Monthly Roundup: Telecommunications, Audio and Video Engineering Standards from May 2025

Looking back at May 2025, professionals in the Telecommunications, Audio and Video Engineering sector encountered a month marked by technical advancement, robust standardization activity, and noteworthy revisions across vital technologies. Five significant standards were released, each addressing the increasingly complex demands of RF intermodulation measurement, high-frequency material characterization, multimedia signal integrity, and fibre optic transceiver performance. For engineers, compliance officers, and procurement specialists seeking to ensure reliable, future-ready infrastructures, this comprehensive overview offers a detailed, retrospective analysis of May 2025’s most impactful standards—and practical guidance for moving forward in a rapidly evolving environment.

Monthly Overview: May 2025

May 2025 proved to be a pivotal period for standardization in the Telecommunications, Audio and Video Engineering sector. The month’s publications reflected continued industry emphasis on enhancing reliability at both the component and system levels, underlined by:

• A tightening of test and measurement protocols for passive RF and microwave devices, including coaxial connectors and exposed objects.
• Innovative approaches to material characterization, expanding frequency ranges to accommodate the latest microwave and millimeter-wave platforms.
• Advances in dependable multimedia data transmission, with standards adapted for the challenging demands of distributed real-time systems.
• Revision and clarification of optical transceiver performance requirements, ensuring Gigabit Ethernet applications meet the demands of expanding data networks.

Compared to previous publication cycles, May 2025 stood out for its focus on technical revisions—reflecting lessons from field implementations, shifts in industry practice, and alignment with evolving international benchmarks. The result is a more robust, interoperable, and safety-focused regulatory landscape, as organizations look to assure quality and reduce risk amid greater technological complexity.

Standards Published This Month

EN IEC 62037-3:2025 – Measurement of Passive Intermodulation in Coaxial Connectors

Passive RF and microwave devices, intermodulation level measurement – Part 3: Measurement of passive intermodulation in coaxial connectors

EN IEC 62037-3:2025 addresses a perennial concern for the RF industry: ensuring coaxial connectors do not become weak points for passive intermodulation (PIM), which can degrade signal integrity. The standard prescribes an impact testing method, simulating mechanical stresses (such as vibrations or mishandling) that could exacerbate internal PIM sources—particularly loose connections or foreign particles. With this third edition, the scope expands to include multi-channel connector impact requirements, a new method for energy calculation in non-round connector profiles, and refined reporting requirements (including maximum PIM values measured).

Key requirements include:

• Test procedures to evaluate connector robustness against PIM under mechanical impact.
• Applicability to both cable-terminated and panel-mounted connectors (by using adequate transmission lines).
• Clarification that PIM reports must state the highest measured value—a significant aid to quality assurance and device selection.

Who it affects:

• RF component manufacturers, telecommunications infrastructure providers, test and calibration labs.
• Essential for those procuring or qualifying connectors for high-reliability cellular, broadcast, or military communication systems.

Notable changes:

• Addition of impact test for multi-channel connectors.
• Guidance for non-circular connector forms.
• Clearer definition of reporting and test documentation.

Key highlights:

• Robustness requirements for a wider range of connector types
• Methodology for evaluating PIM under real-world mechanical stresses
• Enhanced clarity and consistency in reporting

Access the full standard:View EN IEC 62037-3:2025 on iTeh Standards

EN IEC 62037-8:2025 – Measurement of Passive Intermodulation Generated by Objects Exposed to RF Radiation

Passive RF and microwave devices, intermodulation level measurement – Part 8: Measurement of passive intermodulation generated by objects exposed to RF radiation

EN IEC 62037-8:2025 acknowledges a critical but often overlooked source of signal problems: passive intermodulation generated not only by RF components, but by any object or material present in the vicinity of wireless infrastructure. The revised standard sets forth methodologies for measuring radiated PIM—either on-site or in controlled chambers—under both near-field and far-field conditions. The update brings improved safety protocols, corrects mathematical errors, and clarifies reporting requirements.

Scope and requirements:

• Applies to all materials or objects potentially exposed to incident RF fields—not just those intended as RF signal carriers.
• Procedures for both single and multi-antenna test configurations.
• Explicit safety reminders (verification of transmitter status before setup changes), reflecting operational best practices.

Target users:

• Installers and maintainers of base stations, wireless facilities, and distributed antenna systems.
• Asset managers overseeing the electromagnetic environment in critical communications facilities.

