November 2025 Electronics Standards: New Updates for Semiconductor Testing & Circular Connectors

Staying compliant with international standards is crucial in today's fast-evolving electronics industry. November 2025 has brought a series of important updates, introducing five new and revised IEC standards that address semiconductor device bond strength testing and circular connector specifications. These standards set the requirements for mechanical reliability, process quality, and interoperability in modern electronic devices—a must-read for engineers, quality managers, compliance officers, and manufacturing specialists. In this article, you'll find expert analysis and practical insights on these five standards released this month, ensuring your organization stays ahead of regulatory and technological demands.

Overview / Introduction

The global demand for increased reliability and performance in electronic components continues to drive innovation—and regulation—in electronics manufacturing. International standards play an essential role by defining test methods, quality requirements, and technical benchmarks, ensuring that products perform consistently and safely, no matter where they are produced or used. For professionals in the electronics sector, staying updated with the latest standards is a strategic advantage: it enables process optimization, risk reduction, and smooth market access.

This article covers:

• Requirements and key features of the latest semiconductor device bond testing methods
• A significant update to circular connector specifications
• Implementation and compliance considerations
• Technical best practices and next steps for industry leaders

Detailed Standards Coverage

IEC 60749-22-1:2025 - Wire Bond Pull Test Methods

Semiconductor devices – Mechanical and climatic test methods – Part 22-1: Bond strength – Wire bond pull test methods

Published: 2025-11-26

This newly published standard defines critical procedures for assessing the mechanical strength of wire bonds in semiconductor devices, whether unencapsulated or decapsulated. It addresses the testing of thermosonic (ball and stitch) and ultrasonic (wedge) wire bonds across a broad range of wire diameters—from 15 µm to 600 µm—in gold, copper, silver, and aluminium alloys. By establishing two principal destructive test methods (hook and clamp), the standard supports process development, quality control, and assurance activities.

Scope and Key Requirements

• Wire bond pull testing uses either a hook or clamp to destructively test the strength of a wire bond, identifying failure modes and the integrity of interconnects.
• Covers specific procedures for both thermosonic (ball and stitch) bonds and ultrasonic (wedge) bonds.
• Allows testing on both unencapsulated and decapsulated devices, reflecting real-world manufacturing and failure analysis needs.
• Replaces and splits the previous IEC 60749-22 (2002) standard, updating it for new materials (especially copper wires) and more complex bonding techniques.

Who Needs to Comply

This standard is essential for:

• Semiconductor device manufacturers and assembly houses
• Process development and R&D teams
• Quality assurance and reliability engineers
• Laboratories conducting destructive testing

Practical Implementation

• Incorporate hook and clamp pull test procedures in process control and outgoing inspection
• Use standardized failure codes and reporting structures for efficient root cause analysis
• Address device-specific challenges, such as decapsulation, by adhering to best practices outlined in annexes

Notable Changes

• Complete rewrite and division into subparts (with IEC 60749-22-2)
• Updated materials, particularly for copper and silver alloys

Key highlights:

• Destructive testing using hook/clamp on wires 15–600 µm diameter
• New guidance on copper wire bonds and decapsulation techniques
• Replaces and expands the scope of the previous single standard

Access the full standard:View IEC 60749-22-1:2025 on iTeh Standards

IEC 60749-22-1:2025 - Wire Bond Pull Test Methods (Duplicate Listing)

Note: This article covers each distinct standard. As this is a duplicate entry, please refer to the previous section for a comprehensive review. The link for access remains the same.

Access the full standard:View IEC 60749-22-1:2025 on iTeh Standards

IEC 60749-22-2:2025 - Wire Bond Shear Test Methods

Semiconductor devices – Mechanical and climatic test methods – Part 22-2: Bond strength – Wire bond shear test methods

Published: 2025-11-26

Complementing Part 22-1, this standard sets out the methodology for shear testing ball bonds on semiconductor dies and packages, enabling assessment of metallurgical bond integrity and bond quality. It addresses both pre- and post-encapsulation scenarios, focusing especially on thermosonic (ball) bonds with small-diameter wires.

Scope and Key Requirements

• Shear testing evaluates the resistance of a wire bond to lateral (shear) force, typically using a precision chisel tool.
• Applicable to gold, copper, and aluminium ball bonds ranging from 15 µm to 76 µm diameter.
• Defines minimum bond heights (≥4.0 µm) and spatial constraints for reliable results.
• Provides a classification system for failure types and extensive guidance on equipment setup and calibration.
• Includes processes for specialized bond types (e.g., stitch-on-ball, reverse bonding) and addresses limitations for wedge bond testing.

Who Needs to Comply

• Semiconductor device manufacturers
• Reliability and quality control laboratories
• Chip designers and process engineers
• Assembly/test houses performing destructive reliability testing

Practical Implementation

• Adopt shear test procedures for monitoring bond integrity throughout product lifecycle
• Maintain and calibrate chisel tools according to specification
• Record and categorize test results using standard codes for quality trend analysis

Notable Changes

• Major rewrite to reflect new materials and techniques
• Now complemented by a dedicated pull test standard (IEC 60749-22-1)

Key highlights:

• Comprehensive shear test methods for ball bonds in semiconductors
• Standards-based approach to failure mode analysis
• Updated guidance for new wire materials and reverse/stitch bonds

Access the full standard:View IEC 60749-22-2:2025 on iTeh Standards

IEC 60749-22-2:2025 - Wire Bond Shear Test Methods (Duplicate Listing)

This duplicate listing is covered above. For a full review, see the previous IEC 60749-22-2:2025 subsection.

