November 2025 Brings Key Updates to Electronics Standards: New Methods and Reliability Benchmarks

Electronics professionals face an ever-evolving landscape of standards that directly shape design integrity, product safety, and global market acceptance. November 2025 saw the release of five pivotal international standards setting new baselines for testing, material selection, and reliability in electronics manufacturing. These updates – the first in a three-part series – introduce essential methods and requirements for circuit board inspection, printed board materials, and semiconductor device reliability, directly impacting procurement, engineering, quality assurance, and compliance management throughout the electronics sector.

Overview

The electronics industry relies on internationally harmonized standards to ensure consistent product quality, supply chain interoperability, and safety across global markets. From the intricate detection of circuit board defects to evaluating the endurance of semiconductor devices under severe environmental stress, rigorous standards create a reliable foundation for innovation and risk management. In this article, you’ll discover:

• What’s new in non-destructive testing for circuit boards
• Enhanced requirements for PTFE laminate sheets used in advanced electronic assemblies
• The latest methodologies for testing semiconductor device reliability under moisture and gas exposure
• Practical implications for manufacturers, integrators, and quality teams

This coverage is essential reading for electronics manufacturers, supply chain professionals, R&D engineers, and anyone responsible for product compliance or quality assurance.

Detailed Standards Coverage

EN IEC 61189-3-302:2025 – Detection of Plating Defects in Unpopulated Circuit Boards by Computed Tomography (CT)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

EN IEC 61189-3-302:2025 defines an advanced, non-destructive approach for identifying plating defects in unpopulated circuit boards, specifically targeting metallized holes essential for multilayer PCB reliability. By leveraging computed tomography (CT), this standard enables three-dimensional imaging of internal structures, providing detailed, quantitative defect analysis without damaging the board.

Applicability spans PCB manufacturers, quality assurance labs, and industries requiring high-integrity interconnection, such as aerospace, automotive, telecommunications, and medical electronics. The method lays out:

• Equipment requirements for X-ray CT scanning
• Detailed scanning and image reconstruction techniques
• Procedures for recognizing voids, folds, nodules, and blind via copper-filling defects
• Reporting protocols that ensure comprehensive traceability and analysis
• Statistical approaches to defect quantification (e.g., void rate by board thickness)

For organizations aiming to minimize field failures and rework, integrating CT-based inspection under this standard represents a best-in-class quality strategy.

Key highlights:

• Enables true non-destructive testing for critical board features
• Outlines 3D defect visualization and analysis, including void and fold identification
• Drives more robust root-cause analysis and supplier qualification

Access the full standard:View EN IEC 61189-3-302:2025 on iTeh Standards

EN IEC 61249-2-53:2025 – Reinforced Base Materials: PTFE Laminate Sheets, Defined Flammability (Vertical Burning Test), Copper-Clad

Materials for printed boards and other interconnecting structures – Part 2-53: Reinforced base materials clad and unclad – PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad

EN IEC 61249-2-53:2025 specifies stringent requirements for PTFE (polytetrafluoroethylene) unfilled reinforced laminate sheets, both copper-clad and unclad, across a thickness range from 0.05 mm to 10 mm. Key to this standard is the definition of flame retardancy verified by vertical burning tests, ensuring materials meet critical safety expectations.

This standard is highly relevant to designers and manufacturers of electronic assemblies demanding high performance under thermal and chemical stress – including RF/microwave circuits, high-frequency PCBs, and advanced industrial controls. The standard addresses:

• Physical and electrical property benchmarks
• Flammability testing protocols (referencing clause 8.4)
• Appearance and dimensional stability criteria
• Inspection and quality conformance procedures, including mechanical, thermal, and electrical test methods
• Certificate and traceability documentation for responsible procurement

By specifying PTFE laminate safety and quality, this update addresses increasing industry and regulatory pressure toward advanced, environmentally robust PCB materials.

Key highlights:

• Clearly defined flammability requirements for PTFE laminate
• Comprehensive quality assurance and conformance inspection procedures
• Enhanced dimensional stability and electrical performance benchmarks

Access the full standard:View EN IEC 61249-2-53:2025 on iTeh Standards

IEC 60749-24:2025 – Accelerated Moisture Resistance – Unbiased HAST

Semiconductor devices – Mechanical and climatic test methods – Part 24: Accelerated moisture resistance – Unbiased HAST

IEC 60749-24:2025 delivers a comprehensive methodology for performing Highly Accelerated Stress Testing (HAST) on non-hermetically packaged solid-state devices in humid environments. Unlike other humidity tests, unbiased HAST does not apply electrical bias during exposure, allowing identification of hidden failure mechanisms such as galvanic corrosion that may be masked by power operation.

This destructive test is primarily targeted at semiconductor device manufacturers, reliability engineers, and those qualifying devices for high-performance or mission-critical systems (e.g., automotive, consumer electronics, medical devices). Updates in this edition include:

• Rearrangement of requirements for clarity and efficiency
• New notes clarifying post-test electrical checks
• Detailed apparatus setup, temperature/humidity parameters (e.g., 130 °C/85% RH, 110 °C/85% RH), and proper record-keeping for traceability
• Guidance on handling, mounting, and failure criteria

The standard provides equivalence criteria for comparison with other reliability tests such as unbiased autoclave and references to key supporting documents. With stricter requirements, organizations can detect latent reliability risks earlier, ultimately reducing costly field returns or recalls.

