Industrial communication networks - Profiles - Part 1: Fieldbus profiles

IEC 61784-1:2014 defines a set of protocol specific communication profiles based primarily on the IEC 61158 series, to be used in the design of devices involved in communications in factory manufacturing and process control. This fourth edition cancels and replaces the third edition published in 2010 it constitutes a technical revision. The main changes are:
- update of the dated references to the IEC 61158 series, to IEC 61784-2, to the IEC 61784-3 series, to the IEC 61784-5 series and to IEC 61918 throughout the document;
- new profile family CPF 19;
- update of selection tables for CPF 1 and CPF 9.

Réseaux de communication industriels - Profils - Partie 1: Profils de bus de terrain

L'IEC 61784-1:2014 définit un jeu de profils de communication spécifiques au protocole, principalement fondé sur la série de normes IEC 61158, à utiliser pour la conception d'appareils employés en communication dans le cadre du contrôle de la fabrication et du processus en usine. Cette quatrième édition annule et remplace la troisième édition parue en 2010. Cette édition constitue une révision technique. Par rapport à l'édition précédente, les changements majeurs sont les suivants:
- la mise à jour des références datées à la série IEC 61158, à l'IEC 61784-2, à la série IEC 61784-3, à la série IEC 61784-5 et à l'IEC 61918 dans l'ensemble du document;
- une nouvelle famille de profils CPF 19;
- la mise à jour des tableaux de sélection pour CPF 1 et CPF 9.

General Information

Status
Published
Publication Date
18-Aug-2014
Technical Committee
SC 65C - Industrial networks
Drafting Committee
WG 9 - TC 65/SC 65C/WG 9
Current Stage
DELPUB - Deleted Publication
Start Date
10-Apr-2019
Completion Date
26-Oct-2025

Relations

Effective Date
05-Sep-2023
Effective Date
05-Sep-2023

Overview

IEC 61784-1:2014 is an international standard published by the International Electrotechnical Commission (IEC) that specifies protocol-specific communication profiles for industrial communication networks. Focused on fieldbus profiles, this standard is primarily based on the IEC 61158 series and supports the design of devices used in factory manufacturing and process control communications. The standard represents the fourth edition, updating references and introducing new profile families to keep pace with evolving industrial communication technologies.

This standard is essential for engineers, designers, and professionals working with industrial automation and communications, ensuring interoperability and standardization across various industrial communication protocols and devices.

Key Topics

  • Fieldbus Communication Profiles: IEC 61784-1:2014 defines profiles for different Fieldbus communication protocols, facilitating seamless communication between devices in industrial automation.
  • Protocol Families: The document categorizes communication profiles into families such as FOUNDATION™ fieldbus, CIP™, PROFIBUS & PROFINET, P-NET®, WorldFIP®, INTERBUS®, CC-Link, and HART®.
  • Layered Protocol Descriptions: Each profile includes detailed specifications across layers-physical, data-link, and application-to ensure comprehensive implementation guidelines.
  • Updated References: The fourth edition updates references to IEC 61158, IEC 61784-2, IEC 61784-3, IEC 61784-5, and IEC 61918 standards.
  • New Profile Family (CPF 19): Introduction of a new communication profile family to address emerging industrial communication requirements.
  • Selection Table Updates: Revisions to selection tables for CPF 1 and CPF 9 assist in choosing the appropriate profile for specific applications.
  • Conformance Requirements: Methods and criteria for conformance to communication profiles are detailed, ensuring interoperability among products from different manufacturers.

Applications

IEC 61784-1:2014 is critical for:

  • Factory Automation: Standardizing communication between controllers, sensors, actuators, and other devices on the factory floor.
  • Process Control Systems: Enabling reliable and efficient communication in continuous and batch processes in industries like chemical, oil & gas, and pharmaceuticals.
  • Device Design and Integration: Guiding device manufacturers on communication protocols to facilitate cross-compatibility and reduce integration costs.
  • Industrial Network Deployment: Assisting system integrators in selecting suitable communication protocols based on network requirements and application needs.
  • Upgrading Industrial Communication: Providing a framework for updating legacy systems with modern communication protocols while maintaining compatibility.

