CLC/BTTF 97-1 - Known Good Die
To prepare standards of data requirement for unpackaged and minimally packaged semiconductor die, with or without connection structures. The requirements include those of general nature, vocabulary, mechanical material and connectivity. Specific requirements include test, quality, handling, thermal and electrical simulation.
Known Good Die
To prepare standards of data requirement for unpackaged and minimally packaged semiconductor die, with or without connection structures. The requirements include those of general nature, vocabulary, mechanical material and connectivity. Specific requirements include test, quality, handling, thermal and electrical simulation.
General Information
Frequently Asked Questions
CLC/BTTF 97-1 is a Technical Committee within CLC. It is named "Known Good Die" and is responsible for: To prepare standards of data requirement for unpackaged and minimally packaged semiconductor die, with or without connection structures. The requirements include those of general nature, vocabulary, mechanical material and connectivity. Specific requirements include test, quality, handling, thermal and electrical simulation. This committee has published 8 standards.
CLC/BTTF 97-1 develops CLC standards in the area of V09 - SEMICONDUCTORS. The scope of work includes: To prepare standards of data requirement for unpackaged and minimally packaged semiconductor die, with or without connection structures. The requirements include those of general nature, vocabulary, mechanical material and connectivity. Specific requirements include test, quality, handling, thermal and electrical simulation. Currently, there are 8 published standards from this technical committee.
CLC is a standardization organization that develops and publishes standards to support industry, commerce, and regulatory requirements.
A Technical Committee (TC) in CLC is a group of experts responsible for developing international standards in a specific technical area. TCs are composed of national member body delegates and work through consensus to create standards that meet global industry needs. Each TC may have subcommittees (SCs) and working groups (WGs) for specialized topics.
Superseded by EN 61360-4:2005
- Technical specification22 pagesEnglish languagee-Library read for1 day
CECC/WG KGD superseded by BTTF 97-1 * Superseded by CLC/TR 62258-3:2007
- Technical specification10 pagesEnglish languagee-Library read for1 day
CECC/WG KGD superseded by BTTF 97-1 * Superseded by EN 62258-5:2006
- Technical specification10 pagesEnglish languagee-Library read for1 day
CECC/WG KGD superseded by BTTF 97-1 * Superseded by EN 62258-6:2006
- Technical specification8 pagesEnglish languagee-Library read for1 day
CECC/WG KGD superseded by BTTF 97-1 * Superseded by EN 62258-1:2005
- Technical specification11 pagesEnglish languagee-Library read for1 day
CECC/WG KGD superseded by BTTF 97-1 * Superseded by EN 62258-1:2005
- Technical specification20 pagesEnglish languagee-Library read for1 day
CECC/WG KGD superseded by BTTF 97-1 * Superseded by EN 62258-2:2005
- Technical specification38 pagesEnglish languagee-Library read for1 day
CECC/WG KGD superseded by BTTF 97-1 * Superseded by EN 62258-1:2005
- Technical specification6 pagesEnglish languagee-Library read for1 day