October 2025 in Review: Electronics Standards Monthly Overview (Part 2)

Looking back at October 2025, the electronics sector continued its dynamic evolution through the publication of several pivotal international standards. This second part of our monthly overview delves into three significant standards released during the period, each influencing design, safety, and innovation across a broad array of electronic products and systems. Whether you’re a quality manager, compliance officer, R&D engineer, or procurement specialist, staying abreast of these developments is essential for operational excellence and strategic foresight.

With this review, we synthesize key themes, requirements, and industry trends discernible from the newly published documents—ensuring that no critical update in the electronics standardization landscape goes unnoticed.

Monthly Overview: October 2025

October 2025 saw a strong focus on foundational advancements in electronics materials, machine safety technologies, and micro-electromechanical (MEMS) devices. The diversity of standards issued reflects an industry balancing operational reliability, compliance demands, and emerging application areas. Notably, attention was given to:

• Enhanced material properties and safety requirements for printed circuit substrates
• Sophisticated electro-sensitive machine safety equipment leveraging opto-electronics
• Test method harmonization for MEMS components crucial to automotive, industrial, and energy sectors

Compared to typical months, October’s breadth hints at increased regulatory harmonization, expanded safety requirements for automated environments, and a maturing ecosystem for MEMS. For organizations navigating rapid technological change, these standards serve as critical touchpoints for risk mitigation, quality improvement, and innovation enablement.

Standards Published This Month

IEC 61249-2-53:2025 - Materials for Printed Boards and Other Interconnecting Structures: PTFE Unfilled Laminate Sheets of Defined Flammability (Copper-Clad)

Materials for printed boards and other interconnecting structures – Part 2-53: Reinforced base materials clad and unclad – PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad

IEC 61249-2-53:2025 defines comprehensive requirements for PTFE (Polytetrafluoroethylene) unfilled reinforced laminate sheets, with and without copper cladding, focusing on a broad thickness range from 0.05 mm up to 10.0 mm. These materials are central to the fabrication of high-performance printed boards and other interconnecting infrastructures in demanding applications, where electrical, mechanical, and flammability performance are paramount. The vertical burning test requirements specify fire resistance as part of the product’s safety performance profile, responding to growing industry demand for flame-retardant substrates in electronics manufacturing and assembly.

The standard encompasses:

• Specification of resin and reinforcement systems (PTFE and woven E-glass)
• Detailed electrical property thresholds: surface and volume resistivity, relative permittivity, dielectric strength, and more
• Mechanical and thermal evaluations, such as peel strength, dimensional stability, and heat shock resistance
• Strict visual and dimensional quality criteria, including surface defects, waviness, and thickness tolerances
• Defined protocols for quality assurance, marking, and packaging

Who Needs to Comply: This standard is critical for manufacturers and suppliers of printed circuit board materials, OEMs requiring flame-retardant and high-reliability base laminates, and contract assemblers serving aerospace, telecom, automotive, and industrial electronics sectors. It also serves QC laboratories, procurement teams, and regulatory bodies monitoring safety-critical electronics.

Notable Features:

• Provides a harmonized approach to fire testing and flame resistance for PTFE-based materials
• Integrates requirements for advanced measurement techniques (permittivity at microwave frequencies, Z-axis expansion, etc.)
• Establishes a robust inspection and certification framework for consistent quality

Key highlights:

• Focuses on enhanced fire safety (vertical burning test) for high-integrity PCB materials
• Expands requirements to a wide range of laminate thicknesses and configurations
• Introduces detailed defect classes for inspection (pitting, scratches, blisters)

Access the full standard:View IEC 61249-2-53:2025 on iTeh Standards

EN IEC 61496-3:2025 - Safety of Machinery: Particular Requirements for Active Opto-Electronic Protective Devices Responsive to Diffuse Reflection (AOPDDR)

Safety of machinery – Electro-sensitive protective equipment – Part 3: Particular requirements for active opto-electronic protective devices responsive to diffuse reflection (AOPDDR)

EN IEC 61496-3:2025 delivers updated and refined requirements for electro-sensitive protective equipment (ESPE) utilizing active opto-electronic protective devices that detect persons or body parts through diffuse reflection (AOPDDR). The standard addresses both 2D and 3D detection zones, with sensing based on near-infrared reflectance—a critical advance for safeguarding humans around hazardous machinery in increasingly automated industrial spaces. This fourth edition incorporates significant technical changes, notably the alignment with the foundational IEC 61496-1:2020 and updated requirements for detection capability and fault response in Type 2 devices.

Scope highlights include:

• Specification of functional, design, and environmental requirements for AOPDDRs
• Updates to testing methodologies, safety performance, and marking requirements
• Enhanced provisions for minimal detectable object sizes (30–200 mm), device verification, and fault handling
• Restrictions and guidance for radiation wavelengths, environmental use, and exclusion of devices not intended for human protection

Who Needs to Comply: Essential for manufacturers and integrators of safety-related automation equipment, particularly in robotics, assembly automation, and industrial machinery. Key stakeholders include health and safety practitioners, automation engineers, and product certification personnel concerned with compliance and risk reduction through non-contact safety solutions.