This standard supports critical features such as real-time data exchange, control message prioritization, and network scalability, which are paramount for advanced industrial automation solutions.

Related Standards

  • IEC 61158 - Fieldbus Types: Foundational standards specifying the data-link and physical layer protocols that IEC 61784-1 profiles build upon.
  • IEC 61784-2 - Additional Profiles: Extends profile families to include time synchronization and security features.
  • IEC 61784-3 - Functional Safety Profiles: Covers safety communication profiles for applications demanding high reliability and safety integrity.
  • IEC 61784-5 - Security: Addresses security profiles for industrial communication networks.
  • IEC 61918 - Industrial Communication Systems: Provides guidelines on aspects like field device integration.

Understanding IEC 61784-1 alongside these related standards is vital for comprehensive implementation of robust and interoperable industrial communication networks.


Keywords: IEC 61784-1:2014, industrial communication networks, fieldbus profiles, IEC 61158, FOUNDATION fieldbus, PROFIBUS, PROFINET, CIP protocols, industrial automation standards, process control communication, industrial protocols, communication profiles, device interoperability.

Standard

IEC 61784-1:2014 - Industrial communication networks - Profiles - Part 1: Fieldbus profiles Released:8/19/2014

English and French language
716 pages
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Frequently Asked Questions

IEC 61784-1:2014 is a standard published by the International Electrotechnical Commission (IEC). Its full title is "Industrial communication networks - Profiles - Part 1: Fieldbus profiles". This standard covers: IEC 61784-1:2014 defines a set of protocol specific communication profiles based primarily on the IEC 61158 series, to be used in the design of devices involved in communications in factory manufacturing and process control. This fourth edition cancels and replaces the third edition published in 2010 it constitutes a technical revision. The main changes are: - update of the dated references to the IEC 61158 series, to IEC 61784-2, to the IEC 61784-3 series, to the IEC 61784-5 series and to IEC 61918 throughout the document; - new profile family CPF 19; - update of selection tables for CPF 1 and CPF 9.

IEC 61784-1:2014 defines a set of protocol specific communication profiles based primarily on the IEC 61158 series, to be used in the design of devices involved in communications in factory manufacturing and process control. This fourth edition cancels and replaces the third edition published in 2010 it constitutes a technical revision. The main changes are: - update of the dated references to the IEC 61158 series, to IEC 61784-2, to the IEC 61784-3 series, to the IEC 61784-5 series and to IEC 61918 throughout the document; - new profile family CPF 19; - update of selection tables for CPF 1 and CPF 9.

IEC 61784-1:2014 is classified under the following ICS (International Classification for Standards) categories: 35.100.20 - Data link layer; 35.240.50 - IT applications in industry. The ICS classification helps identify the subject area and facilitates finding related standards.

IEC 61784-1:2014 has the following relationships with other standards: It is inter standard links to IEC 61784-1:2019, IEC 61784-1:2010. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.

IEC 61784-1:2014 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.

Standards Content (Sample)


IEC 61784-1 ®
Edition 4.0 2014-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Industrial communication networks – Profiles –
Part 1: Fieldbus profiles
Réseaux de communication industriels – Profils –
Partie 1: Profils de bus de terrain

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IEC 61784-1 ®
Edition 4.0 2014-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Industrial communication networks – Profiles –

Part 1: Fieldbus profiles
Réseaux de communication industriels – Profils –

Partie 1: Profils de bus de terrain

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX XH
ICS 35.100.20; 35.240.50 ISBN 978-2-8322-1706-1