Update highlights:

• Safety protocols emphasized for RF exposure.
• Correction of test formulae for more precise results.
• Expanded documentation: reports must now specify maximum PIM and VSWR (Voltage Standing Wave Ratio) values.

Key highlights:

• Universal applicability to any materials in RF zones
• Safer, more accurate measurement protocols
• Comprehensive reporting for compliance verification

Access the full standard:View EN IEC 62037-8:2025 on iTeh Standards

EN IEC 63185:2025 – Measurement of Complex Permittivity for Low-Loss Dielectric Substrates

Measurement of the complex permittivity for low-loss dielectric substrates balanced-type circular disk resonator method

Microwave and millimeter-wave designers increasingly rely on accurate material characterizations to develop high-performance, miniaturized, and loss-efficient circuits. EN IEC 63185:2025 delivers a technically rigorous method for measuring the complex permittivity of low-loss dielectrics, essential for specifying substrates in advanced RF devices. The standard utilizes a balanced-type circular disk resonator, now improved to operate up to 170 GHz (expanded from 110 GHz), and introduces precise calculation methods including the effects of fringing fields.

Core aspects:

• Enables broadband, non-destructive dielectric measurements using a single resonator setup.
• Valid for frequency ranges between 10 GHz and 170 GHz, and suitable for substrates with relative permittivity from 1 to 10.
• Incorporates mode-matching analysis, accommodating complex geometries and field distributions.

Intended stakeholders:

• Materials suppliers, RF circuit designers, research laboratories.
• Organizations specifying materials for base stations, satellite terminals, or next-gen wireless devices.

Major changes:

• Extended measurement capability to 170 GHz.
• Inclusion of waveguide interface measurements.
• Enhanced calculation accuracy (taking fringing effects into account).

Key highlights:

• Broadband, accurate material evaluation for new frequency bands
• Improved repeatability and non-destructive analysis
• Technically aligned with cutting-edge research needs

Access the full standard:View EN IEC 63185:2025 on iTeh Standards

IEC 63455:2025 – Multimedia Signal Transmission: Dependable Line Code with Error Correction

Multimedia systems and equipment – Multimedia signal transmission – Dependable line code with error correction

Applications including IoT devices, robotics, and real-time sensor networks demand low-latency, error-resilient communication, often in adversarial or noisy environments. IEC 63455:2025 answers this call by specifying a 4b/10b line code protocol designed for embedded clocking, DC balance, error detection and error correction within the line code itself. This approach distinguishes itself by negating the need for additional error correction layers, making real-time communications more reliable and efficient even in environments poorly served by conventional codes like 8b/10b.

Core features:

• Protocol specification aligns with OSI reference model layers 1–2.
• Underpins distributed systems, including wearable device networks, amusement systems, and spacecraft.
• Embeds error correction directly into the coding scheme, minimizing latency and facilitating deployment in challenging environments.

Relevant for:

• System architects and developers of distributed real-time and embedded systems.
• Engineers specifying interconnection protocols for mission-critical automation, sensor, or consumer electronics applications.

Innovation:

• Holistic approach to on-line error correction—eliminating reliance on upper-layer protocols for error mitigation.
• Agnostic to physical transmission medium, suitable for copper, fibre, or wireless links.

Key highlights:

• On-line, real-time error correction for distributed systems
• Enhanced protocol robustness for noisy or mission-critical environments
• Facilitates next-generation automated and multimedia applications

Access the full standard:View IEC 63455:2025 on iTeh Standards

IEC 62149-4:2022 – Performance Standards for 1 300 nm Fibre Optic Transceivers for Gigabit Ethernet

Fibre optic active components and devices – Performance standards – Part 4: 1 300 nm fibre optic transceivers for Gigabit Ethernet application

As enterprises and service providers upgrade and expand their data networks, ensuring interoperability and consistent performance from optical transceiver modules grows ever more important. IEC 62149-4:2022 defines comprehensive performance, environmental, and safety requirements for 1 300 nm fibre optic transceivers targeting Gigabit Ethernet applications, based on rigorous functional and conformance test suites. The latest edition updates normative references, increases permissible optical output power for multimode fibre, and clarifies that out-of-specification devices cannot be certified by performance tests alone.

Key sections:

• Product parameters and absolute ratings (safety and operational boundaries).
• Complete performance, environmental, and electromagnetic conformance tests.
• Sample size and grouping requirements, quality assurance principles, and marking.

