SIST EN 300 417-4-2 V1.1.1:2003
(Main)Transmission and Multiplexing (TM); Generic requirements of transport functionality of equipment; Part 4-2: Synchronous Digital Hierarchy (SDH) path layer functions; Implementation Conformance Statement (ICS) proforma specification
- Abstract
ICS proforma for ETS 300 417-4-1
- Status
- Published
- Publication Date
- 30-Nov-2003
- Current Stage
- 6060 - National Implementation/Publication (Adopted Project)
- Start Date
- 01-Dec-2003
- Due Date
- 01-Dec-2003
- Completion Date
- 01-Dec-2003
SIST EN 300 417-4-2 V1.1.1:2003 is the Slovenian adoption of EN 300 417-4-2 Version 1.1.1, published by SIST and produced by ETSI. It is an Implementation Conformance Statement (ICS) proforma for Synchronous Digital Hierarchy (SDH) path layer functions. In practice, it gives suppliers and test laboratories a standard questionnaire for stating which SDH path-layer capabilities are implemented so conformance or approval testing can be planned consistently.
What does SIST EN 300 417-4-2 V1.1.1:2003 specify?
SIST EN 300 417-4-2 V1.1.1:2003 specifies the ICS proforma for the SDH path layer functions defined in EN 300 417-4-1. It is a documentation and testing aid, not a functional profile: it records implementation choices, supported options, and the conditions under which they apply.
The document is organized as a short front section, clause 4 on conformance to the proforma, and five normative annexes.
| Annex | What it covers |
|---|---|
| A | Guidance for completing the ICS proforma |
| B | S4 Path Layer |
| C | S3 Path Layer |
| D | S2 Path Layer |
| E | S12 Path Layer |
What are the key requirements of SIST EN 300 417-4-2 V1.1.1:2003?
Clause 4 states that a conforming ICS must be technically equivalent to the annexed proformas and must preserve the numbering, naming and order of the items. For a buyer or test lab, this means the completed form has to follow the same structure if it is to be accepted as a valid conformance statement.
Annex A defines how the questionnaire is completed. It uses the status codes m, o, n/a, x, o.i and c, and it requires support answers such as Y and N. In practice, this lets the supplier show what is mandatory, optional, prohibited, conditional, or not applicable for a given implementation.
Annex A also says that the completed proforma is filled in by the supplier, with separate handling for user implementations and network implementations where those tables appear. That matters because the same equipment may need different answers depending on its role in the system.
Annex B, Annex C, Annex D and Annex E each provide a layer-specific proforma for S4, S3, S2 and S12 respectively. Each annex begins with implementation identification, identification of the EN, and a global statement area, then moves into detailed capability tables. This is the core of the document and the part that is usually reviewed during conformance testing.
The layer tables capture the main SDH functions that may be present:
- connection functions such as S4_C, S3_C, S2_C and S12_C
- trail termination functions, including source and sink roles
- adaptation functions to payloads and lower-order layers
- tandem connection and non-intrusive monitoring functions
- linear trail protection and SNC protection
- defect detection, consequent action, defect correlation and performance monitoring
For example, the tables cover BIP-8 error monitoring, Trail Trace Identifier handling, Remote Defect Indication and Remote Error Indication, protection switching, and monitoring at near-end and far-end. In practice, these are the items a test lab uses to decide which tests apply and what the implementation claims to support.
What terms does SIST EN 300 417-4-2 V1.1.1:2003 define?
Implementation Conformance Statement (ICS) - a statement from the supplier that says which capabilities of a specification are implemented.
ICS proforma - the questionnaire form that becomes an ICS when it is completed for a particular implementation.
Implementation Under Test (IUT) - the specific implementation being assessed.
System Under Test (SUT) - the system that contains the IUT.
Automatic Protection Switch (APS) - the protection switching mechanism used in linear trail and SNC protection.
Sub-Network Connection (SNC) - a protection arrangement used for VC-4, VC-3, VC-2 and VC-12 path layers.
Trail Trace Identifier (TTI) - the identifier inserted and checked in the trail, carried in byte J1 for VC-4 and related layers.
Who uses SIST EN 300 417-4-2 V1.1.1:2003?
SIST EN 300 417-4-2 V1.1.1:2003 is used by equipment suppliers, test laboratories, network operators, and clients who request conformance or approval testing. It is especially useful for teams documenting SDH path-layer support, selecting applicable test cases, and comparing implementations across vendors.