– 2 – IEC 61784-1:2014 © IEC 2014

CONTENTS
FOREWORD . 15

INTRODUCTION . 17

1 Scope . 18

2 Normative references . 19

3 Definitions . 23

3.1 Terms and definitions . 23

3.2 Abbreviations and symbols . 23

3.2.1 IEC 61158 abbreviations and symbols . 23
3.2.2 Other abbreviations and symbols . 24
3.3 Conventions . 24
3.3.1 Conventions common to all layers . 24
3.3.2 Physical layer . 26
3.3.3 Data-link layer . 26
3.3.4 Application layer . 27
4 Conformance to communication profiles . 27
5 Communication Profile Family 1 (FOUNDATION™ fieldbus) . 28
5.1 General overview . 28
5.2 Profile 1/1 (FOUNDATION™ H1) . 29
5.2.1 Physical layer . 29
5.2.2 Data-link layer . 47
5.2.3 Application layer . 118
5.3 Profile 1/2 (FOUNDATION™ HSE) . 120
5.3.1 Physical layer . 120
5.3.2 Data-link layer . 120
5.3.3 Network layer . 120
5.3.4 Transport layer . 120
5.3.5 Application layer . 120
5.4 Profile 1/3 (FOUNDATION™ H2) . 121
5.4.1 Physical layer . 121
5.4.2 Data-link layer . 124
5.4.3 Application layer . 124
6 Communication Profile Family 2 (CIP™) . 124

6.1 General overview . 124
6.2 Profile 2/1 (ControlNet) . 125
6.2.1 Physical layer . 125
6.2.2 Data-link layer . 126
6.2.3 Application layer . 128
6.3 Profile 2/2 (EtherNet/IP) . 129
6.3.1 Physical layer . 129
6.3.2 Data-link layer . 130
6.3.3 Application layer . 131
6.4 Profile 2/3 (DeviceNet) . 133
6.4.1 Physical layer . 133
6.4.2 Data-link layer . 133
6.4.3 Application layer . 135
7 Communication Profile Family 3 (PROFIBUS & PROFINET) . 136

7.1 General overview . 136

7.2 Profile 3/1 (PROFIBUS DP). 138

7.2.1 Physical layer . 138

7.2.2 Data-link layer . 140

7.2.3 Application layer . 164

7.3 Profile 3/2 (PROFIBUS PA) . 223

7.3.1 Physical layer . 223

7.3.2 Data-link layer . 228

7.3.3 Application layer . 240

7.4 Profile 3/3 (PROFINET CBA)---Void . 241

8 Communication Profile Family 4 (P-NET®) . 241
8.1 General overview . 241
8.2 Profile 4/1 (P-NET RS-485) . 241
8.2.1 Physical layer . 241
8.2.2 Data-link layer . 242
8.2.3 Application layer . 243
9 Communication Profile Family 5 (WorldFIP®) . 244
9.1 General overview . 244
9.2 Profile 5/1 (WorldFIP) . 245
9.2.1 Physical layer . 245
9.2.2 Data-link layer . 247
9.2.3 Application layer . 249
9.3 Profile 5/2 (WorldFIP) . 255
9.3.1 Physical layer . 255
9.3.2 Data-link layer . 255
9.3.3 Application layer . 255
9.4 Profile 5/3 (WorldFIP) . 261
9.4.1 Physical layer . 261
9.4.2 Data-link layer . 261
9.4.3 Application layer . 261
10 Communication Profile Family 6 (INTERBUS®) . 262
10.1 General overview . 262
10.2 Profile 6/1 . 263
10.2.1 Physical layer . 263
10.2.2 Data-link layer . 265

10.2.3 Application layer . 267
10.3 Profile 6/2 . 268
10.3.1 Physical layer . 268
10.3.2 Data-link layer . 269
10.3.3 Application layer . 270
10.4 Profile 6/3 . 271
10.4.1 Physical layer . 271
10.4.2 Data-link layer . 271
10.4.3 Application layer . 272
11 Communication Profile Family 7 – Void. 273
12 Communication Profile Family 8 (CC-Link) . 274
12.1 General overview . 274
12.1.1 General . 274

