glow discharge mass
between the purchaser and the supplier.
spectrometer (GDMS) with a nominal mdl # 0.05 weight ppm.
7. Grain Size NOTE 1—The mdl for some metallic species by GDMS is >0.05 weight
ppm, as limited by interferences.
7.1 The average and the maximum grain size shall be as
11.1.2 Carbon, Oxygen, Sulfur—By fusion and gas
agreed upon between the purchaser and the supplier.
extraction/infrared spectroscopy with an mdl of #10 weight
7.2 Average grain size shall be measured and reported in
ppm.
accordance with Test Methods E 112, or other equivalent
11.1.3 Nitrogen—By fusion and gas extraction with an mdl
method.
of #10
...