Which standards are used with SIST EN 300 417-4-2 V1.1.1:2003?
| Reference | What it contributes |
|---|---|
| EN 300 417-4-1 | The SDH path layer functions that this ICS proforma documents |
| EN 300 417-1-1 | Generic processes, performance, TTI handling, defect and performance monitoring, and related supervision rules |
| EN 300 417-3-1 | Protection-related processes and terms used for SNC and linear protection |
| EN 300 417-6-1 | Synchronization layer family reference |
| ETS 300 746 | APS protocols and operation |
| ISO/IEC 9646-1 | General conformance testing concepts |
| ISO/IEC 9646-7 | Rules for ICS documents and proformas |
| ETS 300 406 | Standardization methodology for conformance testing specifications |
| ITU-T G.707 | SDH network node interface, including error-monitoring concepts used in the tables |
| ITU-T G.823 | Jitter and wander control |
| ETS 300 337 | Generic frame structures for transport of various signals |
| ISO/IEC 8802-6 | DQDB access method and physical layer specifications |
What does the SIST EN 300 417-4-2 V1.1.1:2003 document contain?
The document contains instructions for completing an ICS, blank identification fields for the IUT, SUT, supplier and contact person, and large capability tables for each path layer. The tables list connection, trail termination, adaptation, protection, tandem connection, defect and performance-monitoring functions.
Annex B is the most detailed part and covers S4 with VC-4 connection, adaptation to P4x, P4e, VC-3, VC-2, VC-12, VC-11, DQDB, ATM, LC, TSS1 and P0s, plus protection and monitoring. Annexes C, D and E repeat the same kind of structure for S3, S2 and S12 with their corresponding VC-3, VC-2 and VC-12 functions.
The proforma also includes guidance on conditional items, prerequisites, support notation and item references. That makes it suitable for use in testing, certification and formal supplier declarations.
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Frequently Asked Questions
SIST EN 300 417-4-2 V1.1.1:2003 is a standard published by the Slovenian Institute for Standardization (SIST). Its full title is "Transmission and Multiplexing (TM); Generic requirements of transport functionality of equipment; Part 4-2: Synchronous Digital Hierarchy (SDH) path layer functions; Implementation Conformance Statement (ICS) proforma specification". This standard covers: ICS proforma for ETS 300 417-4-1
ICS proforma for ETS 300 417-4-1
SIST EN 300 417-4-2 V1.1.1:2003 is classified under the following ICS (International Classification for Standards) categories: 33.040.20 - Transmission systems. The ICS classification helps identify the subject area and facilitates finding related standards.
SIST EN 300 417-4-2 V1.1.1:2003 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.XQNFLRQDOQRVWTransmission and Multiplexing (TM); Generic requirements of transport functionality of equipment; Part 4-2: Synchronous Digital Hierarchy (SDH) path layer functions; Implementation Conformance Statement (ICS) proforma specification33.040.20Prenosni sistemTransmission systemsICS:Ta slovenski standard je istoveten z:EN 300 417-4-2 Version 1.1.1SIST EN 300 417-4-2 V1.1.1:2003en01-december-2003SIST EN 300 417-4-2 V1.1.1:2003SLOVENSKI
STANDARD
EN 300 417-4-2 V1.1.1 (1999-06)European Standard (Telecommunications series)Transmission and Multiplexing (TM);Generic requirements of transport functionality of equipment;Part 4-2: Synchronous Digital Hierarchy (SDH)path layer functions;Implementation Conformance Statement (ICS)proforma specificationSIST EN 300 417-4-2 V1.1.1:2003