– 4 – IEC 61784-1:2014 © IEC 2014

12.1.2 Profile 8/1 . 274

12.1.3 Profile 8/2 . 275

12.1.4 Profile 8/3 . 275

12.2 Profile 8/1 . 275

12.2.1 Physical layer . 275

12.2.2 Data-link layer . 276

12.2.3 Application layer . 279

12.3 Profile 8/2 . 282

12.3.1 Physical layer . 282

12.3.2 Data-link layer . 282

12.3.3 Application layer . 282
12.4 Profile 8/3 . 282
12.4.1 Physical layer . 282
12.4.2 Data-link layer . 283
12.4.3 Application layer . 286 ®
13 Communication Profile Family 9 (HART ) . 289
13.1 General Overview . 289 ®
13.2 Profile 9/1, HART . 289
13.2.1 Physical layer . 289
13.2.2 Data-link layer . 290
13.2.3 Application layer . 291
13.3 Profile 9/2, WirelessHART® . 292
14 Communication Profile Family 16 (SERCOS) . 292
14.1 General overview . 292
14.2 Profile 16/1 (SERCOS I) . 292
14.2.1 Physical layer selection . 292
14.2.2 Data-link layer . 293
14.2.3 Application layer . 294
14.3 Profile 16/2 (SERCOS II) . 294
14.3.1 Physical layer . 294
14.3.2 Data-link layer . 295
14.3.3 Application layer . 296
15 Communication Profile Family 19 (MECHATRLINK) . 296
15.1 General overview . 296
15.2 Profile 19/1 (MECHATROLINK-II) . 296

15.2.1 Physical layer selection . 296
15.2.2 Data-link layer . 298
15.2.3 Application layer . 307
15.3 Profile 19/2 (M-III) . 313
15.3.1 Physical layer . 313
15.3.2 Data-link layer . 313
15.3.3 Application layer . 323
Annex A (informative) Communication concepts . 328
A.1 CPF 1 (FOUNDATION Fieldbus) communication concepts . 328
A.1.1 Overview. 328
A.1.2 Physical layer characteristics . 328
A.1.3 Data-link layer characteristics . 328
A.1.4 Application layer characteristics . 329

A.1.5 Management characteristics . 329

A.2 CPF 2 (CIP) communication concepts . 329

A.2.1 Overview. 329

A.2.2 CIP common characteristics . 330

A.2.3 ControlNet . 330

A.2.4 EtherNet/IP . 331

A.2.5 DeviceNet . 332

A.3 CPF 3 (PROFIBUS & PROFINET) communication concepts . 332

A.3.1 Basic characteristics . 332

A.3.2 Physical layer profiles . 333
A.3.3 Communication feature list (GSD) . 334
A.3.4 PROFINET---Void . 334
A.4 CPF 4 (P-NET) communication concepts . 334
A.5 CPF 5 (WorldFIP) communication concepts . 336
A.5.1 Physical layer characteristics . 336
A.5.2 Data-link layer characteristics . 336
A.5.3 Application layer characteristics . 336
A.6 CPF 6 (INTERBUS) communication concepts . 336
A.7 CPF 8 (CC-LINK) communication concepts . 338
A.7.1 Basic characteristics . 338
A.7.2 Variants . 338
A.8 CPF 9 (HART) communication concepts . 339
A.9 CPF 16 (SERCOS) communication concepts . 339
Annex B (informative) Added value of IEC 61784-1. 341
Bibliography . 342

Figure 1 – Communication profile families and profiles . 18
Figure 2 – Example optical power budget for a 100/140 µm fiber system with a 16/16
optical passive star coupler. 46
Figure 3 – CP 3/2 Slave devices usable in applications. 138
Figure A.1 – Ring structure . 339
Figure A.2 – Topology example. 340

