ASTM F487-13
(Specification)Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding
Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding
ABSTRACT
This specification covers aluminum-1 % silicon alloy wire for semiconductor devices lead-bonding and is limited to wire of diameter up to and including 0.0020 in. (0.051 mm). The wire surface shall be clean and free of finger oils, lubricant residues, stains, and particulate matter. The elongation and breaking load shall be tested to meet the requirements prescribed. The methods in determining the wire dimensions are presented in details. Verify that the chemical requirements are satisfied by means of spectrographic analysis.
SCOPE
1.1 This specification covers aluminum–1 % silicon alloy wire for internal connections in semiconductor devices and is limited to wire of diameter up to and including 76 μm (0.003 in.). For diameters larger than 76 μm (0.003 in.), the specifications are to be agreed upon between the purchaser and the supplier.
1.2 The values stated in SI units are to be regarded as the standard, regardless of whether they appear first or second in a table. Values given in parentheses are for information only.
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Designation:F487 −13
Standard Specification for
Fine Aluminum–1% Silicon Wire for Semiconductor Lead-
1
Bonding
ThisstandardisissuedunderthefixeddesignationF487;thenumberimmediatelyfollowingthedesignationindicatestheyearoforiginal
adoption or, in the case of revision, the year of last revision.Anumber in parentheses indicates the year of last reapproval.Asuperscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope 4. Physical Requirements
1.1 This specification covers aluminum–1 % silicon alloy 4.1 Elongation and breaking-load ranges for the wire shall
wire for internal connections in semiconductor devices and is be specified by the purchaser. The maximum ranges of these
limited to wire of diameter up to and including 76 µm (0.003 mechanical properties are listed in Table 1.
in.). For diameters larger than 76 µm (0.003 in.), the specifi-
4.2 Mechanical property requirements in ranges smaller
cations are to be agreed upon between the purchaser and the
than those listed in Table 1 may be specified upon agreement
supplier.
between the purchaser and the supplier.
1.2 The values stated in SI units are to be regarded as the
NOTE 1—The nature of aluminum–1 % silicon alloy is such that the
standard, regardless of whether they appear first or second in a
mechanical properties of both as-drawn and annealed wires overlap
table. Values given in parentheses are for information only.
considerably. It is also possible to alter the properties of hard wire by
varying the manufacturing parameters and procedures. For these reasons,
no distinction is made between the two types of wire in this specification.
2. Referenced Documents
2
2.1 ASTM Standards:
5. Dimensions, Weights, and Permissible Variations
F16 Test Methods for Measuring Diameter or Thickness of
5.1 Wiresizeshallbeexpressedintermsofwirediameterin
Wire and Ribbon for Electronic Devices and Lamps
decimal fractions of millimetres (inches). Tolerances for vari-
F219 Test Methods of Testing Fine Round and Flat Wire for
ous size ranges are specified in Table 2.
Electron Devices and Lamps
3
2.2 Military Standard: 5.2 When wire size is expressed in terms of weight, the
following values shall be used:
MIL-STD-105 Sampling Procedures and Tables for Inspec-
3
5.2.1 Density of Aluminum–1 % Silicon—2.7 g/cm .
tion by Attributes
5.2.2 Weight of a 200-mm Length of Wire 25.4 µm in
3. Ordering Information Diameter—0.274 mg.
3.1 Orders for material under this specification shall include
6. Surface Finish
the following information:
3.1.1 Quantity,
6.1 The wire surface shall be clean and free of finger oils,
3.1.2 Size (see Section 5),
lubricant residues, stains, and particulate matter.
3.1.3 Breaking load and elongation (see Section 4),
6.2 Mechanical damage to the wire surface, such as nicks,
3.1.4 Packaging and marking (see Section 11), and
scratches, and kinks, shall be held to a minimum.
3.1.5 Special requirements, such as for certificate of com-
6.3 Theinspectionshallbecarriedoutbyelectronic,optical,
pliance (see Section 10).
or other inspection method is agreed upon between the
purchaser and the supplier. The nature and extent of defects
1
permitted to be present on the surface of the wire shall be
This specification is under the jurisdiction of ASTM Committee F01 on
Electronics and is the direct responsibility of Subcommittee F01.03 on Metallic
agreed upon between the purchaser and the supplier.
Materials, Wire Bonding, and Flip Chip.
Current edition approved Jan. 1, 2013. Published January 2013. Originally
7. Chemical Requirements
approved in 1977. Last previous edition approved in 2006 as F487 – 88 (2006).
DOI: 10.1520/F0487-13.
7.1 The alloy composition shall be 1.00 6 0.15 % silicon,
2
For referenced ASTM standards, visit the ASTM website, www.astm.org, or
and between 98.84 and 99.15 % aluminum.All other elements
contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
Standards volume information, refer to the standard’s Document Summary page on are considered impurities.
the ASTM website.
