IEC 61967-6:2002/AMD1:2008

IEC 61967-6
Edition 1.0 2008-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
AMENDMENT 1
AMENDEMENT 1
Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
1 GHz –
Part 6: Measurement of conducted emissions – Magnetic probe method

Circuits intégrés – Mesure des émissions électromagnétiques, 150 kHz à 1 GHz –
Partie 6: Mesure des émissions conduites – Méthode de la sonde magnétique

IEC 61967-6 A1:2008
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IEC 61967-6
Edition 1.0 2008-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
AMENDMENT 1
AMENDEMENT 1
Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
1 GHz –
Part 6: Measurement of conducted emissions – Magnetic probe method

Circuits intégrés – Mesure des émissions électromagnétiques, 150 kHz à 1 GHz –
Partie 6: Mesure des émissions conduites – Méthode de la sonde magnétique

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
R
CODE PRIX
ICS 31.200 ISBN 2-8318-9641-X

– 2 – 61967-6 Amend. 1 © IEC:2008
FOREWORD
This amendment has been prepared by subcommittee 47A: Integrated circuits, of IEC
technical committee 47: Semiconductor devices.
The text of this amendment is based on the following documents:
FDIS Report on voting
47A/781/FDIS 47A/784/RVD
Full information on the voting for the approval of this amendment can be found in the report
on voting indicated in the above table.
The committee has decided that the contents of this amendment and the base publication will
remain unchanged until the maintenance result date indicated on the IEC web site under
"http://webstore.iec.ch" in the data related to the specific publication. At this date, the
publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
_____________
Page 49
Add the following new Annex E:

61967-6 Amend. 1 © IEC:2008 – 3 –
Annex E
(informative)
Advanced magnetic probe
E.1 General
The miniature magnetic probe (advanced magnetic probe) has a high spatial resolution, and it
enables accurate measurement of near magnetic fields of IC packages and dense PCBs. It
should be made of a low temperature co-fired ceramics (LTCC) board and its detecting part
(detecting loop) should be about 2 mm wide and 1 mm thick. The miniaturization may cause a
decrease of probe sensitivity of magnetic field, due to the reduction of loop size. The details
of probe design are shown in Figures E.1, E.2, E.3 and E.4. However, the lower sensitivity to
magnetic field is compensated by the decrease of necessary gain, resulting from the
possibility of placement of the new probe loop edge closer to the microstrip line than it was
before.
E.2 Advanced magnetic probe fixture
The previous model of magnetic field probe is a shielded loop probe, made by using
multilayer FR4-PCB. The loop part of the previous magnetic field probe cannot be made small
enough to measure current at short trace on PCB. The new model is made by precise glass
ceramic multi-layer board, enabling both compactness and high spatial resolution.
Figures E.1 and E.2 show an external view of the probe. The size of the magnetic detecting
loop is reduced to 2 mm width x 1 mm thickness. The advanced magnetic probe should be a
tri-plate strip line composed of a three-layer LTCC board. Recommended probe construction
details are shown in Figures E.3, E.4, E.5, E.6, E.7 and E.8. In all figures, braces ( ) indicate
that the enclosed values are examples. Other dimensions shall be within tolerances described
below. If the loop part does not fall within tolerance limits, measurement error will increase.
A semi-rigid cable can be attached at the junction area which is shown as Figures E.1 and E.2.
Junction for the connection should have characteristic impedance of 50 Ω up to 3 GHz. The
connection construction which is shown in the figures is one example of connection between
LTCC board and semi-rigid coaxial cable. Other constructions which provide good high-
frequency connectivity are acceptable.
In Figures E.4, E.5, E.6 and E.7, the relative dielectric constant of the board material is 7,1,
and the printed pattern on an LTCC board is formed with Ag-Pd paste. In these figures,

finished dimensions of printed pattern of loop portion may have a tolerance rating of ±2,5
percent. Dimensions with braces also may have a tolerance rating of ±10 percent. The
conductors are 15 μm thick with a tolerance of ±5 μm. The insulators (dielectric) are 120 μm
thick with a tolerance rating of ±10 percent. The ground pads on the first layer and the fifth
layer are coated with about 30 μm (thickness) of gold (Au) plating. Therefore the thickness of
the ground pad may be increased, so as to solder the pads to conductor case. Unless
otherwise specified, dimensions of printed pattern may have a tolerance rating of ±10 percent.

