ETSI TS 103 713 V15.1.0 (2020-02)

ETSI TS 103 713 V15.1.0 (2020-02)






TECHNICAL SPECIFICATION
Smart Secure Platform (SSP);
SPI interface
(Release 15)

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Release 15 2 ETSI TS 103 713 V15.1.0 (2020-02)



Reference
RTS/SCP-T103713vf10
Keywords
M2M, MFF
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ETSI

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Release 15 3 ETSI TS 103 713 V15.1.0 (2020-02)
Contents
Intellectual Property Rights . 5
Foreword . 5
Modal verbs terminology . 5
1 Scope . 6
2 References . 6
2.1 Normative references . 6
2.2 Informative references . 6
3 Definition of terms, symbols and abbreviations . 7
3.1 Terms . 7
3.2 Symbols . 7
3.3 Abbreviations . 7
4 Introduction . 8
5 SCL Under-Layers Protocol Stack . 8
6 Electrical interfaces . 9
6.1 Introduction . 9
6.2 Physical interface with 5 signals . 9
6.3 Physical interface with 4 signals . 10
6.4 Electrical characteristics . 11
6.4.1 DC characteristics . 11
6.4.2 Data transfer mode, AC characteristics . 11
7 Data Link Layer . 13
7.1 Overview . 13
7.2 MAC Layer . 13
7.2.1 Overview . 13
7.2.2 Timing . 13
7.2.2.1 Timing definitions . 13
7.2.2.2 T1 = Slave Ready Time. 13
7.2.2.3 T2 = Slave Request Time . 13
7.2.3 5 signals MAC layer . 14
7.2.3.1 Initiation of the data transfer from the master . 14
7.2.3.2 Initiation of the data transfer from the slave . 14
7.2.3.3 Simultaneous initiation of a data transfer from both master and slave . 15
7.2.3.4 MAC activation . 15
7.2.3.5 MAC deactivation . 16
7.2.4 4 signals MAC layer . 16
7.2.4.1 Introduction . 16
7.2.4.2 Initiation of the data transfer from the master . 16
7.2.4.3 Initiation of the data transfer from the slave . 16
7.2.4.4 Simultaneous initiation of the data transfer from both master and slave. 17
7.2.4.5 Slave-driven Flow Control . 18
7.2.4.6 MAC activation . 18
7.2.4.7 MAC deactivation . 18
7.3 Link Layer Frame . 19
7.3.1 Overview . 19
7.3.2 Frames generation and transfer rules . 20
7.3.3 Data transfer cases . 21
7.4 LLC layers . 22
7.5 Interworking of the LLC layers . 23
7.6 MCT LLC definition . 24
7.6.1 MCT LPDU structure . 24
7.6.2 MCT_DATA from master . 24
7.6.3 MCT_DATA from slave . 25
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Release 15 4 ETSI TS 103 713 V15.1.0 (2020-02)
7.6.4 MCT activation procedure . 26
7.7 SHDLC LLC definition . 26
7.7.1 SHDLC overview . 26
7.7.2 Endpoints . 26
7.7.3 Flow control . 27
7.7.3.1 Overview . 27
7.7.3.2 Flow control based on SHDLC . 27
7.8 Power management . 27
7.8.1 Power saving mode . 27
7.8.2 Conditions for entering power saving mode . 27
7.8.2.1 Slave entering power saving mode . 27
7.8.2.2 Master entering power saving mode . 28
7.8.3 Resuming from power saving mode . 28
7.8.3.1 Resuming the slave from power saving mode . 28
7.8.3.2 Resuming the master from power saving mode . 28
Annex A (informative): Change history . 30
History . 31

