Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

IEC 62148-21:2021 is available as IEC 62148-21:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62148-21: 2021 covers the design guidelines of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages. This second edition cancels and replaces the first edition published in 2019. This edition constitutes a technical revision. This edition includes the following significant technical change with respect to the previous edition: specification of an electric guard band area around the optical terminal area, so as to allow applications with electric signals at higher symbol rates (e.g. 50 Gbaud and 100 Gbaud).

Aktive Lichtwellenleiterbauelemente und Geräte - Gehäuse- und Schnittstellennormen - Teil 21: Konstruktionsleitfaden für elektrische Schnittstellen von PIC-Gehäusen mit Si-Feinraster-Ball-Grid-Array (S-FBGA) und Si-Feinraster-Land-Grid-Array (S-FLGA)

Composants et dispositifs actifs fibroniques - Normes de boîtier et d'interface - Partie 21: Lignes directrices de conception de l'interface électrique des boîtiers PIC utilisant des boîtiers matriciels à billes et à pas fins en silicium (S-FBGA) et des boîtiers matriciels à zone de contact plate et à pas fins en silicium (S-FLGA)

IEC 62148-21:2021 est disponible sous forme de IEC 62148-21:2021 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.

Aktivne optične komponente in naprave - Standardi za ohišja in vmesnike - 21. del: Smernice za projektiranje električnega vmesnika za PIC-ohišja, ki uporabljajo silicijev fini raster mreže krogličnih priključkov (S-FBGA) in silicijev fini raster mreže priključkov v ravnini (S-FLGA) (IEC 62148-21:2021)

General Information

Status
Published
Publication Date
03-Jun-2021
Current Stage
6060 - Document made available - Publishing
Start Date
04-Jun-2021
Completion Date
04-Jun-2021

Relations

Overview

EN IEC 62148-21:2021 (IEC 62148-21:2021) provides design guidelines for the electrical interface of photonic integrated circuit (PIC) packages that use silicon fine‑pitch ball grid array (S‑FBGA) and silicon fine‑pitch land grid array (S‑FLGA) technologies. This second edition supersedes the 2019 version and introduces a significant technical update: an electric guard band area around the optical terminal area to support higher symbol‑rate electrical signals (for example, 50 Gbaud and 100 Gbaud). The document aims to ensure mechanical and electrical interchangeability of PIC packages used for optical transmitters and receivers.

Key Topics

  • Scope and purpose: Guidelines for electrical interface dimensions, tolerances and allocation rules for S‑FBGA and S‑FLGA PIC packages.
  • Definitions: Clear definitions of S‑FBGA (outer balls > 0.1 mm height) and S‑FLGA (outer lands ≤ 0.1 mm height).
  • Terminal numbering: Standardized row/column alphanumeric scheme for terminal identification (A, B, C…; 1, 2, 3…).
  • Package nominal dimensions: Code system for package length (E) and width (D) expressed to two decimal places in millimetres.
  • Mechanical drawings and symbols: Standardized figures for package outline, optical terminal area, and electrical terminal existence areas.
  • Dimensions and tolerances: Specified dimension/tolerance tables and mechanical gauge requirements; examples include guidance for fine pitch (e.g., e = 0.30 mm S‑FBGA and e = 0.25 mm S‑FLGA).
  • Optical terminal guard band: Defined electrical guard band area to minimize interference and support higher baud rates.
  • Normative references: References such as IEC 60050‑731 and IEC TR 61931 for terminology.

Applications

EN IEC 62148-21:2021 is directly applicable to:

  • Design and verification of PIC packages for optical transmitters and receivers.
  • Development of high‑speed optical modules and pluggable transceivers used in data centers, telecom networks, and high‑performance computing.
  • PCB footprint and connector interface design where S‑FBGA / S‑FLGA packages are deployed.
  • Manufacturing, testing and procurement processes that require mechanical and electrical interchangeability.

Who should use this standard

  • Photonic packaging engineers and mechanical designers
  • PIC and silicon photonics device manufacturers
  • PCB designers and system integrators
  • Test engineers and QA teams for optical modules
  • Standards committees and procurement specialists

Related standards

  • IEC 62148 series (package and interface standards for fibre optic active components)
  • IEC 62148‑1, IEC 62148‑19 (harmonized parts)
  • IEC 60050‑731 and IEC TR 61931 (terminology)
  • IEC 60191‑6‑22 (related package/interconnect guidance)

This standard is essential for anyone designing or integrating S‑FBGA/S‑SFLGA PIC packages who needs consistent electrical interfaces, defined tolerances, and support for evolving high‑speed signal requirements (50/100 Gbaud).