– 4 – 61967-6 Amend. 1 © IEC:2008
Shielded loop structure is used for detecting part for magnetic field. This part shall be
fabricated precisely using precise LTCC process. Figure E.3 shows the superimposed main
pattern of the magnetic field detector made by using a 5-layer glass ceramic board. The
second and forth layers are ground layers corresponding to the outer sheath of a coaxial
cable; the third layer is the signal layer, equivalent to the core conductor. The loop and lead
portion of the multilayer board of the new probe is symmetrical about the third layer except via
and signal pattern. The strip line was designed to have a characteristic impedance of 50 Ω, in
consideration of impedance matching with the measurement system. The end of the signal
line is passed through a via-hole and connected to ground.
The previous probe has apertures in the sides of the tri-plate strip line (lead portion), but both
sides of the ground pattern on the second layer are connected to the fourth layer by via-hole
as shown in Figure E.3. The via-hole shall be formed with a pitch of 0,25 mm or less. The loop
serving as the magnetic field detector is a rectangle 0,2 mm x 1 mm, and the spatial
resolution can be raised to 250 μm (typical) at the 6 dB degrading point. If the target of
measurement is a straight trace such as a microstrip line, the current calibration coefficient
can be used to convert measured magnetic field over a trace into current. About the pattern
on each layer of the LTCC board, the amount of deviation from perfect alignment shall be
within 10 μm. The performance of the probe will decrease when the alignment error increases,
because the characteristic impedance of the strip line of the probe deviates from 50 Ω. Taking
screening test by x-rays, nonconforming items where the alignment error exceeds 10 μm shall
be rejected. Furthermore, the front end face of the LTCC board shall be precisely cut and
polished flat.
The ground pads on the first layer and the fifth layer are shown in Figures E.4 and E.7. The
pad of the first layer is connected to the second layer by via-holes and the pad of the fifth
layer is connected to the fourth layer by enough number of vias, respectively. The ground pad
on the fifth layer is extended, when compared to that on the first layer. As shown in Figures
E.5 to E.6, the trace width is tapered down to a narrow trace. As shown in Figures E.4 and
E.7, the ground patterns are also tapered, because the second and fourth layer patterns are
tapered. Figure E.8 shows the configuration for connection of the LTCC board and the semi-
rigid coaxial cable. The joint construction consists of conductor case, step part of LTCC board
and semi-rigid coaxial cable. As shown in Figure E.8, the central conductor of the semi-rigid
coaxial cable is connected to the signal pad on the third layer of the LTCC board by solder.
LTCC board has a step, so the signal pattern on the third layer is exposed. The central
conductor of the semi-rigid cable can be mounted on signal pattern in parallel with signal
pattern. The outer conductor of the semi-rigid coaxial cable is contacted with the rear edge of
the LTCC board. Further, the conductor case (Cu) is connected to the ground pads on the
first and the fifth layers by solder so as to cover and surround a joint part of the central
conductor. The conductor case shall be connected to the outer conductor by solder. Here, the
ground pad, the outer conductor and the conductor case may preferably be solder-connected
to one another without any clearance. The shield performance of the joint section is enhanced
by the conductor case, so that electromagnetic interference of a sensor output signal with an
outcoming noise or another wiring signal can be suppressed. The characteristic impedance of
joint section including conductor case shall be designed by adjusting the dimensions of the
signal pads and the conductor case, a reflection loss due to impedance mismatching is
suppressed so that a high-frequency signal transmission characteristic can be made
satisfactory.
61967-6 Amend. 1 © IEC:2008 – 5 –

SMA connector
Semi-rigid coaxial cable
LTCC board
(magnetic loop)
A
Conductor case
(metal)
IEC  234/08
Figure E.1 – Illustration of the assembled advanced magnetic probe

(Solder metal case to outer sheath
Metal case
of the semi-rigid coaxial cable)
(Solder metal case to the ground
pad on first and fifth layer)
Semi-rigid
coaxial cable
LTCC board Ground pad
Solder joint
IEC  235/08
Figure E.2 – Enlarged view of part A of Figure E.1
(an example of connection construction)

– 6 – 61967-6 Amend. 1 © IEC:2008

Dimensions in millimetres
Outline of glass
ceramic board
Signal pattern on layer 3
Joint portion for
semi-rigid coaxial
cable, straight
connection is
Ground plane patterns
recommended
on layers 2 and 4
Blind via through
layers 2 and 4
(pitch is 0,25 or less)
Lead portion
50 Ω strip line
Loop portion
for magnetic
field detection
(2,0) (1,0)
Via through layers 2, 3, and 4
IEC  236/08
Figure E.3 – Main pattern (layer 2 to 4) of advanced magnetic probe

Dimensions in millimetres
Joint portion for
semi-rigid c
...