ETSIETSI EN 300 417-4-2 V1.1.1 (1999-06)2ReferenceDEN/TM-01015-4-2 (3v10iico.PDF)KeywordsSDH, testingETSIPostal addressF-06921 Sophia Antipolis Cedex - FRANCEOffice address650 Route des Lucioles - Sophia AntipolisValbonne - FRANCETel.: +33 4 92 94 42 00
Fax: +33 4 93 65 47 16Siret N° 348 623 562 00017 - NAF 742 CAssociation à but non lucratif enregistrée à laSous-Préfecture de Grasse (06) N° 7803/88Internetsecretariat@etsi.frIndividual copies of this ETSI deliverablecan be downloaded fromhttp://www.etsi.orgIf you find errors in the present document, send yourcomment to: editor@etsi.frCopyright NotificationNo part may be reproduced except as authorized by written permission.The copyright and the foregoing restriction extend to reproduction in all media.© European Telecommunications Standards Institute 1999.All rights reserved.SIST EN 300 417-4-2 V1.1.1:2003
ETSIETSI EN 300 417-4-2 V1.1.1 (1999-06)3ContentsIntellectual Property Rights.11Foreword.11Introduction.121Scope.132References.133Definitions and abbreviations.143.1Definitions.143.2Abbreviations.144Conformance to this ICS proforma specification.17Annex A (normative):ICS proforma for EN 300 417-4-1.18A.1Guidance for completing the ICS proforma.18A.1.1Purposes and structure.18A.1.2Abbreviations and conventions.18A.1.3Instructions for completing the ICS proforma.20Annex B (normative):ICS proforma for S4 Path Layer.21B.1Identification of the implementation.21B.1.1Date of the statement.21B.1.2Implementation Under Test (IUT) identification.21B.1.3System Under Test (SUT) identification.22B.1.4Product supplier.22B.1.5Client.23B.1.6ICS contact person.23B.2Identification of the EN.24B.3Global statement of conformance of S4 Path Layer.24B.4S4 Path Layer functions.24B.4.1S4 Path Layer Description.24B.4.2VC-4 Layer Transmission Tables.30B.4.2.1VC-4 Layer Connection Function: S4_C.30B.4.2.1.1Routing process.30B.4.2.1.2Unequipped VC generation.30B.4.2.1.3SNC protection process.31B.4.2.2VC-4 Layer Trail Termination Functions: S4_TT_So, S4_TT_Sk, S4m_TT_Sk, S4s_TT_So andS4s_TT_Sk.34B.4.2.2.1In service error monitoring process.34B.4.2.2.2Remote indicator monitoring process.35B.4.2.2.2.1VC-4 Remote Defect Indication (VC-4 RDI).35B.4.2.2.2.2VC-4 Remote Error Indication (S4 REI).36B.4.2.2.3Trail Trace Identifier.37B.4.2.2.4Supervisory Unequipped indication.39B.4.2.3Activation/deactivation of VC-4 Layer payload Adaptation Functions (S4/P4x_A, S4/P4e_A,S4/TUG_A, S4/DQDB_A, S4/Avp_A and S4/TSS1_A).39B.4.2.4VC-4 Layer to P4x Layer Adaptation Functions: S4/P4x_A_So and S4/P4x_A_Sk.40B.4.2.4.1VC-4 Layer to P4x Layer frequency justification and bitrate adaptation processes.40B.4.2.4.2Justification control.41B.4.2.4.3Smoothing and jitter limiting process.42B.4.2.4.4Payload type processing.42B.4.2.4.5H4 byte processing.43SIST EN 300 417-4-2 V1.1.1:2003
ETSIETSI EN 300 417-4-2 V1.1.1 (1999-06)4B.4.2.5VC-4 Layer to P4e Layer Adaptation Functions: S4/P4e_A_So and S4/P4e_A_Sk.43B.4.2.5.1VC-4 Layer to P4e Layer frequency justification and bitrate adaptation processes.44B.4.2.5.2Justification control.45B.4.2.5.3Smoothing and jitter limiting process.45B.4.2.5.4Frame Alignment process.46B.4.2.5.5Payload type processing.46B.4.2.5.6H4 byte processing.47B.4.2.6VC-4 Layer to VC-3, VC-2, VC-12 and VC-11 Layer Compound Adaptation Functions:S4/SX_A_So and S4/SX_A_Sk.47B.4.2.6.1VC-4 Layer to TUG Adaptation Functions: S4/TUG_A_So and