SIST-TS ES 59008-5-1:2007

SLOVENSKI STANDARD
SIST-TS ES 59008-5-1:2007
01-januar-2007
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Data requirements for semiconductor die -- Part 5-1: Particular requirements and
recommendations for die types - Bare die
Ta slovenski standard je istoveten z: ES 59008-5-1:2001
ICS:
31.080.01
SIST-TS ES 59008-5-1:2007 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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EUROPEAN SPECIFICATION ES 59008-5-1
SPÉCIFICATION EUROPÉENNE
EUROPÄISCHE SPEZIFIKATION March 2001
English version
Data requirements for semiconductor die
Part 5-1: Particular requirements and recommendations for die types -
Bare die
This European Specification was approved by CENELEC on 2001-02-05.
CENELEC members are required to announce the existence of this ES in the same way as for an EN and to
make the ES available promptly at national level in an appropriate form. It is permissible to keep conflicting
national standards in force.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway,
Portugal, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2001 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. ES 59008-5-1:2001 E

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ES 59008-5-1:2001 - 2 -
Foreword
This European Specification has been prepared by the CENELEC BTTF 97-1, Known Good Die.
It was submitted to the vote during the meeting of BTTF 97-1 and approved by CENELEC as ES 59008-5-1
on 2001-02-05.
The following date was fixed:
- latest date by which the existence of the ES
has to be announced at national level (doa) 2001-06-01
The structure of this European Specification is as follows:
ES 59008 Data requirements for semiconductor die
Part 1 General requirements
Part 2 Vocabulary
Part 3 Mechanical, material and connectivity requirements
Part 4 Specific requirements and recommendations
Part 4-1 Test and quality
Part 4-2 Handling and storage
Part 4-3 Thermal
Part 4-4 Electrical simulation
Part 5 Particular requirements and recommendations for die types
Part 5-1 Bare die
Part 5-2 Bare die with added connection structures
Part 5-3 Minimally packaged die
Part 6 Exchange data formats and data dictionary
Part 6-1 Data exchange - DDX
Part 6-2 Data dictionary

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- 3 - ES 59008-5-1:2001
Introduction
This European Specification has been developed to facilitate the selection of unpackaged and
minimally packaged semiconductor die, with or without connection structures in order to save
both design and procurement time.
It is a data specification which defines the requirements of
• product identity,
• product data,
• die mechanical information,
• test, quality and reliability information,
• handling, storage and mounting information,
• thermal data and electrical simulation data.
This document was prepared by CENELEC Task Force CLC/BTTF 97-1 Known Good Die.
Other organisations that helped prepare it were: the ESPRIT GOOD-DIE projects, EECA,
Sematech, DPC and EIAJ.
th
This specification was derived from the work carried out in the ESPRIT 4 Framework project
GOOD-DIE. This project was set up to develop a database for the selection of unpackaged and
minimally packaged semiconductor die, with or without connection structures, and for the
downloading of information to CAD design stations to facilitate the layout and simulation of
MCMs and hybrid circuits. During the early part of the GOOD-DIE project the need was identified
for a standard way of presenting information for the selection and procurement of these
components.

