ISO/TC 202/WG 9 - Guideline for mis‐orientation analysis to assess mechanical damage by EBSD
Lignes directrices applicables à l'analyse des erreurs d'orientation dans l'évaluation des dommages mécaniques par EBSD
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ISO/TC 202/WG 9 is a Working Group within the International Organization for Standardization (ISO). It is named "Guideline for mis‐orientation analysis to assess mechanical damage by EBSD". This committee has published 1 standards.
ISO/TC 202/WG 9 develops ISO standards in the area of Information technology. Currently, there are 1 published standards from this working group.
The International Organization for Standardization (ISO) is an independent, non-governmental international organization that develops and publishes international standards. Founded in 1947 and headquartered in Geneva, Switzerland, ISO brings together experts from 170+ member countries to share knowledge and develop voluntary, consensus-based standards that support innovation and provide solutions to global challenges.
A Working Group in ISO is a specialized group responsible for developing standards or technical work within a defined scope. These bodies bring together international experts to create consensus-based standards that support global trade, safety, and interoperability.
This document describes the guidelines for misorientation analysis to assess mechanical damage such as fatigue and creep induced by plastic and/or creep deformation for metallic materials by using electron backscatter diffraction (EBSD) technique. This international standard defines misorientation parameters and specifies measurement conditions for such mechanical damage assessment. This document is recommended to evaluate mechanical damage of austenitic stainless steel, which is widely used for various components of power plants and other facilities. In this document, the mechanical damage refers to the damage which causes the fracture of structural materials due to external overload, fatigue and creep; excepting the chemical and thermal damages themselves.
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