Table 1 – Relations of Communication Profile Families to type numbers . 19
Table 2 – Layout of profile (sub)clause selection tables . 24
Table 3 – Contents of (sub)clause selection tables . 25
Table 4 – Layout of service selection tables . 25
Table 5 – Contents of service selection tables . 26
Table 6 – Layout of parameter selection tables . 26
Table 7 – Contents of parameter selection tables . 26
Table 8 – Layout of class attribute selection tables . 27
Table 9 – Contents of class attribute selection tables . 27
Table 10 – CPF 1: overview of profile sets . 29
Table 11 – CP 1/1: PhL selection for communicating devices and their MAUs . 29
Table 12 – CP 1/1: PhL classification of MAUs and attached devices . 31

– 6 – IEC 61784-1:2014 © IEC 2014

Table 13 – CP 1/1: PhL selection of Clause 16 for devices and their MAUs . 32

Table 14 – CP 1/1: PhL selection of Clause 12 for devices and their MAUs . 32

Table 15 – Void . 33

Table 16 – CP 1/1: PhL selection of recommended IS parameters for MAU classes

111, 112, 121, 122, 511 and 512 . 34

Table 17 – CP 1/1: PhL selection for media components. 35

Table 18 – CP 1/1: PhL selection of imperative IS parameters for media in FISCO
systems . 36

Table 19 – CP 1/1: PhL selection for power supplies . 37

Table 20 – CP 1/1: PhL selection of power supply types . 38
Table 21 – CP 1/1: PhL selection of permissible output voltage and IS parameters for
FISCO power supplies . 38
Table 22 – CP 1/1: PhL selection for terminators . 39
Table 23 – CP 1/1: PhL selection of IS parameters for terminators . 40
Table 24 – CP 1/1: PhL selection of Clause 12 for intrinsic safety barriers . 41
Table 25 – CP 1/1: PhL selection of recommended IS parameters for intrinsic safety
barriers and galvanic isolators (Entity model only) . 42
Table 26 – CP 1/1: PhL selection of Clause 12 for intrinsically safe galvanic isolators . 43
Table 27 – CP 1/1: PhL selection of Clause 15, recommended optical fiber types . 44
Table 28 – CP 1/1: PhL selection of passive star couplers, recommended maximum
insertion loss . 44
Table 29 – CP 1/1: PhL selection of active star couplers . 45
Table 30 – CP 1/1: Optical power budget considerations . 45
Table 31 – CP 1/1: DLL service selection . 47
Table 32 – CP 1/1: DLL service selection of Clause 5 . 47
Table 33 – CP 1/1: DLL service selection of 5.4 . 47
Table 34 – CP 1/1: DLL service selection of 5.4.1 . 48
Table 35 – CP 1/1: DLL service selection of 5.4.3 . 48
Table 36 – CP 1/1: DLL service selection of 5.4.6 . 49
Table 37 – CP 1/1: DLL service selection of Clause 6 . 50
Table 38 – CP 1/1: DLL service selection of the summary of 6.3, DL-connection QoS . 51
Table 39 – CP 1/1: DLL service selection of figures 9 to 14 of 6.4 . 51

Table 40 – CP 1/1: DLL service selection of 6.5 . 52
Table 41 – CP 1/1: DLL service selection: replacement for Table 13 of 6.5 . 53
Table 42 – CP 1/1: DLL service selection of 6.5, replacement for Table 14 . 54
Table 43 – CP 1/1: DLL service selection of 6.5 for use of addresses for peer DLC . 54
Table 44 – CP 1/1: DLL service selection of 6.5 for use of addresses for multipeer DLC
connect request at publisher . 54
Table 45 – CP 1/1: DLL service selection of 6.5 for use of addresses for multipeer DLC
connect request at subscriber . 54
Table 46 – CP 1/1: DLL service selection of 6.6 . 55
Table 47 – CP 1/1: DLL service selection: replacement for Table 15 of 6.6 . 55
Table 48 – CP 1/1: DLL service selection of 6.7 . 56
Table 49 – CP 1/1: DLL service selection of 6.7, replacement for Table 16 . 56
Table 50 – CP 1/1: DLL service selection of 6.7, replacement for Table 17 . 56

