SIST-TP ETSI/TR 102 489 V1.4.1:2016

SLOVENSKI STANDARD
SIST-TP ETSI/TR 102 489 V1.4.1:2016
01-februar-2016
Okoljski inženiring (EE) - Evropski telekomunikacijski standard za prakso pri
opremi - Navodila za uravnavanje toplote za opremo in njena uporaba

Environmental Engineering (EE);European telecommunications standard for equipment

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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Intellectual Property Rights ................................................................................................................................ 5

Foreword ............................................................................................................................................................. 5

Modal verbs terminology .................................................................................................................................... 5

Abstract ............................................................................................................................................................... 5

1 Scope ........................................................................................................................................................ 6

2 References ................................................................................................................................................ 6

2.1 Normative references ......................................................................................................................................... 6

2.2 Informative references ........................................................................................................................................ 6

3 Definitions and abbreviations ................................................................................................................... 7

3.1 Definitions .......................................................................................................................................................... 7

3.2 Abbreviations ..................................................................................................................................................... 7

4 ARCM integration overview .................................................................................................................... 8

5 Subrack integration in the same ARCM ................................................................................................... 8

5.1 Configuring equipment in an ARCM ................................................................................................................. 8

5.1.0 Introduction................................................................................................................................................... 8

5.1.1 Subrack location ........................................................................................................................................... 8

5.1.2 Cabling .......................................................................................................................................................... 9

5.2 Mechanical structure of ARCM ......................................................................................................................... 9

5.2.0 Introduction................................................................................................................................................... 9

5.2.1 Opening geometry for the airflow ................................................................................................................. 9

5.2.2 Equipment fastening in the ARCM ............................................................................................................. 10

5.2.3 Doors .......................................................................................................................................................... 10

5.3 ARCM cooling issues ....................................................................................................................................... 10

5.3.0 Introduction................................................................................................................................................. 10

5.3.1 Cooling equipment including fans .............................................................................................................. 10

5.3.2 Air Cooling techniques ............................................................................................................................... 10

5.3.3 Air filtering ................................................................................................................................................. 11

5.4 Impact of the implementation of subracks in an ARCM .................................................................................. 11

5.5 Impact of the temperature on equipment reliability ......................................................................................... 12

6 ARCM integration in the same telecommunications equipment or Data centre room ........................... 12

6.1 Positioning the ARCM in a room ..................................................................................................................... 12

6.1.0 Introduction................................................................................................................................................. 12

6.1.1 Room layout................................................................................................................................................ 13

6.1.2 Cabling ........................................................................................................................................................ 13

6.1.3 Cooling systems .......................................................................................................................................... 14

6.2 Mechanical structure of ARCMs in the rows ................................................................................................... 15

6.2.1 Opening geometry for the airflow ............................................................................................................... 15

6.3 Cooling systems for a room .............................................................................................................................. 15

6.3.1 General design considerations .................................................................................................................... 15

6.3.2 Cooling techniques ..................................................................................................................................... 15

6.3.2.0 Introduction ........................................................................................................................................... 15

6.3.2.1 Passive cooling ...................................................................................................................................... 15

6.3.2.2 Warm air extraction (without cool air) .................................................................................................. 16

6.3.2.3 Fresh air supply with natural release via pressure relief ventilators ...................................................... 17

6.3.2.4 Cool air blowing (with or without relative humidity control) ............................................................... 18

6.3.3 Room air paths ............................................................................................................................................ 20

6.3.3.1 Room air supply .................................................................................................................................... 20

6.3.3.1.0 Introduction ..................................................................................................................................... 20

6.3.3.1.1 Free blow ......................................................................................................................................... 20

6.3.3.1.2 Overhead distribution ...................................................................................................................... 20

6.3.3.1.3 Raised floor distribution .................................................................................................................. 20

6.3.3.2 Return air path ....................................................................................................................................... 21

6.3.3.2.1 Direct return to side walls at side/end of room ................................................................................ 21

6.3.3.2.2 Overhead return ............................................................................................................................... 21

7 Thermal evaluation of the equipment/room architecture ....................................................................... 21

8 Temperature reference point .................................................................................................................. 22

8.0 Introduction ...................................................................................................................................................... 22