S4/TUG_A_Sk.47B.4.2.6.1.1Payload type processing.48B.4.2.6.1.2Multiframe Indicator processing.48B.4.2.6.1.3Fixed Stuff insertion.49B.4.2.6.2TUG to VC-3/2/12/11 Layer Adaptation Functions: TUG/S3_A_So, TUG/S3_A_Sk,TUG/S2_A_So, TUG/S2_A_Sk, TUG/S12_A_So, TUG/S12_A_Sk, TUG/S11*_A_So andTUG/S11*_A_Sk.49B.4.2.6.2.1TUG to VC-3/2/12/11 Layer frequency justification and bitrate adaptation processes.51B.4.2.6.2.2TUG to VC-3/2/12/11 Layer alignment process.53B.4.2.6.2.3VC-4 Layer to VC-3/2/12/11 Layer multiplexing and demultiplexing processes.63B.4.2.7VC-4 Layer to DQDB Layer Adaptation Functions: S4/DQDB_A_So and S4/DQDB_A_Sk.64B.4.2.7.1DQDB slot payload scrambling/descrambling.65B.4.2.7.2DQDB slot boundary indication/delineation process.66B.4.2.7.3Link Status Signal processing.67B.4.2.7.4Payload type processing.68B.4.2.7.5DQDB Layer management information transport.68B.4.2.8VC-4 Layer to ATM Layer Compound Adaptation Functions: S4/Avp_A_So and S4/Avp_A_Sk.68B.4.2.9VC-4 Layer to LC Layer Adaptation Function: S4/LC_A_So.68B.4.2.10VC-4 Layer to TSS1 Layer Adaptation Functions: S4/TSS1_A_So and S4/TSS1_A_Sk.69B.4.2.10.1Payload type processing.69B.4.2.10.2H4 byte processing.70B.4.2.11VC-4 Layer to P0s Layer Adaptation Functions: S4/P0s_A_So and S4/P0s_A_Sk.70B.4.2.11.1VC-4 Layer to P0s Layer frequency justification and bitrate adaptation processes.70B.4.2.11.2Data latching and smoothing process.71B.4.3VC-4 Layer Linear Trail Protection Transmission Tables.72B.4.3.1VC-4 Layer Linear Trail Protection Connection Function: S4P_C.73B.4.3.2VC-4 Layer Linear Trail Protection Trail Termination Functions: S4P_TT_So and S4P_TT_Sk.74B.4.3.3VC-4 Layer Linear Trail Protection Adaptation Functions:S4/S4P_A_So and S4/S4P_A_Sk.74B.4.3.3.1VC-4 Layer to VC-4 Protection Layer multiplexing and demultiplexing processes.74B.4.4VC-4 Layer Linear Trail Protection and Sub-Network Connection (SNC) Protection processes.75B.4.4.1APS externally initiated commands.75B.4.4.2APS automatically initiated commands.76B.4.4.3APS generalities.77B.4.4.4APS sub-processes.77B.4.4.5APS status report.78B.4.5VC-4 Tandem Connection Sub-layer Transmission Tables.79B.4.5.1VC-4 Tandem Connection Sub-layer Trail Termination Functions: S4D_TT_So, S4D_TT_Sk andS4Dm_TT_Sk.79B.4.5.1.1In service error monitoring process.79B.4.5.1.2Tandem Connection Error Count processes.80B.4.5.1.3Tandem Connection Multiframe Alignment process.81B.4.5.1.4VC-4 Tandem Connection Remote indicator monitoring process.81B.4.5.1.4.1VC-4 Tandem Connection Remote Defect Indication (TC RDI).81B.4.5.1.4.2VC-4 Tandem Connection Remote Error Indication (TC REI).82B.4.5.1.5VC-4 Tandem Connection Outgoing indicator monitoring process.83B.4.5.1.5.1VC-4 Tandem Connection Outgoing Defect Indication (TC ODI).83B.4.5.1.5.2VC-4 Tandem Connection Outgoing Error Indication (TC OEI).84B.4.5.1.6Tandem Connection Trace Identifier.85B.4.5.2VC-4 Tandem Connection to VC-4 Layer Adaptation Functions: S4D/S4_TT_So and S4D/S4_A_Sk.86B.4.6VC-4 Layer Defect, Consequent Action, Defect Correlation and Performance Monitoring Tables.87B.4.6.1Port Status Management.87SIST EN 300 417-4-2 V1.1.1:2003