Notable Features and Changes:

• Consolidation with 61496-1:2020, removing redundant requirements and updating test procedures
• New and changed requirements for detection capability and fault detection, ensuring higher safety integrity
• Guidance for use beyond personnel protection, extending relevance to equipment and product safety

Key highlights:

• Emphasizes non-contact, opto-electronic safeguarding for industrial machinery
• Defines strict performance, testing, and environmental requirements for safety-rated devices
• Incorporates best practices for system verification, documentation, and application-specific adaptation

Access the full standard:View EN IEC 61496-3:2025 on iTeh Standards

IEC 62047-53:2025 - Semiconductor Devices: Test Methods for MEMS Electrothermal Transfer Devices

Semiconductor devices – Micro-electromechanical devices – Part 53: MEMS electrothermal transfer device

IEC 62047-53:2025 establishes standardized test methods for the performance evaluation of MEMS (Micro-Electro-Mechanical Systems) electrothermal transfer devices. These devices, which convert electrical energy to thermal energy, underpin critical functions in automotive airbags, petroleum/mineral detection instrumentation, and pyrotechnic actuators (e.g., igniters and detonators). The standard responds to market need for accurate, comparable testing and specification, particularly as MEMS find increasing deployment in mission-critical safety and sensing roles.

Detailed provisions include:

• Definitions of essential ratings (limiting values) and key characteristics
• Rigorous test methods for electrical resistance, temperature coefficient, electrothermal transfer rate, response time, and thermal properties
• Test protocols for non-destructive current levels, electrostatic and stray current sensitivity
• Extensive reporting requirements to ensure data integrity and comparability

Who Needs to Comply: MEMS device designers, manufacturers, and quality assurance professionals working in automotive, aerospace, oil & gas, and defense sectors. Also relevant to test laboratories, research institutions, and procurement officials evaluating supplier claims and ensuring product reliability.

Notable Features:

• Highly detailed procedures for each critical performance measure
• Applicability to diverse MEMS device architectures (resistance type, thermocouple type, thin-film type)
• Alignment with modern MEMS deployment trends in safety and control systems

Key highlights:

• Standardizes test benchmarks for MEMS devices used in life-critical and industrial sensing applications
• Supports high-integration, instantaneity, and robust ignition functionality
• Facilitates global comparability in MEMS product qualification and quality control

Access the full standard:View IEC 62047-53:2025 on iTeh Standards

Common Themes and Industry Trends

A holistic view of October 2025’s publications reveals several themes shaping the electronics sector:

• Heightened safety and reliability: From board-level flame resistance to machine safeguarding, a clear trend toward risk reduction and robust performance is evident.
• Material innovation and testing rigor: New requirements for both the composition and testing of printed board laminates and MEMS reflect the industry’s focus on end-to-end quality.
• Automation and intelligent sensing: As industries automate, the expanded scope and technical depth of machine safety standards mirror the rapid adoption of sophisticated non-contact and opto-electronic technologies.
• Harmonization and integration: Continuity with earlier standards (e.g., base standards like IEC 61496-1), and convergence of best practices are promoting global trade, compliance, and manufacturing efficiency.
• Cross-sector applicability: Several standards, especially those regarding MEMS, point to converging needs across automotive, energy, industrial, and defense applications.

Compliance and Implementation Considerations

For organizations impacted by this month’s standards, several best practices are recommended:

• Early assessment: Evaluate existing products, processes, and materials against new or revised requirements, especially regarding fire safety (IEC 61249-2-53:2025) and detection capabilities (EN IEC 61496-3:2025).
• Testing and validation upgrades: Align laboratory procedures with the harmonized test methods prescribed in these standards. For MEMS, requalify device batches using the newly specified test parameters.
• Documentation and traceability: Update quality assurance records, certificates of conformance, and product marking—especially where the standard introduces more granular criteria for inspection and compliance.
• Training and awareness: Equip design, manufacturing, and safety teams with knowledge on the latest technical requirements and risk factors.
• Timeline: Ensure transition plans are in place for compliance by the relevant national or sector deadlines (as indicated, for example, in the European foreword of EN IEC 61496-3:2025).
• Engage suppliers: Communicate these new requirements to material vendors and component suppliers to prevent supply chain disruptions.

Resources on iTeh Standards:

• Access the referenced standards directly to review specific clauses, test procedures, and compliance frameworks
• Utilize iTeh Standards’ advanced search and comparison tools to examine related documents and check for subsequent amendments

Conclusion: Key Takeaways from October 2025

October 2025 underscored the electronics sector’s commitment to reliability, safety, and innovation. The three standards highlighted in this overview capture a cross-section of that effort—from the microstructure of printed circuit materials and the test environment for MEMS devices to the evolving landscape of machine safety using opto-electronic sensors. Any professional engaged in product design, quality assurance, regulatory affairs, or strategic procurement will find these documents foundational for both current operations and long-term planning.

Recommendations for Professionals:

• Prioritize a gap analysis to assess current compliance
• Stay engaged with upcoming reviews and revisions, as these standards will shape sector best practices for the foreseeable future
• Use iTeh Standards as your reference for the latest, most authoritative international documentation

Staying informed on these developments is both a competitive necessity and a compliance imperative. For further exploration, deep dives, or to acquire full documents, visit iTeh Standards’ comprehensive Electronics standards library.