Applicable industries:

• Data center owners, fibre optic network operators, optical component manufacturers.

Major updates:

• Modified soldering temperature limits and other absolute ratings.
• Revised optical output power minimums for greater flexibility.
• Expanded guidance ensuring only fully complying products pass performance testing—a move expected to further raise the bar for network reliability.

Key highlights:

• Robust testing regimes for end-to-end optical module integrity
• Clearer pass/fail criteria and conformance requirements
• Updated alignment with modern Gigabit Ethernet deployments

Access the full standard:View IEC 62149-4:2022 on iTeh Standards

Common Themes and Industry Trends

A retrospective analysis of May 2025’s standards in Telecommunications, Audio and Video Engineering reveals several converging trends:

• Heightened attention to signal integrity and passive intermodulation – Both EN IEC 62037-3 and EN IEC 62037-8 reinforce industry-wide priorities to root out all sources of PIM, from components to environmental factors, reflecting the unrelenting demand for network reliability in 5G, satellite communications, and next-gen wireless.
• Alignment with higher-frequency, broadband applications – The extension of EN IEC 63185’s test method to 170 GHz signals a maturing market for millimeter-wave and advanced microwave applications, including phased-array antennas and high-density device integration.
• Stronger end-to-end compliance mandates – The new edition of IEC 62149-4 clarifies that only in-spec products passing all tests are eligible for compliance, raising expectations for supply chain quality and ongoing module verification.
• Embedded error correction and low latency – IEC 63455’s integrated error correction in the line code protocol stands out as a major step forward for real-time, distributed environments—especially as automation and IoT progress continues.
• Safety and reporting clarity – Across all standards, clearer documentation requirements and explicit safety protocols reflect increasing legal and business risk facing technology deployers and operators.

Together, these trends underscore a landscape where reliability, interoperability, and future-readiness are central to both innovation and compliance.

Compliance and Implementation Considerations

For organizations affected by these standards, the following actions are recommended:

1. Review Engineering and Procurement Specifications

   • Ensure connector and component suppliers can demonstrate conformance to the latest EN IEC 62037-3 and EN IEC 62037-8 requirements, including mechanical robustness and radiated PIM performance.

2. Upgrade Test and Measurement Infrastructure

   • For laboratories and quality assurance teams, tools capable of broadband, high-frequency dielectric testing (as per EN IEC 63185) and the latest RF PIM protocols are now essential.

3. Plan for Protocol and System Upgrades

   • Evaluate the feasibility of integrating IEC 63455’s line code into new designs for robust, real-time multimedia and automation applications—particularly where low latency and high reliability are paramount.

4. Validate Optical Module Stocking and Verification

   • Only stock and deploy optical transceivers validated to IEC 62149-4:2022, and adjust QA acceptance criteria to align with updated power and temperature ratings.

5. Audit Documentation and Training

   • Update standard operating procedures (SOPs) to reflect new safety, reporting, and documentation protocols—especially in installation and commissioning workflows.

Timeline considerations:

• Many national adoptions allow grace periods for compliance (often up to two years); however, competitive and contractual considerations may demand faster alignment.

Resources for getting started:

• Access the full texts via iTeh Standards for the latest documents and guidance.
• Arrange staff training sessions focused on the new test and reporting protocols.
• Use published conformance templates or testing programs where available from accredited laboratories.

Conclusion: Key Takeaways from May 2025

May 2025 saw the publication of five pivotal standards in Telecommunications, Audio and Video Engineering. These standards collectively:

• Set new technical benchmarks for RF, microwave, and optical component performance.
• Advance the state of measurement science and error correction in real-world applications.
• Provide clearer, safer, and more actionable guidance for compliance documentation and reporting.

For industry professionals, mastery of these standards is vital for:

• Ensuring next-generation network reliability.
• Reducing risk throughout the supply chain.
• Equipping engineering teams and facilities for emerging performance requirements and technologies.

We recommend that all quality managers, compliance officers, engineers, and procurement teams:

• Prioritize a review of internal specifications and test procedures against the revised standards listed in this overview.
• Engage with accredited service providers for gap analysis and conformance testing.
• Leverage the detailed requirements and technical advances provided to future-proof investments and operations.

To explore each standard in depth and access supporting resources, visit iTeh Standards. Staying informed and agile with respect to evolving standards is the surest path to regulatory success—and long-term technological competitiveness.