IEC/SC 47D - Semiconductor devices packaging
To prepare international standards on the mechanical and thermal aspects of semiconductor packages, package assembly technologies and measuring methods, including wafer level packaging.
Boîtiers des dispositifs semi-conducteurs
Etablir des normes internationales sur les aspects mécaniques et thermiques des boîtiers semi-conducteurs, les technologies d'assemblage des boîtiers et les méthodes de mesure, y compris la mise en boîtier au niveau de la plaquette
General Information
Frequently Asked Questions
IEC/SC 47D is a Subcommittee within the International Organization for Standardization (ISO). It is named "Semiconductor devices packaging" and is responsible for: To prepare international standards on the mechanical and thermal aspects of semiconductor packages, package assembly technologies and measuring methods, including wafer level packaging. This committee has published 30 standards.
IEC/SC 47D develops ISO standards in the area of Information technology. The scope of work includes: To prepare international standards on the mechanical and thermal aspects of semiconductor packages, package assembly technologies and measuring methods, including wafer level packaging. Currently, there are 30 published standards from this subcommittee.
The International Organization for Standardization (ISO) is an independent, non-governmental international organization that develops and publishes international standards. Founded in 1947 and headquartered in Geneva, Switzerland, ISO brings together experts from 170+ member countries to share knowledge and develop voluntary, consensus-based standards that support innovation and provide solutions to global challenges.
A Subcommittee (SC) in ISO operates under a Technical Committee and focuses on a specific subset of the TC's scope. Subcommittees develop standards and technical specifications in their specialized area, reporting to their parent Technical Committee. They may also have working groups for detailed technical work.