ETSI

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Release 15 5 ETSI TS 103 713 V15.1.0 (2020-02)
Intellectual Property Rights
Essential patents
IPRs essential or potentially essential to normative deliverables may have been declared to ETSI. The information
pertaining to these essential IPRs, if any, is publicly available for ETSI members and non-members, and can be found
in ETSI SR 000 314: "Intellectual Property Rights (IPRs); Essential, or potentially Essential, IPRs notified to ETSI in
respect of ETSI standards", which is available from the ETSI Secretariat. Latest updates are available on the ETSI Web
server (https://ipr.etsi.org/).
Pursuant to the ETSI IPR Policy, no investigation, including IPR searches, has been carried out by ETSI. No guarantee
can be given as to the existence of other IPRs not referenced in ETSI SR 000 314 (or the updates on the ETSI Web
server) which are, or may be, or may become, essential to the present document.
Trademarks
The present document may include trademarks and/or tradenames which are asserted and/or registered by their owners.
ETSI claims no ownership of these except for any which are indicated as being the property of ETSI, and conveys no
right to use or reproduce any trademark and/or tradename. Mention of those trademarks in the present document does
not constitute an endorsement by ETSI of products, services or organizations associated with those trademarks.
Foreword
This Technical Specification (TS) has been produced by ETSI Technical Committee Smart Card Platform (SCP).
The contents of the present document are subject to continuing work within TC SCP and may change following formal
TC SCP approval. If TC SCP modifies the contents of the present document, it will then be republished by ETSI with
an identifying change of release date and an increase in version number as follows:
Version x.y.z
where:
x the first digit:
0 early working draft;
1 presented to TC SCP for information;
2 presented to TC SCP for approval;
3 or greater indicates TC SCP approved document under change control.
y the second digit is incremented for all changes of substance, i.e. technical enhancements, corrections,
updates, etc.
z the third digit is incremented when editorial only changes have been incorporated in the document.
Modal verbs terminology
In the present document "shall", "shall not", "should", "should not", "may", "need not", "will", "will not", "can" and
"cannot" are to be interpreted as described in clause 3.2 of the ETSI Drafting Rules (Verbal forms for the expression of
provisions).
"must" and "must not" are NOT allowed in ETSI deliverables except when used in direct citation.
ETSI

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Release 15 6 ETSI TS 103 713 V15.1.0 (2020-02)
1 Scope
The present document describes the SPI interface for the communication of an SSP, as defined in ETSI
TS 103 666-1 [1] using the SCL protocol.
2 References
2.1 Normative references
References are either specific (identified by date of publication and/or edition number or version number) or
non-specific. For specific references, only the cited version applies. For non-specific references, the latest version of the
referenced document (including any amendments) applies.
• In the case of a reference to a TC SCP document, a non-specific reference implicitly refers to the latest version
of that document in the same Release as the present document.
Referenced documents which are not found to be publicly available in the expected location might be found at
https://docbox.etsi.org/Reference/.
NOTE: While any hyperlinks included in this clause were valid at the time of publication, ETSI cannot guarantee
their long term validity.
The following referenced documents are necessary for the application of the present document.
[1] ETSI TS 103 666-1: "Smart Secure Platform (SSP); Part 1: General characteristics".
[2] ETSI TS 102 613: "Smart Cards; UICC - Contactless Front-end (CLF) Interface; Physical and data
link layer characteristics".
[3] ISO/IEC 13239: "Information Technology -- Telecommunications and information exchange
between systems -- High-level Data Link Control (HDLC) procedures".
2.2 Informative references
References are either specific (identified by date of publication and/or edition number or version number) or
non-specific. For specific references, only the cited version applies. For non-specific references, the latest version of the
referenced document (including any amendments) applies.
• In the case of a reference to a TC SCP document, a non-specific reference implicitly refers to the latest version
of that document in the same Release as the present document.
NOTE: While any hyperlinks included in this clause were valid at the time of publication, ETSI cannot guarantee
their long term validity.
The following referenced documents are not necessary for the application of the present document but they assist the
user with regard to a particular subject area.
[i.1] ETSI TR 102 216: "Smart cards; Vocabulary for Smart Card Platform specifications".
ETSI