8.1 Temperature measurement point for rack ......................................................................................................... 23

8.2 Temperature measurement point for aisle ........................................................................................................ 23

Annex A: Examples of cooling systems in an ARCM in use prior to ETSI EN 300 119-5 .............. 24

A.0 General ................................................................................................................................................... 24

A.1 Single subrack cooling ........................................................................................................................... 24

A.1.0 Introduction ...................................................................................................................................................... 24

A.1.1 Air outlet located at the top of the ARCM ....................................................................................................... 24

A.1.2 Air outlet located at the front of the ARCM ..................................................................................................... 25

A.2 Multiple subrack cooling ........................................................................................................................ 26

A.2.0 Introduction ...................................................................................................................................................... 26

A.2.1 Serial cooling .................................................................................................................................................... 26

A.2.2 Parallel airflow with air inlet located at the front or the bottom of the ARCM ................................................ 27

A.2.3 Parallel airflow with air inlet located at the sides of the rack ........................................................................... 29

A.3 300 mm cabinet ARCM thermal solution .............................................................................................. 30

A.3.0 Introduction ...................................................................................................................................................... 30

A.3.1 Current 300 mm ARCM thermal solutions ...................................................................................................... 30

A.3.2 Alternative 300 mm cabinet solution................................................................................................................ 31

A.3.3 Simulation test result about proposed thermal solution .................................................................................... 32

A.3.3.1 Mock-up configuration ............................................................................................................................... 32

A.3.3.2 Component test result ................................................................................................................................. 33

A.3.4 Air deflector design .......................................................................................................................................... 33

A.3.4.1 Key factors in air deflector design .............................................................................................................. 33

A.3.4.2 Different air deflector mock-up test ............................................................................................................ 33

Annex B: Example of ARCM cooling systems in a room ................................................................... 36

B.1 Room - serial cooling ............................................................................................................................. 36

B.2 Room - parallel cooling .......................................................................................................................... 36

B.3 ETSI 300 mm ARCM in Central Office ................................................................................................ 37

B.3.0 Introduction ...................................................................................................................................................... 37

B.3.1 ETSI 300 mm ARCM solution ......................................................................................................................... 37

B.3.2 ETSI 300 mm ARCM in CO ............................................................................................................................ 38

B.3.3 Alternative ETSI 300 mm ARCM instalment in CO ........................................................................................ 39

B.3.3.0 Introduction................................................................................................................................................. 39

B.3.3.1 Simulation equipment configuration ........................................................................................................... 40

B.3.3.2 Simulation results ....................................................................................................................................... 40

B.3.3.3 Proposed CO arrangement .......................................................................................................................... 41

B.3.3.4 300 mm ARCM in CO simulation .............................................................................................................. 42

Annex C: Bibliography .......................................................................................................................... 44

History .............................................................................................................................................................. 45

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pertaining to these essential IPRs, if any, is publicly available for ETSI members and non-members, and can be found

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This Technical Report (TR) has been produced by ETSI Technical Committee Environmental Engineering (EE).

The present document applies to all telecommunications racks/cabinets, miscellaneous racks/cabinets and subracks

forming part of the public telecommunications network and defined in ETSI EN 300 119-1 [i.3], ETSI

EN 300 119-2 [i.4], ETSI EN 300 119-3 [i.5], ETSI EN 300 119-4 [i.6] and ETSI EN 300 119-5 [i.7]

In the present document "shall", "shall not", "should", "should not", "may", "need not", "will", "will not", "can" and

"cannot" are to be interpreted as described in clause 3.2 of the ETSI Drafting Rules (Verbal forms for the expression of

"must" and "must not" are NOT allowed in ETSI deliverables except when used in direct citation.

It is often necessary to integrate different subracks into the same rack/cabinet and different racks/cabinets into a

common equipment room sharing the common room environment. The integration between equipment and the room is

increasingly more important. The present document is intended to provide assistance in integration of equipment and

room environment to ensure that the equipment has the required environment and that each equipment rack/cabinet is

It should be an aid for all integrators and designers with their different elementary knowledge to integrate.