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EN IEC 62148-21:2021
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Frequently Asked Questions

EN IEC 62148-21:2021 is a standard published by CLC. Its full title is "Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)". This standard covers: IEC 62148-21:2021 is available as IEC 62148-21:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62148-21: 2021 covers the design guidelines of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages. This second edition cancels and replaces the first edition published in 2019. This edition constitutes a technical revision. This edition includes the following significant technical change with respect to the previous edition: specification of an electric guard band area around the optical terminal area, so as to allow applications with electric signals at higher symbol rates (e.g. 50 Gbaud and 100 Gbaud).

IEC 62148-21:2021 is available as IEC 62148-21:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62148-21: 2021 covers the design guidelines of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages. This second edition cancels and replaces the first edition published in 2019. This edition constitutes a technical revision. This edition includes the following significant technical change with respect to the previous edition: specification of an electric guard band area around the optical terminal area, so as to allow applications with electric signals at higher symbol rates (e.g. 50 Gbaud and 100 Gbaud).

EN IEC 62148-21:2021 is classified under the following ICS (International Classification for Standards) categories: 33.180.20 - Fibre optic interconnecting devices. The ICS classification helps identify the subject area and facilitates finding related standards.

EN IEC 62148-21:2021 has the following relationships with other standards: It is inter standard links to EN IEC 62148-21:2019. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.

You can purchase EN IEC 62148-21:2021 directly from iTeh Standards. The document is available in PDF format and is delivered instantly after payment. Add the standard to your cart and complete the secure checkout process. iTeh Standards is an authorized distributor of CLC standards.

Standards Content (Sample)


SLOVENSKI STANDARD
01-september-2021
Nadomešča:
SIST EN IEC 62148-21:2019
Aktivne optične komponente in naprave - Standardi za ohišja in vmesnike - 21. del:
Smernice za projektiranje električnega vmesnika za PIC-ohišja, ki uporabljajo
silicijev fini raster mreže krogličnih priključkov (S-FBGA) in silicijev fini raster
mreže priključkov v ravnini (S-FLGA) (IEC 62148-21:2021)
Fibre optic active components and devices - Package and interface standards - Part 21:
Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid
array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA) (IEC 62148-21:2021)
Aktive Lichtwellenleiterbauelemente und Geräte - Gehäuse- und Schnittstellennormen -
Teil 21: Konstruktionsleitfaden für elektrische Schnittstellen von PIC-Gehäusen mit Si-
Feinraster-Ball-Grid-Array (S-FBGA) und Si-Feinraster-Land-Grid-Array (S-FLGA) (IEC
62148-21:2021)
Composants et dispositifs actifs fibroniques - Normes de boîtier et d'interface - Partie 21:
Lignes directrices de conception de l'interface électrique des boîtiers PIC utilisant des
boîtiers matriciels à billes et à pas fins en silicium (S-FBGA) et des boîtiers matriciels à
zone de contact plate et à pas fins en silicium (S-FLGA) (IEC 62148-21:2021)
Ta slovenski standard je istoveten z: EN IEC 62148-21:2021
ICS:
33.180.20 Povezovalne naprave za Fibre optic interconnecting
optična vlakna devices
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 62148-21

NORME EUROPÉENNE
EUROPÄISCHE NORM
June 2021
ICS 33.180.20 Supersedes EN IEC 62148-21:2019 and all of its
amendments and corrigenda (if any)
English Version
Fibre optic active components and devices - Package and
interface standards - Part 21: Design guidelines of electrical
interface of PIC packages using silicon fine-pitch ball grid array
(S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
(IEC 62148-21:2021)
Composants et dispositifs actifs fibroniques - Normes de Aktive Lichtwellenleiterbauelemente und Geräte - Gehäuse-
boîtier et d'interface - Partie 21: Lignes directrices de und Schnittstellennormen - Teil 21: Konstruktionsleitfaden
conception de l'interface électrique des boîtiers PIC utilisant für elektrische Schnittstellen von PIC-Gehäusen mit Si-
des boîtiers matriciels à billes et à pas fins en silicium (S- Feinraster-Ball-Grid-Array (S-FBGA) und Si-Feinraster-
FBGA) et des boîtiers matriciels à zone de contact plate et Land-Grid-Array (S-FLGA)
à pas fins en silicium (S-FLGA) (IEC 62148-21:2021)
(IEC 62148-21:2021)
This European Standard was approved by CENELEC on 2021-05-27. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 62148-21:2021 E

European foreword
The text of document 86C/1684/CDV, future edition 2 of IEC 62148-21, prepared by SC 86C "Fibre
optic systems and active devices" of IEC/TC 86 "Fibre optics" was submitted to the IEC-CENELEC
parallel vote and approved by CENELEC as EN IEC 62148-21:2021.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2022-02-27
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2024-05-27
document have to be withdrawn
This document supersedes EN IEC 62148-21:2019 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 62148-21:2021 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60191-6-22 NOTE Harmonized as EN 60191-6-22
IEC 62148-1 NOTE Harmonized as EN IEC 62148-1
IEC 62148-19 NOTE Harmonized as EN IEC 62148-19
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60050-731 - International Electrotechnical Vocabulary - - -
Chapter 731: Optical fibre communication
IEC/TR 61931 - Fibre optic - Terminology - -