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Release 15 7 ETSI TS 103 713 V15.1.0 (2020-02)
3 Definition of terms, symbols and abbreviations
3.1 Terms
For the purposes of the present document, the terms given in ETSI TR 102 216 [i.1] and the following apply:
data transfer: information exchange during an SPI access between the master and the slave with SPI_MISO driven by
the slave and SPI_MOSI driven by the master while the master is toggling the SPI_CLK signal
flow control: mechanism of the Data Link Layer that consists of methods applied by the transmitter in order to send at
any time a number of logical data units that can be accepted by the receiver
frame: link layer data structure consisting of a prologue or frame header, payload and epilogue or trailer usually
containing the CRC bytes
MAC access request: request from the slave to the master for a data transfer, i.e. a MAC phase initiated by the slave
MAC phase: initiation of a data transfer by the master and/or request for a data transfer by the slave
SPI access: SPI_NSS assertion by the master, if not already asserted in the MAC phase, followed by SPI_CLK start for
transferring a certain number of bytes according to the SPI master configuration
NOTE: The number of bytes transferred during an SPI access is always the same in both directions on SPI_MISO
and SPI_MOSI and is also referred to as access length.
window size: maximum number of logical data units that can be sent from the transmitter to the receiver without any
link layer acknowledgements for any of these data units
window size slot: fixed space used by the slave in the receive buffer for the logical data units.
NOTE: The length of a window size slot equals the Data Link Layer MTU.
3.2 Symbols
Void.
3.3 Abbreviations
For the purposes of the present document, the following abbreviations apply:
AC Alternating Current
ACT Activation
CLF ContactLess Frontend
CMD Command
CPHA Clock Phase
CPOL Clock Polarity
CRC Cyclic Redundancy Check
DC Direct Current
DLL Data Link Layer
FIFO First In, First Out
IO Input/Output
IOH High Output Current (Output current corresponding to VOH)
IOL Low Output Current (Output current corresponding to VOL)
LLC Logical Link Control
LPDU Link Protocol Data Unit
MAC Medium Access Control
MCT MAC aCTivation
MISO Master Input Slave Output
MOSI Master Output Slave Input
MTU Maximum Transmission Unit
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Release 15 8 ETSI TS 103 713 V15.1.0 (2020-02)
NSD Non-Significant Data
OD Open Drain
RFU Reserved for Future Use
SCL SSP Common Layer
SHDLC Simplified High Level Data Link Control
SPI Serial Peripheral Interface
SSP Smart Secure Platform
SWP Single Wire Protocol
NOTE: Defined in ETSI TS 102 613 [2].
VDD Supply Voltage
VIH High Input Voltage (Input Voltage for High Logic Level)
VIL Low Input Voltage (Input Voltage for Low Logic Level)
VOH High Output Voltage (Output Voltage for High Logic Level)
VOL Low Output Voltage (Output Voltage for Low Logic Level)
4 Introduction
The Serial Peripheral Interface (SPI) is a serial synchronous full-duplex communication interface between a single
master and one or more slaves present on the same SPI bus, each slave being selected at one time by a dedicated
SPI_NSS signal. This clause defines the physical, MAC and data link layers for the SPI interface.
In this clause the terms master and slave refer respectively to the terms master SPI and slave SPI.
5 SCL Under-Layers Protocol Stack
Figure 5.1 illustrates the protocol stack below the SCL supporting the SPI interface.

Figure 5.1: Protocol stack for SPI Interface
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Release 15 9 ETSI TS 103 713 V15.1.0 (2020-02)
6 Electrical interfaces
6.1 Introduction
In the clauses below, different implementations of SPI interface are defined. These implementations allow bi-directional
communication and the possibility for the slave to initiate communication with the master when it has data available
thus avoiding the necessity for continuous polling to be performed by master.
Slave may initiate communication to send a command without a prior command from master.
6.2 Physical interface with 5 signals
Figure 6.1 illustrates the SPI electrical interface using 5 signals.