3
7.2 No single impurity shall exceed 0.0050 % and the total
AvailablefromStandardizationDocumentsOrderDesk,Bldg.4SectionD,700
Robbins Ave., Philadelphia, PA 19111-5094, Attn: NPODS. of all detectable impurities shall not exceed 0.01 %.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
1
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F487−13
TABLE 1 Typical Elongation and Breaking Load of
9.3 Chemical Analysis—Verify that the chemical require-
Aluminum–1% Silicon Alloy Wire
ments are satisfied by means of spectrographic analysis or
other means agreed upon between the purchaser and the
NOTE 1—Select the desired nominal breaking load and elongation for
the wire by specifying a range of mechanical properties t
...
This document is not an ASTM standard and is intended only to provide the user of an ASTM standard an indication of what changes have been made to the previous version. Because
it may not be technically possible to adequately depict all changes accurately, ASTM recommends that users consult prior editions as appropriate. In all cases only the current version
of the standard as published by ASTM is to be considered the official document.
Designation: F487 − 88 (Reapproved 2006) F487 − 13
Standard Specification for
Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-
1
Bonding
This standard is issued under the fixed designation F487; the number immediately following the designation indicates the year of original
adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A superscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope
1.1 This specification covers aluminum–1 % silicon alloy wire for internal connections in semiconductor devices and is limited
to wire of diameter up to and including 0.0020 in. (0.051 mm).76 μm (0.003 in.). For diameters larger than 0.0020 in. (0.051
mm),76 μm (0.003 in.), the specifications are to be agreed upon between the purchaser and the supplier.
1.2 The values stated in inch-poundSI units are to be regarded as the standard. The values standard, regardless of whether they
appear first or second in a table. Values given in parentheses are for information only.
2. Referenced Documents
2
2.1 ASTM Standards:
F16 Test Methods for Measuring Diameter or Thickness of Wire and Ribbon for Electronic Devices and Lamps
F72 Specification for Gold Wire for Semiconductor Lead Bonding
F205 Test Method for Measuring Diameter of Fine Wire by Weighing
F219 Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps
F584 Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
3
2.2 Military Standard:
MIL-STD-105 Sampling Procedures and Tables for Inspection by Attributes
3. Ordering Information
3.1 Orders for material under this specification shall include the following information:
3.1.1 Quantity,
3.1.2 Size (see Section 5),
3.1.3 Breaking load and elongation (see Section 4),
3.1.4 Packaging and marking (see Section 11), and
3.1.5 Special requirements, such as for certificate of compliance (see Section 10).
4. Physical Requirements
4.1 Elongation and breaking-load ranges for the wire shall be specified by the purchaser. The maximum ranges of these
mechanical properties are listed in Table 1.
4.2 Mechanical property requirements in ranges smaller than those listed in Table 1 may be specified upon agreement between
the purchaser and the supplier.
NOTE 1—The nature of aluminum–1 % silicon alloy is such that the mechanical properties of both as-drawn and annealed wires overlap considerably.
It is also possible to alter the properties of hard wire by varying the manufacturing parameters and procedures. For these reasons, no distinction is made
between the two types of wire in this specification.
1
This specification is under the jurisdiction of ASTM Committee F01 on Electronics and is the direct responsibility of Subcommittee F01.07 on Wire Bonding, Flip Chip,
and Tape Automated Bonding.
Current edition approved Jan. 1, 2006Jan. 1, 2013. Published January 2006 January 2013. Originally approved in 1977. Last previous edition approved in 20012006 as
F487 – 88 (2001).(2006). DOI: 10.1520/F0487-88R06.10.1520/F0487-13.
2
For referenced ASTM standards, visit the ASTM website, www.astm.org, or contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM Standards
volume information, refer to the standard’s Document Summary page on the ASTM website.
3
Available from Standardization Documents Order Desk, Bldg. 4 Section D, 700 Robbins Ave., Philadelphia, PA 19111-5094, Attn: NPODS.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
1
---------------------- Page: 1 ----------------------
F487 − 13
TABLE 1 Typical Elongation and Breaking Load of
Aluminum–1 % Silicon Alloy Wire
NOTE 1—Select the desired nominal breaking load and elongation for
the wire by specifying a range of mechanical properties that includes the
A
desired values.
Breaking Load, g Elongation, %
Nominal Diameter,
Max Max
in. (mm)
Min Max Min Max
B C
Range Range
0.0005 (0.013) 1 5 2 0.5 2.0 1.5
0.0007 (0.018) 3 12 2 0.5 3.0 2.0
0.0010 (0.025) 12 22 3 0.5 4.0 2.5
0.0012 (0.030) 14 30 3 0.5 4.0 2.5
0.00125 (0.032) 15 32 3 0.5 4.0 3.0
0.0015 (0.038) 20 50 4 0.5 4.0 3.0
0.0020 (0.051) 32 90 6 1.0 4.0 3.0
A
Example: Wire of 0.0010-in. (0.025-mm)25-μm (0.001-in.) diameter with a
breaking load of 16 g and an elongation of 2.0 % is desired. Specify a breaking-
load range of 14 to 18 g (16 ± 2 g) and an elongation range of 1.0 to 3.5 %
(2.0 + 1.5 %, 2.0 − 1.0 %). (Note—Smaller ranges are acceptable; for this
example, ranges of 15 to 17 g and
...
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