Access the full standard:View IEC 60749-22-2:2025 on iTeh Standards

IEC 61076-2:2025 - Sectional Specification for Circular Connectors

Connectors for electrical and electronic equipment – Product requirements – Part 2: Sectional specification for circular connectors

Published: 2025-11-26

With its third edition, IEC 61076-2 delivers an updated, harmonized set of product requirements for circular connectors widely used in industrial automation, machinery, communications, and instrumentation. It establishes a unified technical reference for manufacturers, OEMs, and system integrators seeking reliability and interoperability across equipment platforms.

Scope and Key Requirements

• Defines a sectional (applicable to a family of products) specification for circular connectors used in electrical and electronic equipment.
• Complements detail part specifications with a generic framework (to be used with IEC 61076-1), ensuring compatibility, performance, and safety.
• Outlines requirements and minimum test schedules for dimensions, marking, environmental performance (e.g., climatic categories, IP codes), clearance/creepage distances, electrical ratings, and mechanical strength.
• Updated test schedules (including transmission characteristics, current-carrying capacity, and new groupings for accelerated testing).
• Clarifies the use of performance and compatibility levels for procurement and qualification purposes.

Who Needs to Comply

• Manufacturers of connectors and cable assemblies
• Electrical/electronic equipment OEMs
• Purchasing and specification engineers
• Test labs certifying connectors to IEC standards

Practical Implementation

• Standardizes connector selection for design-in and procurement
• Ensures product compatibility and safety across global supply chains
• Supports compliance testing and quality assessment procedures

Notable Changes (Third Edition)

• Enhanced technical information in core clauses
• Updated and reorganized testing and qualification tables
• Addition of requirements for transmission and current-carrying capacity

Key highlights:

• Broad application for circular connectors in industrial and commercial use
• Improved clarity and expanded performance/test schedules
• Supports compliance with system-level equipment standards

Access the full standard:View IEC 61076-2:2025 on iTeh Standards

Industry Impact & Compliance

Driving Reliability, Safety, and Product Quality

These newly updated and published standards underpin critical assurance functions in the electronics sector:

• Risk Mitigation: By enforcing rigorous mechanical and climatic testing, organizations minimize the potential for in-field device failures or connector incompatibilities.
• Quality Management: Standardized test methods enable repeatable, auditable assessments across global supply chains.
• Market Access: Compliance is often a prerequisite for entry into regulated markets or to meet customer-specific requirements.

Compliance Considerations and Timelines

• Transition: Organizations should review their current quality control and process documentation to align with the requirements of the November 2025 standards.
• Training: Personnel should be trained on new testing methods, equipment calibration, and failure mode documentation.
• Documentation: Maintain traceability with standardized reporting formats and adapt supplier requirements accordingly.

Benefits of Adoption

• Reduced risk of costly product recalls or warranty claims
• Improved device reliability and stakeholder confidence
• Enhanced process transparency and capability, supporting continuous improvement

Risks of Non-Compliance

• Limited market access and possible customer requalification needs
• Potential for safety or regulatory non-conformance
• Increased failure rates and associated liability

Technical Insights

Common Technical Requirements

• Destructive Testing: Pull and shear tests are inherently destructive but essential for accurate assessment of bond integrity, especially in microelectronics packages.
• Material Updates: The new standards explicitly address testing challenges for copper and silver wires, more frequently used in contemporary devices.
• Standardized Failure Codes: Both pull and shear testing standards introduce harmonized failure and result codes, facilitating easier cross-company and cross-industry analysis.

Implementation Best Practices

1. Calibrate test equipment regularly to meet the accuracy requirements defined in the standards.
2. Follow prescribed specimen preparation techniques, especially device decapsulation and inspection protocols.
3. Document results using the failure code classifications and keep historical records to identify trends or recurring issues.
4. Align supplier and subcontractor processes to IEC specifications, ensuring a consistent approach to quality.

Testing and Certification Considerations

• Ensure that testing laboratories are accredited and follow the latest IEC methods.
• For connectors, verify compatibility across equipment platforms using the updated test group schedules in IEC 61076-2.
• Where detail specifications take precedence, use them in conjunction with the sectional standard for procurement and qualification.

Conclusion / Next Steps

Staying current with international standards is not just a regulatory necessity—it’s a strategic advantage. The November 2025 updates for semiconductor mechanical testing and circular connector product requirements bring enhanced clarity, technical rigor, and practical guidance for manufacturers, engineers, and quality leaders in the electronics arena.

Key takeaways:

• Implement the latest destructive test methods for wire bonds to strengthen product quality and reliability.
• Reassess your connector procurement and design processes with the new IEC specifications to ensure interoperability and safety.
• Invest in training and update quality systems to reflect the revised standards, minimizing transition risks and leveraging the associated benefits.

To explore each standard in detail and ensure your operations stay ahead of industry changes, visit iTeh Standards and review the full publications. Stay tuned for Part 3 of our series and further in-depth analysis of upcoming standards in electronics manufacturing.

Stay compliant, stay competitive—explore the full range of electronics standards now at iTeh Standards.