The present document is an aid for all integrators of Information and Communication Technologies (ICT) equipment to

minimize thermal problems. It establishes recommendations for the thermal management of racks/cabinets,

The present document considers telecommunication Central Office (CO) and Data Centers (DC) locations.

The present document considers only the thermal factors. The integrator should consider the thermal factors in

References are either specific (identified by date of publication and/or edition number or version number) or

non-specific. For specific references, only the cited version applies. For non-specific references, the latest version of the

Referenced documents which are not found to be publicly available in the expected location might be found at

NOTE: While any hyperlinks included in this clause were valid at the time of publication, ETSI cannot guarantee

The following referenced documents are necessary for the application of the present document.

References are either specific (identified by date of publication and/or edition number or version number) or

non-specific. For specific references, only the cited version applies. For non-specific references, the latest version of the

NOTE: While any hyperlinks included in this clause were valid at the time of publication, ETSI cannot guarantee

The following referenced documents are not necessary for the application of the present document but they assist the

[i.1] ETSI EN 300 019-1-3: "Environmental Engineering (EE); Environmental conditions and

environmental tests for telecommunications equipment; Part 1-3: Classification of environmental

[i.2] CENELEC EN 60950-1 (2006): "Information technology equipment - Safety - Part 1: General

[i.3] ETSI EN 300 119-1: "Environmental Engineering (EE); European telecommunication standard for

[i.4] ETSI EN 300 119-2: "Environmental Engineering (EE); European telecommunication standard for

[i.5] ETSI EN 300 119-3: "Environmental Engineering (EE); European telecommunication standard for

equipment practice; Part 3: Engineering requirements for miscellaneous racks and cabinets".

[i.6] ETSI EN 300 119-4: "Environmental Engineering (EE); European telecommunication standard for

equipment practice; Part 4: Engineering requirements for subracks in miscellaneous racks and

[i.7] ETSI EN 300 119-5: "Environmental Engineering (EE); European telecommunication standard for

[i.8] ETSI EN 300 386: "Electromagnetic compatibility and Radio spectrum Matters (ERM);

Telecommunication network equipment; ElectroMagnetic Compatibility (EMC) requirements".

[i.9] IEC TR 62380: "Reliability data handbook - Universal model for reliability prediction of

[i.12] ETSI ES 202 336-12: "Environmental Engineering (EE); Monitoring and control interface for

infrastructure equipment (power, cooling and building environment systems used in

telecommunication networks); Part 12: ICT equipment power, energy and environmental

For the purposes of the present document, the following terms and definitions apply:

cabinet: free-standing and self-supporting enclosure for housing electrical and/or electronic equipment

NOTE: It is usually fitted with doors and/or panels which may or may not be removable.

integrator: end user/operator of telecommunication or IT equipment or their agent

micro-climate: conditions found within the rack/cabinet/miscellaneous rack/cabinet creating a local ambient for the

NOTE: In practice this will typically result in elevated temperatures and reduced relative humidities to those

Miscellaneous Rack/Cabinet (MRC): cabinet that accommodates subracks of several different types of equipment and

rack: free-standing or fixed structure for housing electrical and/or electronic equipment

• Analysing the possible impact of thermal issues on the configuration of racks/cabinets (e.g. location of

The overall cooling effectiveness needed depends in principle on the type of equipment to be cooled and thermal

Special attention should be taken to check the impact of the installation of different equipment in the same ARCM on

It is often very helpful to check, by suitable hand calculation, thermal simulation and measurement, whether the

This activity consists of choosing how to combine the different subracks and the cabling in the ARCM.

• Maximum power dissipated by the equipment for the maximum traffic load or its intended operational state.

For instance, knowledge of the maximum power dissipated will allow the integrator to locate the highest

dissipating subracks at the top of the ARCM in order to minimize the increase of temperature experienced by

• Subracks working maximum temperature: For example, subracks which withstand high temperature can be

installed at upper part of the ARCM (where generally the temperature is the highest).

• Thermal restrictions of each subrack. If possible, place the most restrictive subrack in an area not heated by

other subracks, for example, at the bottom in an ARCM with natural convection cooling system, or in an area

• The position and area of air inlet and air outlet for the different subracks. The porosity of the surface and the

obstacles to the airflow in front of the ventilation surface should also be taken int