EN IEC 62148-19:2019

SLOVENSKI STANDARD
01-oktober-2019
Aktivne komponente in naprave optičnih vlaken - Standardi za ohišja in vmesnike -
19. del: Fotonsko ohišje v velikosti čipa (IEC 62148-19:2019)
Fibre optic active components and devices - Package and interface standards - Part 19:
Photonic chip scale package (IEC 62148-19:2019)
Aktive Lichtwellenleiterbauelemente und -geräte - Gehäuse- und Schnittstellennormen -
Teil 19: Photonisches Gehäuse in Chipgröße (IEC 62148-19:2019)
Composants et dispositifs actifs fibroniques - Normes de boîtier et d’interface - Partie 19
: Boîtier à puce photonique (IEC 62148-19:2019)
Ta slovenski standard je istoveten z: EN IEC 62148-19:2019
ICS:
33.180.20 Povezovalne naprave za Fibre optic interconnecting
optična vlakna devices
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 62148-19

NORME EUROPÉENNE
EUROPÄISCHE NORM
July 2019
ICS 33.180.20
English Version
Fibre optic active components and devices - Package and
interface standards - Part 19: Photonic chip scale package
(IEC 62148-19:2019)
Composants et dispositifs actifs fibroniques - Normes de Aktive Lichtwellenleiterbauelemente und -geräte - Gehäuse-
boîtier et d'interface - Partie 19 : Boîtier à puce photonique und Schnittstellennormen - Teil 19: Photonisches Gehäuse
(IEC 62148-19:2019) in Chipgröße
(IEC 62148-19:2019)
This European Standard was approved by CENELEC on 2019-06-06. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2019 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN IEC 62148-19:2019 E

European foreword
The text of document 86C/1574/FDIS, future edition 1 of IEC 62148-19, prepared by SC 86C "Fibre optic
systems and active devices" of IEC/TC 86 "Fibre optics" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN IEC 62148-19:2019.
The following dates are fixed:
• latest date by which the document has to be implemented at national level by (dop) 2020-03-06
publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2022-06-06
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent
rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice
The text of the International Standard IEC 62148-19:2019 was approved by CENELEC as a European Standard
without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60191 (series) NOTE Harmonized in EN 60191 (series)
IEC 61281-1 NOTE Harmonized as EN IEC 61281-1
IEC 62148-21 NOTE Harmonized as EN IEC 62148-21

Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content constitutes
requirements of this document. For dated references, only the edition cited applies. For undated references, the
latest edition of the referenced document (including any amendments) applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu.

Publication Year Title EN/HD Year
IEC 62148-1 -  Fibre optic active components and devices - EN IEC 62148-1 -
Package and interface standards - Part 1:
General and guidance
IEC 62148-19 ®
Edition 1.0 2019-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Fibre optic active components and devices – Package and interface standards –

Part 19: Photonic chip scale package

Composants et dispositifs actifs fibroniques – Normes de boîtier et d'interface –

Partie 19: Boîtier à puce photonique

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 33.180.20 ISBN 978-2-8322-6869-8

– 2 – IEC 62148-19:2019 © IEC 2019
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms, definitions and abbreviated terms . 7
3.1 Terms and definitions . 7
3.2 Abbreviated terms . 7
4 Classification . 8
5 Specification of photonic chip scale package . 8
5.1 General . 8
5.2 General block diagram (silicon photonics) . 8
5.3 Electrical interface . 9
5.3.1 General . 9
5.3.2 Numbering of electrical terminals . 9
5.4 Optical interface . 9
5.4.1 General . 9
5.4.2 Free space optical beam condition . 9
5.5 Outline and footprint . 9
5.5.1 General . 9
5.5.2 Drawing of footprint . 10
Annex A (normative) Specific configurations . 11
A.1 General . 11
A.2 4ch transceiver . 11
A.2.1 Block diagram . 11
A.2.2 Electrical terminal assignments . 12
A.2.3 Optical terminal assignments . 15
A.2.4 Outline drawing . 16
A.3 8ch transceiver . 18
A.3.1 Block diagram . 18
A.3.2 Electrical terminal assignments . 19
A.3.3 Optical terminal assignments . 23
A.3.4 Outline drawing . 24
A.4 12ch transmitter and receiver . 25
A.4.1 Block diagram . 25
A.4.2 Electrical terminal assignments . 27
A.4.3 Optical terminal assignments . 32
A.4.4 Outline drawing . 34
Bibliography . 38

Figure 1 – General block diagram for photonic chip scale package . 8
Figure 2 – Electrical terminal numbering assignment (top view) . 9
Figure 3 – Recommended pattern layout for PCB . 10
Figure 4 – Informative electrical strip line wiring for high speed electrical interface . 10
Figure A.1 – Block diagram for chip scale package of 4ch transceiver using silicon
photonics chip with optional pads for LD control. 12

IEC 62148-19:2019 © IEC 2019 – 3 –
Figure A.2 – Electrical terminal numbering assignment (top view) . 13
Figure A.3 – Optical terminal numbering assignment for 0,25 mm pitch optical interface
for 4ch transceiver (top view) . 16
Figure A.4 – Package outline drawing of 4ch transceiver . 17
Figure A.5 – Block diagram for chip scale package of 8ch transceiver using silicon

photonics chip with optional pads for LD control. 19
Figure A.6 – Electrical terminal numbering assignment (top view) . 20
Figure A.7 – Optical terminal numbering assignment for 0,125 mm pitch optical
interface for 8ch transceiver (top view) . 23
Figure A.8 – Package outline drawing of 8ch transceiver . 24
Figure A.9 – Block diagram for chip scale package of 12ch transmitter using silicon
photonics chip with optional pads for LD control. 26
Figure A.10 – Block diagram for the chip scale package of 12ch receiver with optional

pad for PD bias . 26
Figure A.11 – Electrical terminal numbering assignment (top view) . 27
Figure A.12 – Optical terminal numbering assignment for 0,125 mm pitch optical
interface for 12ch transmitter and receiver (top view) . 33
Figure A.13 – Package outline drawing of 12ch transmitter . 34
Figure A.14 – Package outline drawing of 12ch receiver . 36

Table 1 – Dimensions of recommended pattern layout for PCB . 10
Table A.1 – Specific configurations specified in Annex A . 11
Table A.2 – Terminal function definitions for a 4ch transceiver . 13
Table A.3 – Optical terminal function definitions for 4ch transceiver . 16
Table A.4 – Dimensions of the package outline of 4ch transceiver . 17
Table A.5 – Terminal function definitions for 8ch transceiver. 20
Table A.6 – Optical t
...