Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock

Modification of the validity date: now put at 2007.

Corrigendum 1 - Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 10: Chocs mécaniques

Modification de la date de validité : fixée maintenant à 2007.

General Information

Status
Published
Publication Date
12-Aug-2003
Technical Committee
Current Stage
DELPUB - Deleted Publication
Completion Date
27-Apr-2022
Ref Project

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IEC 60749-10:2002/COR1:2003 - Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock Released:8/13/2003
English and French language
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Standards Content (Sample)


CEI 60749-10 IEC 60749-10
(Première édition – 2002) (First edition – 2002)

DISPOSITIFS À SEMICONDUCTEURS – SEMICONDUCTOR DEVICES –
MÉTHODES D'ESSAIS MÉCANIQUES MECHANICAL AND CLIMATIC TEST METHODS –

ET CLIMATIQUES –
Part 10: Mechanical shock
Partie 10: Chocs mécaniques
CORRIGENDUM 1
Page 2 Page 3
Au lieu de: Instead of:
Le comité a décidé que le contenu de The committee has dec
...

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