IEC TR 62658:2013

IEC/TR 62658 ®
Edition 1.0 2013-07
TECHNICAL
REPORT
colour
inside
Roadmap of optical circuit boards and their related packaging technologies

IEC/TR 62658:2013(E)
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IEC/TR 62658 ®
Edition 1.0 2013-07
TECHNICAL
REPORT
colour
inside
Roadmap of optical circuit boards and their related packaging technologies

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
R
ICS 33.180.01; 33.180.99 ISBN 978-2-8322-0915-8

– 2 – TR 62658 © IEC:2013(E)
CONTENTS
FOREWORD . 3
1 Scope . 5
2 General . 5
2.1 Background of optical packaging technology road map . 5
2.2 Advantages of optical interconnects . 7
2.3 Planar embedded optical waveguides . 9
3 Standardization of board-level optical packaging . 9
3.1 Role of IEC TC86/JWG9 (with TC91) . 9
3.2 Optical circuit boards [20] . 10
3.3 Optical backplanes [22] . 11
3.4 Optical circuit board connectors [23]. 13
3.5 Opto-electronic modules on boards . 14
3.6 Originating standards . 15
4 Standardization road map . 16
4.1 Performance trends for optical circuit boards . 16
5 Standardization road map of optical circuit boards . 17
Bibliography . 18

Figure 1 – Data transmission speed and capability trends for network traffic and
server systems [2]. 6
Figure 2 – Internet traffic and router power consumption in Japan [5] . 7
Figure 3 – Increase of power consumption in future network . 8
Figure 4 – Comparison of power consumption of 10 Tbps electrical and optical routers . 9
Figure 5 – Discussion field in IEC TC86/JWG9 (with TC91) . 10
Figure 6 – Classification of optical circuit boards . 11
Figure 7 – Four types of optical backplane applications . 13
Figure 8 – Classification of optical circuit board connectors . 14
Figure 9 – Classification of optical modules on boards . 15
Figure 10 – De facto-standards in Japan [24] . 15
Figure 11 – Performance trends for optical circuit boards. 16
Figure 12 – Standardization roadmap of optical circuit board and its related optical
packaging . 17

TR 62658 © IEC:2013(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ROADMAP OF OPTICAL CIRCUIT BOARDS AND
THEIR RELATED PACKAGING TECHNOLOGIES

FOREWORD
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The main task of IEC technical committees is to prepare International Standards. However, a
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example "state of the art".
IEC 62658, which is a technical report, has been prepared by IEC technical committee 86:
Fibre optics.
The text of this technical report is based on the following documents:
Enquiry draft Report on voting
86/442/DTR 86/453/RVC
Full information on the voting for the approval of this technical report can be found in the
report on voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – TR 62658 © IEC:2013(E)
The committee has decided that the contents of this publication will remain unchanged until
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related to the specific publication. At this date, the publication will be
• reconfirmed,
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IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
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TR 62658 © IEC:2013(E) – 5 –
ROADMAP OF OPTICAL CIRCUIT BOARDS AND
THEIR RELATED PACKAGING TECHNOLOGIES

1 Scope
This Technical Report covers the roadmap of optical circuit boards, and its related packaging
technologies including optical circuit board connectors and optical modules on boards.
2 General
2.1 Background of optical packaging technology road map
The volume of network traffic is dramatically increasing due to the amount of data being
captured, processed, conveyed and stored as digital information. This information is
generated from many sources, including critical business applications, email communications,
the Internet and multimedia applications which have collectively fuelled an increase in
demand for data networking and storage capacity. In addition, the proliferation of media rich
applications, such as digital music and video sharing services is fuelling a concurrent
increase in data processing in data centres [1] . The growth in network traffic attributed to
personalized content is 20 % per month, giving rise to a doubling of network traffic every
1,5 years. However, this is out of step with the input/output (I/O) performance or I/O
throughput of servers, which doubles every 2 years. Therefore, there is an increasing gap
between the performance evolution of network equipment such as servers, and the growth in
network traffic (Figure 1) [2].

________________
Figures in square brackets refer to the Bibliography.

– 6 – TR 62658 © IEC:2013(E)
IEC  1588/13
Figure 1 – Data transmission speed and capability trends
for network traffic and server systems [2]
In general, system power consumption will increase as the volume of internet traffic expands.
By 2020, power consumption in network routers in Japan will reach the gross power
generation of Japan in 2005. An energy saving by 3 to 4 orders of magnitude in network
router technology is required in 2030 to meet the stipulated targets in the Kyoto protocol [3]
(Figure 2).
In addition, the bandwidth and density requirements for interconnects within high-performance
computing systems are becoming unmanageable, due to increasing chip speeds, wider buses
and larger numbers of processors per system [4]. The increase in system bandwidth and
density required to satisfy this demand would impose unmanageable cost and performance
burdens on future data networking and storage technologies.
An alternative to the current electrical printed circuit board (PCB) interconnect technology is
required across multiple high-speed application spaces to mitigate this common trend. Optical
interconnects are expected to bridge the performance gap between network hardware and
traffic, and give rise to a reduction in hardware power consumption while increasing
bandwidth density by over two orders of magnitude.

TR 62658 © IEC:2013(E) – 7 –
IEC  1589/13
Figure 2 – Internet traffic and router power consumption in Japan [5]
2.2 Advantages of optical interconnects
Optical interconnects will be fundamental in furthe
...