ETSIETSI EN 300 417-4-2 V1.1.1 (1999-06)5B.4.6.2Defect detection and clearance criteria.87B.4.6.3Consequent action activation and clearance criteria.93B.4.6.4Defect correlation.99B.4.6.5Performance monitoring.101B.4.6.5.1Near End Performance monitoring.101B.4.6.5.2Far End Performance monitoring.102B.4.7VC-4 Layer Linear Trail Protection Defect, Consequent Action, Defect Correlation and PerformanceMonitoring Tables.102B.4.7.1Consequent action activation and clearance criteria.102B.4.7.2Defect correlation.103B.4.8VC-4 Tandem Connection Sub-layer Defect, Consequent Action, Defect Correlation and PerformanceMonitoring Tables.103B.4.8.1Port Status Management.103B.4.8.2Defect detection and clearance criteria.104B.4.8.3Consequent action activation and clearance criteria.106B.4.8.4Defect correlation.110B.4.8.5Performance monitoring.112B.4.8.5.1Near End Performance monitoring.112B.4.8.5.2Far End Performance Monitoring.112B.4.8.5.3Tandem Connection Outgoing VC Performance Monitoring.113Annex C (normative):ICS proforma for S3 Path Layer.114C.1Identification of the implementation.114C.1.1Date of the statement.114C.1.2Implementation Under Test (IUT) identification.114C.1.3System Under Test (SUT) identification.115C.1.4Product supplier.115C.1.5Client.116C.1.6ICS contact person.116C.2Identification of the EN.117C.3Global statement of conformance of S3 Path Layer.117C.4S3 Path Layer functions.117C.4.1S3 Path Layer Description.117C.4.2VC-3 Layer Transmission Tables.121C.4.2.1VC-3 Layer Connection Function: S3_C.121C.4.2.1.1Routing process.121C.4.2.1.2Unequipped VC generation.122C.4.2.1.3SNC protection process.122C.4.2.2VC-3 Layer Trail Termination Functions: S3_TT_So, S3_TT_Sk, S3m_TT_Sk, S3s_TT_So andS3s_TT_Sk.124C.4.2.2.1In service error monitoring process.125C.4.2.2.2Remote indicator monitoring process.126C.4.2.2.2.1VC-3 Remote Defect Indication (VC-3 RDI).126C.4.2.2.2.2VC-3 Remote Error Indication (S3 REI).127C.4.2.2.3Trail Trace Identifier.128C.4.2.2.4Supervisory Unequipped indication.129C.4.2.3Activation/deactivation of VC-3 Layer payload Adaptation Functions (S3/P31x_A, S3/P31e_A,S3/Avp_A and S3/TSS3_A).130C.4.2.4VC-3 Layer to P31x Layer Adaptation Functions: S3/P31x_A_So and S3/P31x_A_Sk.131C.4.2.4.1VC-3 Layer to P31x Layer frequency justification and bitrate adaptation processes.131C.4.2.4.2Justification control.133C.4.2.4.3Smoothing and jitter limiting process.133C.4.2.4.4Payload typeSignal Label processing.134C.4.2.4.5H4 byte processing.134C.4.2.5VC-3 Layer to P31e Layer Adaptation Functions: S3/P31e_A_So and S3/P31e_A_Sk.135C.4.2.5.1VC-3 Layer to P31e Layer frequency justification and bitrate adaptation processes.135C.4.2.5.2Justification control.137C.4.2.5.3Smoothing and jitter limiting process.137SIST EN 300 417-4-2 V1.1.1:2003
ETSIETSI EN 300 417-4-2 V1.1.1 (1999-06)6C.4.2.5.4Frame Alignment process.138C.4.2.5.5Payload typeSignal Label processing.138C.4.2.5.6H4 byte processing.139C.4.2.6VC-3 Layer to ATM Layer Compound Adaptation Functions: S3/Avp_A_So and S3/Avp_A_Sk.139C.4.2.7VC-4 Layer to LC Layer Adaptation Function: S3/LC_A_So.139C.4.2.8VC-3 Layer to TSS3 Layer Adaptation Functions: S3/TSS3_A_So and S3/TSS3_A_Sk.139C.4.2.8.1Payload typeSignal Label processing.140C.4.2.8.2H4 byte processing.140C.4.2.9VC-3 Layer to P0s Layer Adaptation Functions: S3/P0s_A_So and S3/P0s_A_Sk.140C.4.2.9.1VC-3 Layer to P0s Layer frequency justification and bitrate adaptation processes.141C.4.2.9.2Data latching and smoothing process.142C.4.3VC-3 Layer Linear Trail Protection Transmission Tables.142C.4.3.1VC-3 Layer Linear Trail Protection Connection Function: S3P_C.143C.4.3.2VC-3 Layer Linear Trail Protection Trail Termination Functions: S3P_TT_So and S3P_TT_Sk.144C.4.3.3VC-3 Layer Linear Trail Protection Adaptation Functions:S3/S3P_A_So and S3/S3P_A_Sk.144C.4.3.3.1VC-3 Layer to VC-3 Protection Layer multiplexing and