Figure 6.1: SPI electrical interface with 5 signals
This SPI interface describes two sets of signals:
• The generic and legacy SPI interface using the 4 signals: SPI_MOSI (Master Output Slave Input), SPI_MISO
(Master Input Slave Output), SPI_CLK (clock) and the SPI_NSS signal used for the selection of a Slave
Endpoint among N slaves sharing the same bus. SPI_MISO, SPI_MOSI and SPI_CLK can be shared between
several SPI slaves present on the same SPI bus.
• The SPI_INT signal allows the slave to initiate a MAC access request in order to notify the master to start a
data transfer.
SPI_INT signal is considered active or asserted at high voltage level.
SPI_NSS is considered active or asserted at low voltage level.
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6.3 Physical interface with 4 signals
Figure 6.2 illustrates the SPI interface using 4 signals, bi-directional SPI_NSS.
MAST ER SLAVE
SP I_MISO
SP I_MOS I
SP I_C LK
VDD
R
SS_MI SS_SI
SP I_NS S
SS _MO SS_SO
VSS
VSS

Figure 6.2: SPI electrical interface with 4 signals, bi-directional SPI_NSS
The SPI interface with 4 signals describes two sets of signals:
• The three generic and legacy SPI signals as SPI_MOSI (Master Output Slave Input), SPI_MISO (Master Input
Slave Output) and SPI_CLK (clock). These signals can be shared between several SPI slaves as a bus.
• The SPI_NSS (Negative Slave Select) signal used for the selection of a slave endpoint among N slaves sharing
the same bus and for the slave to initiate a MAC access request to notify the master to initiate a data transfer.
SPI_NSS is considered active or asserted at low voltage level. SPI_NSS requires a bidirectional IO implementing an
Open Drain (OD) interface for both master and slave. This configuration allows driving the SPI_NSS signal to low
voltage level by both master and slave without electrical contention.
A pull-up resistor allows to keep SPI_NSS at high state level (i.e. idle state) when SS_MO and SS_SO are not asserted.
The SPI_NSS signal is at low state when either SS_MO or SS_SO are asserted.
NOTE: Despite the current industry de-facto SPI specification which defines SPI_NSS signal as unidirectional,
driven by the master, in the present document the SPI_NSS in the 4 signals configuration is bidirectional.
Table 6.1: Definition of the signals
Signal Description
SS_MO Internal master output signal for SPI_NSS assertion. SS_MO is at high state level for generating a
SPI_NSS signal assertion (i.e. low level state)
SS_SO Internal slave output signal for SPI_NSS assertion. SS_SO is at high state level for generating a SPI_NSS
signal assertion (i.e. low level state)
SS_MI Internal master input signal indicating SPI_NSS status. SS_MI is at high state level when the SPI_NSS
signal is not asserted
SS_SI Internal slave input signal indicating SPI_NSS status. SS_SI is at high state level when the SPI_NSS signal
is not asserted
SPI_NSS SPI_NSS signal: low state level when asserted

ETSI

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Release 15 11 ETSI TS 103 713 V15.1.0 (2020-02)
6.4 Electrical characteristics
6.4.1 DC characteristics
The SPI Electrical specification interface shall be defined for VDD operational voltage classes B and C as defined in
ETSI TS 103 666-1 [1], clause 6.2.2.3.
Table 6.2: DC characteristics for operational voltage class B
Parameter Symbol Min Max Unit Note/Test condition
Input high voltage VIH 0,7 × VDD VDD + 0,5 V
Input low voltage VIL -0,5 0,3 × VDD V
Output high voltage VOH 0,9 × VDD V IOH = -100 uA
Output low voltage VOL 0,1 × VDD V IOL = 1,0 mA
SPI_NSS Low Level Output current IOL -1 - mA VOL = 0,3 V
(see note)
Maximal SPI_NSS line capacitance Cl - 20 pF
(see note)
NOTE: Applicable for the physical interface with 4 signals.