Table 51 – CP 1/1: DLL service selection of 6.7, replacement for Table 18 . 57

Table 52 – CP 1/1: DLL service selection of Clause 7 . 57

Table 53 – CP 1/1: DLL service selection of 7.5, replacement for Table 23 . 58

Table 54 – CP 1/1: DLL service selection of Clause 8 . 59

Table 55 – CP 1/1: DLL service selection of 8.5, replacement for Table 28 . 59

Table 56 – CP 1/1: DLL protocol selection . 60

Table 57 – CP 1/1: DLL protocol selection of Clause 4 . 60

Table 58 – CP 1/1: DLL protocol selection of 4.3 . 61

Table 59 – CP 1/1: DLL protocol selection of 4.3.2.1 for use of link designators. 61
Table 60 – CP 1/1: DLL protocol selection of 4.3.2.2 for use of node designators . 61
Table 61 – CP 1/1: DLL protocol selection of 4.3.3.1 for predefined flat non–local
DL-addresses . 62
Table 62 – CP 1/1: DLL protocol selection of 4.3.3.2 for predefined flat link–local
DL-addresses . 62
Table 63 – CP 1/1: DLL protocol selection of 4.3.3.3 for predefined node–local
DL-addresses . 62
Table 64 – CP 1/1: DLL protocol selection of 4.7 . 63
Table 65 – CP 1/1: DLL protocol selection of 4.7.4 . 64
Table 66 – CP 1/1: DLL protocol selection of 4.7.5 . 65
Table 67 – CP 1/1: DLL protocol selection of Clause 6 . 66
Table 68 – CP 1/1: DLL protocol selection, replacement for Table 10 of 6.0 . 67
Table 69 – CP 1/1: DLL protocol selection of 6.5 . 68
Table 70 – CP 1/1: DLL protocol selection of 6.7 . 71
Table 71 – CP 1/1: DLL protocol selection of 6.8 . 75
Table 72 – CP 1/1: DLL protocol selection of 6.11 . 76
Table 73 – CP 1/1: DLL protocol selection of 6.12 . 76
Table 74 – CP 1/1: DLL protocol selection of 6.15 . 77
Table 75 – CP 1/1: DLL protocol selection of 6.20 . 78
Table 76 – CP 1/1: DLL protocol selection of Clause 7 . 79
Table 77 – CP 1/1: DLL protocol selection of 7.4 . 80
Table 78 – CP 1/1: DLL protocol selection of Clause 8 . 81
Table 79 – CP 1/1: DLL protocol selection of 8.2 . 82

Table 80 – CP 1/1: DLL protocol selection of 8.2.2 . 93
Table 81 – CP 1/1: DLL protocol selection of 8.3 . 105
Table 82 – CP 1/1: DLL protocol selection of 8.4 . 106
Table 83 – CP 1/1: DLL protocol selection of Clause 9 . 107
Table 84 – CP 1/1: DLL protocol selection of 9.3 . 108
Table 85 – CP 1/1: DLL protocol selection of 9.3.5 . 110
Table 86 – CP 1/1: DLL protocol selection of 9.3.5.2.2, replacement for element
encoding . 111
Table 87 – CP 1/1: DLL protocol selection of Clause 10 . 111
Table 88 – CP 1/1: DLL protocol selection of 10.2 . 112
Table 89 – CP 1/1: DLL protocol selection of 10.3 . 113
Table 90 – CP 1/1: DLL protocol selection of 10.3.7, specification of errors . 115