Key highlights:

• Benchmark method for evaluating moisture resistance in modern semiconductor packages
• Focus on non-hermetic devices and underlying (often hidden) failure mechanisms
• Includes important updates for test consistency and electrical evaluation

Access the full standard:View IEC 60749-24:2025 on iTeh Standards

IEC 60749-7:2025 – Internal Moisture Content Measurement and Analysis of Residual Gases (Hermetic Devices)

Semiconductor devices – Mechanical and climatic test methods – Part 7: Internal moisture content measurement and the analysis of other residual gases

IEC 60749-7:2025 specifies destructive test methods for precisely quantifying moisture content and other residual gases inside hermetically sealed semiconductor devices (metal or ceramic packages). This test is integral for ensuring the sealing process' integrity and the long-term chemical stability within critical devices used in sectors like aerospace, defence, military, and scientific instrumentation.

The revision represents a thorough rewrite, aligning the method with MIL-STD-883, Method 1018.10, and providing enhanced guidance on calibration requirements. Notable coverage includes:

• Mass spectrometer requirements for accurate detection thresholds (including moisture, nitrogen, oxygen, helium, argon, fluorocarbon residues)
• Procedures for device puncture, sample introduction, and atmospheric analysis
• Interpretation of oxygen-to-argon ratios, leak test gas residues, and anomalous gas concentrations as quality indicators
• Calibration routines (annual, quarterly, daily) for reproducible and traceable measurement

The standard assists manufacturers in verifying both hermeticity and process cleanliness, serving both compliance and root-cause failure analysis.

Key highlights:

• Aligned to latest military and spaceflight reliability expectations
• Improved calibration and test data reliability for gas and moisture analysis
• Mandatory for high-reliability hermetic device manufacturing and supplier acceptance

Access the full standard:View IEC 60749-7:2025 on iTeh Standards

Industry Impact & Compliance

Adopting these November 2025 electronics standards delivers immediate and long-term benefits for manufacturers, integrators, and end users:

• Quality Assurance: New and revised methods—such as CT defect analysis and unbiased HAST—empower manufacturers to systematically reduce hidden field failures and warranty claims by detecting latent faults earlier in the design process.
• Market Access: Internationally harmonized standards ensure smoother export, tender qualification, and interoperability in complex supply chains.
• Regulatory Compliance: Adherence demonstrates commitment to best-practice safety (e.g., PTFE flammability) and reliability, satisfying regulatory and contractual obligations, especially in highly scrutinized sectors like automotive, defence, and aerospace.
• Risk Mitigation: Failing to comply puts organizations at risk for costly product recalls, customer dissatisfaction, and exclusion from key markets or supply chains.
• Implementation Timelines: Organizations should review new requirements promptly, updating procedures and qualifying suppliers in line with standard publication to remain competitive and compliant.

Technical Insights

Across these key standards, certain themes and technical benchmarks recur:

• Non-Destructive Testing (NDT): Modern CT imaging protocols for printed board evaluation offer precise, repeatable defect identification not possible with legacy cross-sectioning or visual inspections.
• Materials Stewardship: Flammability, dimensional stability, and compositional requirements for PTFE-based laminates underscore heightened focus on safety and lifecycle management.
• Reliability and Environmental Testing: Moisture ingress, internal outgassing, and gas analysis methods now match or surpass military specifications, reflecting greater market and mission expectations for robust electronics under stress.
• Testing and Certification Practices: Regular calibration (annual/quarterly/daily) of measurement apparatus, comprehensive reporting, and third-party laboratory qualification become baseline requirements.

Implementation best practices include:

1. Gap Analysis: Review current inspection, testing, and qualification frameworks against new standard requirements.
2. Pilot Testing: Use CT analysis or HAST pilot runs to identify process weaknesses ahead of full-scale certifications.
3. Supplier Engagement: Communicate new requirements with material and component suppliers, updating contracts and auditing protocols.
4. Training: Update internal protocols and train engineering and quality staff on the operation of new test apparatus and reporting procedures.
5. Documentation: Maintain meticulous records for traceability, calibration, and conformance (especially critical in regulated markets).

Conclusion / Next Steps

November 2025’s electronics standards updates deliver new opportunities for quality-driven organizations to lead in reliability, safety, and international market acceptance. The new test methods and specifications for circuit boards, base materials, and semiconductor reliability represent not just compliance targets but catalysts for innovation and operational excellence.

Key steps for industry professionals:

• Actively review and acquire each published standard to incorporate detailed requirements into your development, procurement, and inspection processes.
• Engage multi-disciplinary teams (engineering, procurement, QA, compliance) to assess the impact and make necessary operational or supplier changes.
• Monitor ongoing updates: This article is part 1 of 3, so subscribe or check back for the next installments covering further standards released in November 2025.

For direct access to the standards and full documentation, visit the iTeh Standards platform:

• EN IEC 61189-3-302:2025 - Plating Defect Detection in PCBs
• EN IEC 61249-2-53:2025 - PTFE Laminate Flammability
• IEC 60749-24:2025 - Unbiased HAST for Semiconductors
• IEC 60749-7:2025 - Moisture/Gas Analysis for Hermetics

Stay informed, stay competitive. For more detailed insights and updates on international electronics standards, visit iTeh Standards.