ISO/IEC 30129:2015/AMD1:2019

ISO/IEC 30129
Edition 1.0 2019-02
INTERNATIONAL
STANDARD
AMENDMENT 1
Information technology – Telecommunications bonding networks for buildings
and other structures
ISO/IEC 30129:2015-10/AMD1:2019-02(en)

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ISO/IEC 30129
Edition 1.0 2019-02
INTERNATIONAL
STANDARD
AMENDMENT 1
Information technology – Telecommunications bonding networks for buildings

and other structures
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 35.200 ISBN 978-2-8322-6570-3

– 2 – ISO/IEC 30129:2015/AMD1:2019
© ISO/IEC 2019
FOREWORD
This amendment has been prepared by subcommittee 25: Interconnection of information
technology equipment, of ISO/IEC joint technical committee 1: Information technology.
The text of this amendment is based on the following documents:
FDIS Report on voting
JTC1-SC25/2849/FDIS JTC1-SC25/2858/RVD

Full information on the voting for the approval of this amendment can be found in the report
on voting indicated in the above table.

___________
2 Normative references
Add, at the end of the list, the following new references:
IEC 61557-4, Electrical safety in low voltage distribution systems up to 1 000 V a.c. and
1 500 V d.c. – Equipment for testing, measuring or monitoring of protective measures –
Part 4. Resistance of earth connection and equipotential bonding
IEC 61557-5, Electrical safety in low voltage distribution systems up to 1 000 V a.c. and
1 500 V d.c. – Equipment for testing, measuring or monitoring of protective measures –
Part 5. Resistance to earth
3 Terms, definitions and abbreviations
3.1 Terms and definitions
Add, at the end of the list, the following new terms and definitions:
3.1.26
high frequency
frequency of, or greater than, 1 MHz
3.1.27
low frequency
frequency of less than 1 MHz
4 Conformance
In b)2), first bullet, replace "Clause 5" with "Clause 6".
Add the following text at the end of the NOTE:
IEC 60364-4-44 contains additional information.

© ISO/IEC 2019
6 Selection of the telecommunications bonding network approach
6.1 Assessment of the impact of the telecommunications bonding network on the
interconnection of telecommunications equipment
Replace paragraphs 2, 3 and 4 with the following:
The mesh bonding network of Clause 11 provides the most effective bonding at high
frequencies and can provide effective bonding at low frequencies. It is intended to support the
most demanding requirements of both cabling media and the applications supported over
those media (see Table 1). In addition, it provides the most flexibility in relation to the types
and locations of telecommunications equipment that may be installed (subject to the
transmission performance limits of the applications when using the selected
telecommunications cabling).
The installation of such a telecommunications bonding network is most easily implemented
during new construction or refurbishment of a building or s
...