– 8 – IEC 61784-1:2014 © IEC 2014

Table 91 – CP 1/1: DLL protocol selection of 10.4 . 116

Table 92 – CP 1/1: DLL protocol selection of 10.5 . 117

Table 93 – CP 1/1: DLL protocol selection of 10.6 . 118

Table 94 – CP 1/1: AL service selection . 118

Table 95 – CP 1/1: AL data type selection of Clause 4 . 119

Table 96 – CP 1/1: AL protocol selection . 119

Table 97 – CP 1/2: AL service selection . 120

Table 98 – CP 1/2: AL protocol selection . 121

Table 99 – CP 1/3: PhL selection for H2 devices. 122
Table 100 – CP 1/3: PhL selection for H2 media and related components . 123
Table 101 – CPF 2: overview of profile sets . 125
Table 102 – CP 2/1: PhL selection . 125
Table 103 – CP 2/1: DLL service selection . 126
Table 104 – CP 2/1: DLL protocol selection . 127
Table 105 – CP 2/1: DLL protocol selection of management objects . 128
Table 106 – CP 2/1: AL service selection . 128
Table 107 – CP 2/1: AL protocol selection . 129
Table 108 – CP 2/2: DLL protocol selection . 130
Table 109 – CP 2/2: DLL protocol selection of management objects . 131
Table 110 – CP 2/2: AL service selection . 131
Table 111 – CP 2/2: AL protocol selection . 132
Table 112 – CP 2/3: DLL protocol selection . 134
Table 113 – CP 2/3: DLL protocol selection of management objects . 134
Table 114 – CP 2/3: AL service selection . 135
Table 115 – CP 2/3: AL protocol selection . 136
Table 116 – CPF 3: overview of profile sets . 137
Table 117 – CP 3/1: PhL selection . 138
Table 118 – CP 3/1: PhL selection of Clause 3 . 140
Table 119 – CP 3/1: PhL selection of Clause 4 . 140
Table 120 – CP 3/1: General DLL service selection . 140
Table 121 – CP 3/1: DLL service selection for DP-V0 master (class 1) . 141

Table 122 – CP 3/1: DLM service selection for DP-V0 master (class 1) . 142
Table 123 – CP 3/1: DLL service selection for DP-V1 master (class 1) . 143
Table 124 – CP 3/1: DLM service selection for DP-V1 master (class 1) . 144
Table 125 – CP 3/1: DLL service selection for DP-V0 master (class 2) . 144
Table 126 – CP 3/1: DLL service selection for DP-V1 master (class 2) . 145
Table 127 – CP 3/1: DLL service selection for DP-V0 slave . 147
Table 128 – CP 3/1: DLM service selection for DP-V0 slave . 148
Table 129 – CP 3/1: DLL service selection for DP-V1 slave . 149
Table 130 – CP 3/1: DLM service selection for DP-V1 slave . 150
Table 131 – CP 3/1: General DLL protocol selection . 151
Table 132 – CP 3/1: DLL protocol selection of Clause 5 . 151
Table 133 – CP 3/1: DLL protocol selection of Clause 6 . 152

Table 134 – CP 3/1: DLL protocol selection of Clause 7 . 152

Table 135 – CP 3/1: Time variable selection for DP-V0 master (class 1) . 153

Table 136 – CP 3/1: Timer and counter selection for DP-V0 master (class 1) . 154

Table 137 – CP 3/1: DLPDU selection for DP-V0 master (class 1) . 154

Table 138 – CP 3/1: MAC state selection for DP-V0 master (class 1) . 155

Table 139 – CP 3/1: Time selection for DP-V1 master (class 1) . 156

Table 140 – CP 3/1: Timer and counter selection for DP-V1 master (class 1) . 157

Table 141 – CP 3/1: DLPDU selection for DP-V1 master (class 1) . 157

Table 142 – CP 3/1: MAC state selection for DP-V1 master (class 1) . 158
Table 143 – CP 3/1: CS protocol selection for DP-V1 master (class 1) . 158
Table 144 – CP 3/1: Time selection for DP-V1 master (class 2) . 159
Table 145 – CP 3/1: Timer and counter selection for DP-V1 master (class 2) . 159
Table 146 – CP 3/1: DLPDU selection for DP-V1 master (class 2) .
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