demultiplexing processes.144C.4.4VC-3 Layer Linear Trail Protection and Sub-Network Connection (SNC) Protection processes.145C.4.4.1APS externally initiated commands.145C.4.4.2APS automatically initiated commands.146C.4.4.3APS generalities.147C.4.4.4APS switch performance.148C.4.4.5APS sub-processes.148C.4.4.6APS signal interpretation.149C.4.4.7APS status report.149C.4.5VC-3 Tandem Connection Sub-layer Transmission Tables.150C.4.5.1VC-3 Tandem Connection Sub-layer Trail Termination Functions: S3D_TT_So, S3D_TT_Sk andS3Dm_TT_Sk.150C.4.5.1.1In service error monitoring process.150C.4.5.1.2Tandem Connection Error Count process.151C.4.5.1.3Tandem Connection Multiframe Alignment process.152C.4.5.1.4VC-3 Tandem Connection Remote indicator monitoring process.152C.4.5.1.4.1VC-3 Tandem Connection Remote Defect Indication (TC RDI).152C.4.5.1.4.2VC-3 Tandem Connection Remote Error Indication (TC REI).153C.4.5.1.5VC-3 Tandem Connection Outgoing indicator monitoring process.154C.4.5.1.5.1VC-3 Tandem Connection Outgoing Defect Indication (TC ODI).154C.4.5.1.5.2VC-3 Tandem Connection Outgoing Error Indication (TC OEI).155C.4.5.1.6Tandem Connection Trace Identifier.156C.4.5.2VC-3 Tandem Connection to VC-3 Layer Adaptation Functions: S3D/S3_TT_So and S3D/S3_A_Sk.157C.4.6VC-3 Layer Defect, Consequent Action, Defect correlation and Performance Monitoring Tables.158C.4.6.1Port Status Management.158C.4.6.2Defect detection and clearance criteria.158C.4.6.3Consequent action activation and clearance criteria.162C.4.6.4Defect Correlation.166C.4.6.5Performance monitoring.167C.4.6.5.1Near End Performance monitoring.167C.4.6.5.2Far End Performance Monitoring.168C.4.7VC-3 Layer Linear Trail Protection Defect, Defect, Consequent Action, Defect Correlation andPerformance Monitoring Tables.169C.4.7.1Consequent action activation and clearance criteria.169C.4.7.2Defect correlation.169C.4.8VC-3 Tandem Connection Sub-layer Defect, Consequent Action, Defect Correlation and PerformanceMonitoring Tables.170C.4.8.1Port Status Management.170C.4.8.2Defect detection and clearance criteria.170C.4.8.3Consequent action activation and clearance criteria.173C.4.8.4Defect correlation.176C.4.8.5Performance Monitoring.177C.4.8.5.1Near End Performance Monitoring.177C.4.8.5.2Far End Performance Monitoring.178C.4.8.5.3Tandem Connection Outgoing VC Performance Monitoring.178SIST EN 300 417-4-2 V1.1.1:2003
ETSIETSI EN 300 417-4-2 V1.1.1 (1999-06)7Annex D (normative):ICS proforma for S2 Path Layer.180D.1Identification of the implementation.180D.1.1Date of the statement.180D.1.2Implementation Under Test (IUT) identification.180D.1.3System Under Test (SUT) identification.181D.1.4Product supplier.181D.1.5Client.182D.1.6ICS contact person.182D.2Identification of the EN.183D.3Global statement of conformance of S2 Path Layer.183D.4S2 Path Layer functions.183D.4.1S2 Path Layer Description.183D.4.2VC-2 Layer Transmission Tables.187D.4.2.1VC-2 Layer Connection Function: S2_C.187D.4.2.1.1Routing process.187D.4.2.1.2Unequipped VC generation.188D.4.2.1.3SNC protection process.188D.4.2.2VC-2 Layer Trail Termination Functions: S2_TT_So, S2_TT_Sk, S2m_TT_Sk, S2s_TT_So andS2s_TT_Sk.191D.4.2.2.1In service error monitoring process.191D.4.2.2.2Remote indicator monitoring process.192D.4.2.2.2.1VC-2 Remote Defect Indication (VC-2 RDI).192D.4.2.2.2.2VC-2 Remote Error Indication (S2 REI).193D.4.2.2.3Trail Trace Identifier.194D.4.2.2.4Supervisory Unequipped indication.196D.4.2.3Activation/deactivation of VC-2 Layer payload