IEC 62148-21 ®
Edition 2.0 2021-04
INTERNATIONAL
STANDARD
Fibre optic active components and devices – Package and interface standards –

Part 21: Design guidelines of electrical interface of PIC packages using silicon

fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array

(S‑FLGA)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 33.180.20 ISBN 978-2-8322-9723-0

– 2 – IEC 62148-21:2021 © IEC 2021
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Terminal position numbering . 6
5 Code of package nominal dimensions . 6
6 Symbols and drawings . 6
7 Dimensions and tolerances . 8
Bibliography . 13

Figure 1 – S-FBGA and S-FLGA outline . 7
Figure 2 – Mechanical gauge drawing . 8
Figure 3 – Array of terminal-existence areas . 8

Table 1 – Dimensions and tolerances . 9
Table 2 – Combination list of D, E, M , and M for e = 0,30 mm pitch S-FBGA
D E
(informative) . 11
Table 3 – Combination list of D, E, M , and M for e = 0,25 mm pitch S-FLGA . 12
D E
IEC 62148-21:2021 © IEC 2021 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES –
PACKAGE AND INTERFACE STANDARDS –

Part 21: Design guidelines of electrical interface of PIC
packages using silicon fine-pitch ball grid array (S-FBGA)
and silicon fine-pitch land grid array (S-FLGA)

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses
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記事のタイトル:EN IEC 62148-21:2021 - 光ファイバーの活性部品とデバイス-パッケージとインターフェースの標準-パート21:シリコンの精密ピッチボールグリッドアレイ(S-FBGA)およびシリコンの精密ピッチランドグリッドアレイ(S-FLGA)を使用したPICパッケージの電気インターフェースの設計ガイドライン 記事内容:IEC 62148-21:2021は、以前のバージョンとの技術的な変更点を示した国際標準書とそのRedline版であるIEC 62148-21:2021 RLVが利用可能です。IEC 62148-21:2021は、シリコンの精密ピッチボールグリッドアレイ(S-FBGA)とシリコンの精密ピッチランドグリッドアレイ(S-FLGA)を使用したフォトニック集積回路(PIC)パッケージの電気インターフェースの設計ガイドラインをカバーしています。この文書では、S-FBGAパッケージの電気インターフェースが情報提供されています。この文書の目的は、光トランスミッターおよびレシーバーから構成されるPICパッケージの機械的および電気的な交換性を十分に指定することです。この第2版は、2019年に発行された第1版を取り消し、置き換えます。この版は技術的な改訂を構成しており、以前の版と比較して以下の重要な技術的変更を含んでいます:光端子領域周辺に電気的防護バンド領域の仕様化、これにより高いシンボルレート(例:50 Gbaudおよび100 Gbaud)での電気信号を使用するアプリケーションをサポートします。

The article discusses the IEC 62148-21:2021 standard, which provides design guidelines for the electrical interface of photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). This document aims to specify the electrical interface of PIC packages that allow for interchangeability of optical transmitters and receivers. The second edition of the standard includes a new technical change, which specifies an electric guard band area to support applications with higher symbol rates.

기사 제목: EN IEC 62148-21:2021 - 광섬유 활성 부품 및 장치 - 패키지 및 인터페이스 표준 - 제 21 부: 실리콘 파인 피치 볼 그리드 어레이(S-FBGA)와 실리콘 파인 피치 랜드 그리드 어레이(S-FLGA)를 사용하는 PIC 패키지의 전기 인터페이스 설계 지침 기사 내용: IEC 62148-21:2021은 이전 판과 비교하여 기술 내용의 변경 사항을 모두 보여주는 국제표준과 그 변경 사항을 보여주는 Redline 버전인 IEC 62148-21:2021 RLV로 제공된다. IEC 62148-21:2021은 실리콘 파인 피치 볼 그리드 어레이(S-FBGA)와 실리콘 파인 피치 랜드 그리드 어레이(S-FLGA)를 사용하는 광학적 통합 회로(PIC) 패키지의 전기 인터페이스 설계 지침을 다룬다. 이 문서에서 S-FBGA 패키지의 전기 인터페이스는 정보를 제공한다. 이 문서의 목적은 광 전송 및 수신기로 구성된 PIC 패키지의 기계적 및 전기적 상호 교환성을 확보하기 위한 것이다. 이 판은 2019년에 발행된 첫 번째 판을 취소하고 대체한다. 이 판은 기술 개정을 구성한다. 이 판은 이전 판과 비교하여 다음과 같은 중요한 기술적 변경 사항을 포함하고 있다: 광 단자 영역 주변에 전기적 가드 밴드 영역의 사양화로, 더 높은 심볼률(예: 50 Gbaud 및 100 Gbaud)에서 전기 신호를 사용하는 응용 프로그램을 지원하기 위함이다.