Table 6.3: DC characteristics for operational voltage class C
Parameter Symbol Min Max Unit Note/Test condition
Input high voltage VIH 0,7 × VDD VDD + 0,3 V
Input low voltage VIL -0,3 0,3 × VDD V
Output high voltage VOH 0,9 × VDD V IOH = -100 uA
Output low voltage VOL 0,1 × VDD V IOL = 1,0 mA
SPI_NSS Low Level Output current IOL -1 - mA VOL = 0,3 V
(see note)
Maximal SPI_NSS line capacitance Cl - 20 pF
(see note)
NOTE: Applicable for the physical interface with 4 signals.

The value of the resistor R in figure 6.2 shall be selected for a resultant maximum current lower than or equal to the
minimum between the absolute IOL values of the master and the slave.
6.4.2 Data transfer mode, AC characteristics
The SPI interface shall implement the SPI mode 0 according to the industry de-facto SPI specification.
SPI mode 0 is determined by CPOL = 0 and CPHA = 0 where:
• CPOL: defines the SPI_CLK idle state.
• CPOL = 0 implies that the SPI_CLK is at input low voltage while it is idle.
• CPHA: defines the data sampling time.
• CPHA = 0 implies that data sampling is done on the rising edges of the SPI_CLK for both SPI_MISO and
SPI_MOSI.
SPI_NSS is considered active or asserted at low voltage level.
Data availability timings with reference to SPI_CLK are shown in figure 6.3.
ETSI

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Release 15 12 ETSI TS 103 713 V15.1.0 (2020-02)

Figure 6.3: SPI timing diagram
Table 6.4: AC characteristics for 1,8 V and 3,3 V (SPI Slave, Mode 0: CPOL = 0 and CPHA = 0)
Symbol Definition Value
(MIN values unless MAX specified)
Max SPI_CLK is specified by Slave
fCLK SPI_CLK frequency
at initialization in MCT_READY
tCLKL SPI_CLK low time 0,45 × tCLK
tCLKH SPI_CLK high time 0,45 × tCLK
tSU Data setup time to clock rising edge 5 ns
tH SPI_MOSI hold time/Data hold time to clock rising edge 3 ns
tHO SPI_MISO hold time/Output hold time to clock falling edge 0 ns
tCSS SPI_CS# setup time (1,8 V) 63 ns
tCSS SPI_CS# setup time (3,3 V) 33 ns
tCSH Hold time clock falling edge to SPI_CS# inactive 0,5 × tCLK
tCS SPI_CS# inactive time (1,8 V) 60 ns
tCS SPI_CS# inactive time (3,3 V) 30 ns
tCSV SPI_MISO valid delay time from SPI_CS# active (1,8 V) 58 ns (MAX)
tCSV SPI_MISO valid delay time from SPI_CS# active (3,3 V) 28 ns (MAX)
0 ns (MIN)
tV SPI_MISO valid delay time from clock falling edge
0,7 × tCLKL (MAX)
0 ns (MIN)
tCSDO SPI_MISO Output disable time from SPI_CS# inactive (1,8 V)
60 ns (MAX)
0 ns (MIN)
tCSDO SPI_MISO Output disable time from SPI_CS# inactive (3,3 V)
30 ns (MAX)

The values indicated in table 6.4 are reference values for generic SPI slaves. If the concrete slave device supports better
timing parameters, a system design may choose to configure the master for these timing values in order to achieve
better performance.
ETSI

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Release 15 13 ETSI TS 103 713 V15.1.0 (2020-02)
7 Data Link Layer
7.1 Overview
Clause 9.1 in ETSI TS 102 613 [2] shall apply.
7.2 MAC
...