Adaptation Functions (S2/Avp_A and S2/TSS4_A).196D.4.2.4VC-2 Layer to ATM Layer Compound Adaptation Functions: S2/Avp_A_So and S2/Avp_A_Sk.196D.4.2.5VC-2 Layer to LC Layer Adaptation Function: S2/LC_A_So.196D.4.2.6VC-2 Layer to TSS4 Layer Adaptation Functions: S2/TSS4_A_So and S2/TSS4_A_Sk.197D.4.2.6.1Payload typeSignal Label processing.197D.4.3VC-2 Layer Linear Trail Protection Transmission Tables.198D.4.3.1VC-2 Layer Linear Trail Protection Connection Function: S2P_C.199D.4.3.2VC-2 Layer Linear Trail Protection Trail Termination Functions: S2P_TT_So and S2P_TT_Sk.200D.4.3.3VC-2 Layer Linear Trail Protection Adaptation Functions:S2/S2P_A_So and S2/S2P_A_Sk.200D.4.3.3.1VC-2 Layer to VC-2 Protection Layer multiplexing and demultiplexing processes.200D.4.4VC-2 Layer Linear Trail Protection and Sub-Network Connection (SNC) Protection processes.201D.4.4.1APS externally initiated commands.201D.4.4.1.1APS automatically initiated commands.202D.4.4.1.2APS generalities.203D.4.4.1.3APS switch performance.203D.4.4.1.4APS sub-processes.203D.4.4.1.5APS status report.205D.4.5VC-2 Tandem Connection Sub-layer Transmission Tables.205D.4.5.1VC-2 Tandem Connection Sub-layer Trail Termination Functions: S2D_TT_So, S2D_TT_Sk andS2Dm_TT_Sk.205D.4.5.1.1VC-2 in service error monitoring process.206D.4.5.1.2Tandem Connection in service error monitoring process.206D.4.5.1.3Tandem Connection Multiframe Alignment process.207D.4.5.1.4VC-2 Tandem Connection Remote indicator monitoring process.208D.4.5.1.4.1VC-2 Tandem Connection Remote Defect Indication (TC RDI).208D.4.5.1.4.2VC-2 Tandem Connection Remote Error Indication (TC REI).209D.4.5.1.5VC-2 Tandem Connection Outgoing indicator monitoring process.209D.4.5.1.5.1VC-2 Tandem Connection Outgoing Defect Indication (TC ODI).209D.4.5.1.5.2VC-2 Tandem Connection Outgoing Error Indication (TC OEI).210D.4.5.1.6Tandem Connection Trace Identifier.211D.4.5.1.7Incoming AIS code process.213D.4.5.2VC-2 Tandem Connection to VC-2 Layer Adaptation Functions: S2D/S2_TT_So and S2D/S2_A_Sk.213D.4.6VC-2 Layer Defect, Consequent Action, Defect Correlation and Performance Monitoring Tables.213SIST EN 300 417-4-2 V1.1.1:2003
ETSIETSI EN 300 417-4-2 V1.1.1 (1999-06)8D.4.6.1Port Status Management.213D.4.6.2Defect detection and clearance criteria.214D.4.6.3Consequent action activation and clearance criteria.216D.4.6.4Defect correlation.219D.4.6.5Performance monitoring.220D.4.6.5.1Near End Performance monitoring.220D.4.6.5.2Far End Performance monitoring.221D.4.7VC-2 Layer Linear Trail Protection Defect, Consequent Action, Defect Correlation and PerformanceMonitoring Tables.221D.4.7.1Consequent action activation and clearance criteria.221D.4.7.2Defect correlation.222D.4.8VC-2 Tandem Connection Sub-layer Defect, Consequent Action, Defect correlation and PerformanceMonitoring Tables.222D.4.8.1Port Status Management.222D.4.8.2Defect detection and clearance criteria.223D.4.8.3Consequent action activation and clearance criteria.225D.4.8.4Defect correlation.229D.4.8.5Performance monitoring.230D.4.8.5.1Near End Performance monitoring.230D.4.8.5.2Far End Performance Monitoring.231D.4.8.5.3Tandem Connection Outgoing VC Performance Monitoring.231Annex E (normative):ICS proforma for S12 Path Layer.233E.1Identification of the implementation.233E.1.1Date of the statement.233E.1.2Implementation Under Test (IUT) identification.233E.1.3System Under Test (SUT) identification.234E.1.4Product supplier.
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