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ES 59008-5-1:2001 - 4 -
1 Scope
This European Specification specifies requirements for the exchange of data pertaining to bare
semiconductor die with or without connection structures, and minimally-packaged semiconductor
die.
This specification also gives recommendations for general industry good practice for handling
bare die, with or without connection structures and minimally-packaged die.
ES 59008-5-1 specifies particular requirements and recommendations for bare die and wafers
that are not contained elsewhere in this series of specifications.
This specification is for use by semiconductor manufacturers, suppliers, die processors and
users of semiconductor die.
ES 59008-5-1 is to be read in conjunction with ES 59008-1, General requirements, and
ES 59008-3, Mechanical, material and connectivity requirements, and, where relevant,
ES 59008-4-1, ES 59008-4-2, ES 59008-4-3 and ES 59008-4-4.
2 Normative references
The following normative documents contain provisions which, through reference in this text,
constitute provisions of ES 59008-5-1.
ES 59008-1 Data requirements for semiconductor die -- Part 1: General requirements
ES 59008-2 Part 2: Vocabulary
ES 59008-3 Part 3: Mechanical, material and connectivity requirements
ES 59008-4-1 Part 4-1: Specific requirements and recommendations – Test and quality
ES 59008-4-2 Part 4-2: Specific requirements and recommendations – Handling, assembly and
storage
ES 59008-4-3 Part 4-3: Specific requirements and recommendations – Thermal
ES 59008-4-4 Part 4-4: Specific requirements and recommendations – Electrical simulation
EIA/JESD49 Procurement standard for Known Good Die (KGD) February 1996
FED-STD-209 Clean room and workstation requirements, controlled environments
3 Definitions
For the purposes of this European Specification, the definitions given in ES 59008-2,
Vocabulary, shall apply.

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- 5 - ES 59008-5-1:2001
4 Conformity levels
Conformity levels do not apply to this part of ES 59008 except where any item in this part of the
standard is already covered by ES 59008-3, ES 59008-4-1, ES 59008-4-2, ES 59008-4-3 or
ES 59008-4-4. This part provides recommendations for good industry practice when exchanging
information about die. All information specific to a bare die or wafer form is included in this part
and should be used as a basis for a detailed supplier or user specification.
5 Specific recommendations – Test and quality
5.1 General
This clause contains classes of information specifically related to the testing performed on the
die or wafer by the supplier or related to the quality of the die or wafer supplied.
5.2 Wafer map or binning information
Wafer map or other method of identifying good devices, except where method is simple inking of
rejects using a single ink colour. If dual or multiple colour inking is used, the wafer map or
binning information should show the meaning of the different ink colours.
5.3 Photo and thermal sensitive devices
Details about die that are sensitive to light or temperature and require testing in a controlled
environment to obtain correct electrical test results.
5.4 Traceability
Information that links the individual die or batch to the manufacturer's traceability system.
Traceability to an individual wafer within a wafer run may be necessary.
5.5 Wafer probing information
Information or recommendations with regard to wafer probing.
6 Specific recommendations - User or assembler related issues, techniques,
best practice and material selection
6.1 General
This clause contains classes of information specifically of use to the user or assembler of die or
wafers including recommended assembly techniques, best practice for assembly and information
on material selection for assembly.
6.2 Die attach material
Suggested die attach material and properties for proper and effective mounting of the die. This
may be important for die with high thermal dissipation or requiring a conductive connection. This
should also mention if particular die attach methods are not recommended i.e. polymer die
attach, silicon-gold eutectic or other specific die attach.
6.3 Bonding method
Any suggested bonding methods that should be used for proper and effective functioning of the
die when assembled (e.g. thermo-compression bonding).

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ES 59008-5-1:2001 - 6 -
6.4 Bond pad surface
Information about the mechanical construction or surface metallisation of the bond pad which
may affect the bonding or bump preparation of the die.
6.5 Bond wire information
Suggested bond wire type, size, bonding sequence and specific information for any down bonds
required for proper functioning of the die.
6.6 Power bonds
Quantity of bond wires on power and ground pins, and stitch-bond (connection) requirements
between ground pins for proper and effective bonding of the power connections.
6.7 Die substrate (backside) connection
Information on the electrical bias of the die substrate (or backside of die). This should always be
detailed where a connection is required to enable proper functioning of the die.
6.8 Peak temperature and duration
Maximum recommended allowable peak die assembly process temperature and time e.g. certain
FLASH technologies may lose data when subjected to excessive temperature.
6.9 Unusual material
Non-standard or unusual material properties (e.g. Silicon on Sapphire substrate), where special
processing may be required.
6.10 Die coat material, thickness and process
Any die coat that is required for the proper functioning of the device when mounted.
Recommendations should be advised as necessary on die coat material, thickness and process
required. Spe
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